CN104767499B - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN104767499B
CN104767499B CN201510172638.8A CN201510172638A CN104767499B CN 104767499 B CN104767499 B CN 104767499B CN 201510172638 A CN201510172638 A CN 201510172638A CN 104767499 B CN104767499 B CN 104767499B
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CN
China
Prior art keywords
electrode
inductor
insulator
wave device
acoustic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510172638.8A
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English (en)
Chinese (zh)
Other versions
CN104767499A (zh
Inventor
中山英明
鹰野敦
古川光弘
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Japan Industrial Co Ltd
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Japan Industrial Co Ltd
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Publication of CN104767499A publication Critical patent/CN104767499A/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/0023—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output
    • H03H9/0028—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices
    • H03H9/0047—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/12—Mounting in enclosures for networks with interaction of optical and acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14588—Horizontally-split transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
CN201510172638.8A 2010-12-16 2011-12-14 弹性波装置 Active CN104767499B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-280146 2010-12-16
JP2010280146 2010-12-16
JP2011-051194 2011-03-09
JP2011051194 2011-03-09
CN201180009464.3A CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180009464.3A Division CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Publications (2)

Publication Number Publication Date
CN104767499A CN104767499A (zh) 2015-07-08
CN104767499B true CN104767499B (zh) 2017-09-22

Family

ID=46244359

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510172638.8A Active CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置
CN201180009464.3A Active CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201180009464.3A Active CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Country Status (4)

