CN104767499B - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN104767499B
CN104767499B CN201510172638.8A CN201510172638A CN104767499B CN 104767499 B CN104767499 B CN 104767499B CN 201510172638 A CN201510172638 A CN 201510172638A CN 104767499 B CN104767499 B CN 104767499B
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CN
China
Prior art keywords
electrode
inductor
acoustic wave
insulator
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
CN201510172638.8A
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English (en)
Chinese (zh)
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CN104767499A (zh
Inventor
中山英明
鹰野敦
古川光弘
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Japan Industrial Co Ltd
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Japan Industrial Co Ltd
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/0023—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output
    • H03H9/0028—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices
    • H03H9/0047—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/12—Mounting in enclosures for networks with interaction of optical and acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14588—Horizontally-split transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
CN201510172638.8A 2010-12-16 2011-12-14 弹性波装置 Active CN104767499B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-280146 2010-12-16
JP2010280146 2010-12-16
JP2011-051194 2011-03-09
JP2011051194 2011-03-09
CN201180009464.3A CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180009464.3A Division CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Publications (2)

Publication Number Publication Date
CN104767499A CN104767499A (zh) 2015-07-08
CN104767499B true CN104767499B (zh) 2017-09-22

Family

ID=46244359

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510172638.8A Active CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置
CN201180009464.3A Active CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201180009464.3A Active CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置

Country Status (4)

Country Link
US (2) US9124239B2 (enExample)
JP (3) JP5569587B2 (enExample)
CN (2) CN104767499B (enExample)
WO (1) WO2012081240A1 (enExample)

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JP2011188255A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 弾性波素子
JP5654303B2 (ja) * 2010-09-21 2015-01-14 太陽誘電株式会社 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス
CN104767499B (zh) * 2010-12-16 2017-09-22 天工滤波方案日本有限公司 弹性波装置
JP5823219B2 (ja) * 2011-09-08 2015-11-25 太陽誘電株式会社 電子部品
WO2013108608A1 (ja) * 2012-01-20 2013-07-25 パナソニック株式会社 弾性波センサ
JP6006086B2 (ja) * 2012-11-01 2016-10-12 太陽誘電株式会社 弾性波フィルタ及びモジュール
CN103824932A (zh) * 2012-11-15 2014-05-28 日本电波工业株式会社 压电零件
DE102013102210B4 (de) * 2013-03-06 2016-04-07 Epcos Ag Zur Miniaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung
US9209380B2 (en) * 2013-03-08 2015-12-08 Triquint Semiconductor, Inc. Acoustic wave device
JP5907195B2 (ja) * 2014-02-27 2016-04-26 株式会社村田製作所 電子部品及び電子部品の製造方法
JP6296154B2 (ja) * 2014-05-20 2018-03-20 株式会社村田製作所 弾性波デバイス及びその製造方法
WO2016042972A1 (ja) * 2014-09-16 2016-03-24 株式会社村田製作所 電子部品及び樹脂モールド型電子部品装置
KR101706257B1 (ko) * 2015-01-13 2017-02-13 (주)와이솔 압전소자 디바이스
WO2016189952A1 (ja) * 2015-05-22 2016-12-01 株式会社村田製作所 電子部品
CN107735948B (zh) * 2015-06-24 2019-01-04 株式会社村田制作所 多工器、发送装置、接收装置、高频前端电路、通信装置以及多工器的阻抗匹配方法
US10069474B2 (en) 2015-11-17 2018-09-04 Qualcomm Incorporated Encapsulation of acoustic resonator devices
US10374574B2 (en) * 2015-12-08 2019-08-06 Skyworks Solutions, Inc. Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
JP6547617B2 (ja) * 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
WO2017221518A1 (ja) * 2016-06-21 2017-12-28 株式会社村田製作所 弾性波装置及びその製造方法
JP6298861B2 (ja) * 2016-09-07 2018-03-20 太陽誘電株式会社 弾性波フィルタ及びモジュール
CN110447169B (zh) * 2017-03-31 2023-06-20 京瓷株式会社 弹性波装置、分波器以及通信装置
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP6669132B2 (ja) * 2017-06-23 2020-03-18 株式会社村田製作所 マルチプレクサ、送信装置および受信装置
CN109478877B (zh) * 2017-06-30 2023-06-09 株式会社村田制作所 弹性波装置
WO2019044178A1 (ja) * 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
EP3511977B1 (en) * 2018-01-16 2021-11-03 Infineon Technologies AG Semiconductor module and method for producing the same
WO2020047315A1 (en) 2018-08-30 2020-03-05 Skyworks Solutions, Inc. Packaged surface acoustic wave devices
JP6958525B2 (ja) * 2018-09-25 2021-11-02 株式会社村田製作所 インダクタ部品
CN114128144A (zh) * 2019-06-28 2022-03-01 京瓷株式会社 弹性波装置以及弹性波装置的制造方法
KR20210013955A (ko) 2019-07-29 2021-02-08 삼성전기주식회사 반도체 패키지
JP7461810B2 (ja) * 2020-06-29 2024-04-04 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 圧電デバイス
JP7527873B2 (ja) 2020-07-15 2024-08-05 太陽誘電株式会社 弾性波デバイス
WO2022080462A1 (ja) * 2020-10-14 2022-04-21 株式会社村田製作所 弾性波装置及び弾性波装置の製造方法
US20230147060A1 (en) 2021-11-08 2023-05-11 Skyworks Solutions, Inc. Method for forming acoustic wave device
US12494766B2 (en) 2022-03-02 2025-12-09 Skyworks Solutions, Inc. Acoustic wave device with interdigital transducer electrode having buffer layer
WO2023189835A1 (ja) * 2022-03-29 2023-10-05 株式会社村田製作所 複合フィルタ装置
WO2024232260A1 (ja) * 2023-05-10 2024-11-14 株式会社村田製作所 複合フィルタ装置