Country Link
US (2) US9124239B2 (enExample)
JP (3) JP5569587B2 (enExample)
CN (2) CN104767499B (enExample)
WO (1) WO2012081240A1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011188255A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 弾性波素子
JP5654303B2 (ja) * 2010-09-21 2015-01-14 太陽誘電株式会社 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス
CN104767499B (zh) * 2010-12-16 2017-09-22 天工滤波方案日本有限公司 弹性波装置
JP5823219B2 (ja) * 2011-09-08 2015-11-25 太陽誘電株式会社 電子部品
EP2806267A4 (en) * 2012-01-20 2015-12-30 Panasonic Ip Man Co Ltd ELASTIC WAVE SENSOR
JP6006086B2 (ja) * 2012-11-01 2016-10-12 太陽誘電株式会社 弾性波フィルタ及びモジュール
TW201419596A (zh) * 2012-11-15 2014-05-16 日本電波工業股份有限公司 壓電零件
DE102013102210B4 (de) * 2013-03-06 2016-04-07 Epcos Ag Zur Miniaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung
US9209380B2 (en) * 2013-03-08 2015-12-08 Triquint Semiconductor, Inc. Acoustic wave device
JP5907195B2 (ja) * 2014-02-27 2016-04-26 株式会社村田製作所 電子部品及び電子部品の製造方法
DE112015002360B4 (de) * 2014-05-20 2022-02-03 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen und Verfahren zu ihrer Herstellung
WO2016042972A1 (ja) * 2014-09-16 2016-03-24 株式会社村田製作所 電子部品及び樹脂モールド型電子部品装置
KR101706257B1 (ko) * 2015-01-13 2017-02-13 (주)와이솔 압전소자 디바이스
WO2016189952A1 (ja) * 2015-05-22 2016-12-01 株式会社村田製作所 電子部品
CN107735948B (zh) * 2015-06-24 2019-01-04 株式会社村田制作所 多工器、发送装置、接收装置、高频前端电路、通信装置以及多工器的阻抗匹配方法
US10069474B2 (en) * 2015-11-17 2018-09-04 Qualcomm Incorporated Encapsulation of acoustic resonator devices
KR20180082622A (ko) * 2015-12-08 2018-07-18 스카이워크스 솔루션즈, 인코포레이티드 캐리어 웨이퍼를 사용하여 웨이퍼-레벨 칩-스케일 패키지에서 보호 캐비티 및 집적 패시브 컴포넌트들을 제공하는 방법
JP6547617B2 (ja) * 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
WO2017221518A1 (ja) * 2016-06-21 2017-12-28 株式会社村田製作所 弾性波装置及びその製造方法
JP6298861B2 (ja) * 2016-09-07 2018-03-20 太陽誘電株式会社 弾性波フィルタ及びモジュール
JP6823711B2 (ja) * 2017-03-31 2021-02-03 京セラ株式会社 弾性波装置、分波器および通信装置
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP6669132B2 (ja) * 2017-06-23 2020-03-18 株式会社村田製作所 マルチプレクサ、送信装置および受信装置
JP6702438B2 (ja) * 2017-06-30 2020-06-03 株式会社村田製作所 弾性波装置
CN111052606B (zh) * 2017-08-31 2023-04-14 株式会社村田制作所 弹性波装置以及具备该弹性波装置的弹性波模块
FR3073354B1 (fr) 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
EP3511977B1 (en) 2018-01-16 2021-11-03 Infineon Technologies AG Semiconductor module and method for producing the same
SG11202101990TA (en) 2018-08-30 2021-03-30 Skyworks Solutions Inc Packaged surface acoustic wave devices
JP6958525B2 (ja) * 2018-09-25 2021-11-02 株式会社村田製作所 インダクタ部品
US20220329228A1 (en) * 2019-06-28 2022-10-13 Kyocera Corporation Elastic wave device and method of manufacturing elastic wave device
KR20210013955A (ko) 2019-07-29 2021-02-08 삼성전기주식회사 반도체 패키지
JP7461810B2 (ja) * 2020-06-29 2024-04-04 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 圧電デバイス
JP7527873B2 (ja) * 2020-07-15 2024-08-05 太陽誘電株式会社 弾性波デバイス
WO2022080462A1 (ja) * 2020-10-14 2022-04-21 株式会社村田製作所 弾性波装置及び弾性波装置の製造方法
CN116918256A (zh) * 2021-03-02 2023-10-20 株式会社村田制作所 高频模块以及通信装置
US12407315B2 (en) 2021-11-08 2025-09-02 Skyworks Solutions, Inc. Stacked filter package having multiple types of acoustic wave devices
CN114050151A (zh) * 2021-11-12 2022-02-15 合肥矽迈微电子科技有限公司 一种芯片封装体组件及其制造方法
JP7370542B2 (ja) * 2021-11-25 2023-10-30 三安ジャパンテクノロジー株式会社 弾性波デバイス
US12456960B2 (en) 2022-03-02 2025-10-28 Skyworks Solutions, Inc. Temperature compensated acoustic wave device with multilayer interdigital transducer electrode including buffer layer
CN118923040A (zh) 2022-03-29 2024-11-08 株式会社村田制作所 复合滤波器装置
CN121058157A (zh) * 2023-05-10 2025-12-02 株式会社村田制作所 复合滤波器装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
CN102763328A (zh) * 2010-12-16 2012-10-31 松下电器产业株式会社 弹性波装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4691787B2 (ja) * 2001-01-15 2011-06-01 パナソニック株式会社 Ｓａｗデバイス
JP4839868B2 (ja) 2006-02-07 2011-12-21 パナソニック株式会社 電子部品パッケージ
JP2009010121A (ja) 2007-06-27 2009-01-15 Hitachi Media Electoronics Co Ltd 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器
CN101803189B (zh) 2007-10-30 2014-01-08 京瓷株式会社 弹性波装置
JP2009182188A (ja) * 2008-01-31 2009-08-13 Panasonic Corp チップコイルおよびその製造方法
JP2010062412A (ja) * 2008-09-05 2010-03-18 Panasonic Corp 電子部品
JP5453787B2 (ja) 2008-12-03 2014-03-26 パナソニック株式会社 弾性表面波デバイス
JP5206377B2 (ja) * 2008-12-05 2013-06-12 株式会社村田製作所 電子部品モジュール
JP5277971B2 (ja) 2009-01-05 2013-08-28 パナソニック株式会社 弾性表面波デバイス
JP5434138B2 (ja) 2009-02-27 2014-03-05 パナソニック株式会社 弾性表面波部品およびその製造方法
JP5056885B2 (ja) 2010-03-29 2012-10-24 パナソニック株式会社 集積回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
CN102763328A (zh) * 2010-12-16 2012-10-31 松下电器产业株式会社 弹性波装置

Also Published As

Publication number Publication date
JPWO2012081240A1 (ja) 2014-05-22
JP5895016B2 (ja) 2016-03-30
JP2013236401A (ja) 2013-11-21
US20160036416A1 (en) 2016-02-04
JP2014140249A (ja) 2014-07-31
WO2012081240A1 (ja) 2012-06-21
HK1210327A1 (en) 2016-04-15
US9124239B2 (en) 2015-09-01
JP5785228B2 (ja) 2015-09-24
US9325295B2 (en) 2016-04-26
CN102763328A (zh) 2012-10-31
CN104767499A (zh) 2015-07-08
CN102763328B (zh) 2015-12-02
US20120280768A1 (en) 2012-11-08
JP5569587B2 (ja) 2014-08-13

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