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
CN102763328A (zh) * 2010-12-16 2012-10-31 松下电器产业株式会社 弹性波装置

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JP4691787B2 (ja) 2001-01-15 2011-06-01 パナソニック株式会社 Ｓａｗデバイス
JP4839868B2 (ja) * 2006-02-07 2011-12-21 パナソニック株式会社 電子部品パッケージ
JP2009010121A (ja) 2007-06-27 2009-01-15 Hitachi Media Electoronics Co Ltd 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器
JP5214627B2 (ja) 2007-10-30 2013-06-19 京セラ株式会社 弾性波装置
JP2009182188A (ja) * 2008-01-31 2009-08-13 Panasonic Corp チップコイルおよびその製造方法
JP2010062412A (ja) * 2008-09-05 2010-03-18 Panasonic Corp 電子部品
JP5453787B2 (ja) 2008-12-03 2014-03-26 パナソニック株式会社 弾性表面波デバイス
JP5206377B2 (ja) * 2008-12-05 2013-06-12 株式会社村田製作所 電子部品モジュール
JP5277971B2 (ja) 2009-01-05 2013-08-28 パナソニック株式会社 弾性表面波デバイス
JP5434138B2 (ja) 2009-02-27 2014-03-05 パナソニック株式会社 弾性表面波部品およびその製造方法
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
CN102763328A (zh) * 2010-12-16 2012-10-31 松下电器产业株式会社 弹性波装置

Also Published As

Publication number Publication date
WO2012081240A1 (ja) 2012-06-21
JP2014140249A (ja) 2014-07-31
HK1210327A1 (en) 2016-04-15
JPWO2012081240A1 (ja) 2014-05-22
US20160036416A1 (en) 2016-02-04
JP5569587B2 (ja) 2014-08-13
CN104767499A (zh) 2015-07-08
US9124239B2 (en) 2015-09-01
JP2013236401A (ja) 2013-11-21
CN102763328A (zh) 2012-10-31
CN102763328B (zh) 2015-12-02
JP5895016B2 (ja) 2016-03-30
JP5785228B2 (ja) 2015-09-24
US9325295B2 (en) 2016-04-26
US20120280768A1 (en) 2012-11-08

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