JP5434138B2 - 弾性表面波部品およびその製造方法 - Google Patents
弾性表面波部品およびその製造方法 Download PDFInfo
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- JP5434138B2 JP5434138B2 JP2009045140A JP2009045140A JP5434138B2 JP 5434138 B2 JP5434138 B2 JP 5434138B2 JP 2009045140 A JP2009045140 A JP 2009045140A JP 2009045140 A JP2009045140 A JP 2009045140A JP 5434138 B2 JP5434138 B2 JP 5434138B2
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- 238000010897 surface acoustic wave method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000007747 plating Methods 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 46
- 230000001012 protector Effects 0.000 claims description 33
- 238000009713 electroplating Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 150000003608 titanium Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 145
- 239000004020 conductor Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
図1は本発明の実施の形態1における正面断面図である。
2 櫛形電極
3 内部導体
3a 内部電極
4 絶縁層
4a 開放部
5 接着層
6 蓋体
7 蓋体下地層
8 蓋体めっき層
9 空間
10 電極下地層
11 接続電極
12 絶縁保護体
13 外部電極
14 下地層
15 第1のめっきレジスト
16 第2のめっきレジスト
17 バンプ電極
Claims (4)
- 圧電体である基板の主面に、櫛形電極と前記櫛形電極と電気的に接続された内部電極とを形成する第1の工程と、
前記第1の工程の後に、前記基板の上方からみたとき前記櫛形電極の周囲を囲むとともに、前記内部電極の周囲の一部を開放部として開放し、残りの周囲を囲む絶縁層を形成する第2の工程と、
前記第2の工程の後に、空間を介して前記櫛形電極を覆う蓋体を前記絶縁層の上に形成する第3の工程と、
前記第3の工程の後に、前記絶縁層において前記内部電極の周囲を囲む側壁部と前記内部電極上に、めっきの下地となる電極下地層を形成する第4の工程と、
前記第4の工程の後に、側面の一部が前記電極下地層を介して前記側壁部に接する接続電極を、前記内部電極上の前記電極下地層の上に、電解めっきにより形成する第5の工程と、
前記第5の工程の後に、前記蓋体の上から前記基板を覆うとともに前記接続電極の側面の残部を覆う絶縁保護体を形成する第6の工程と、
を備えた弾性表面波部品の製造方法。 - 圧電体である基板と、
前記基板上に形成された櫛形電極と、
前記基板上に形成され、前記櫛形電極と電気的に接続された内部電極と、
前記基板上に形成され、前記基板の上方からみたとき前記櫛形電極の周囲を囲むとともに、前記内部電極の周囲の一部を開放部として開放し残りの周囲を囲む絶縁層と、
前記絶縁層の上に形成され、空間を介して前記櫛形電極を覆う蓋体と、
前記絶縁層の外側面の一部および前記内部電極の上面に形成される電極下地層と、
前記内部電極の上に前記電極下地層を介して電解めっきにより形成され、その側面の一部は前記電極下地層を介して前記絶縁層の外側面の一部に接する接続電極と、
前記蓋体の上から前記基板を覆うとともに前記接続電極の側面の残部を前記電極下地層を介さずに覆う絶縁保護体と、
前記接続電極に電気的に接続されるとともに前記絶縁保護体の外部に設けられた外部電極と、
を備えた弾性表面波部品。 - 前記絶縁層が前記内部電極の周囲を囲む割合を前記内部電極の外周の3/4以下にした請求項2記載の弾性表面波部品。
- 前記下地層はチタン層と前記チタン層の上に形成された銅層の2層構造からなる請求項2記載の弾性表面波部品。
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JP2010200198A JP2010200198A (ja) | 2010-09-09 |
JP5434138B2 true JP5434138B2 (ja) | 2014-03-05 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5569587B2 (ja) * | 2010-12-16 | 2014-08-13 | パナソニック株式会社 | 弾性波装置 |
WO2012110057A1 (en) | 2011-02-15 | 2012-08-23 | Chemisches Institut Schaefer Ag | Cefuroxime safety kit |
JP5141852B2 (ja) | 2011-03-28 | 2013-02-13 | 株式会社村田製作所 | 電子部品及びその製造方法 |
US9548437B2 (en) * | 2011-08-22 | 2017-01-17 | Kyocera Corporation | Acoustic wave device and electronic component |
JP5873311B2 (ja) | 2011-11-29 | 2016-03-01 | 太陽誘電株式会社 | 弾性波デバイス及び多層基板 |
WO2021100506A1 (ja) * | 2019-11-21 | 2021-05-27 | 株式会社村田製作所 | 電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3677409B2 (ja) * | 1999-03-05 | 2005-08-03 | 京セラ株式会社 | 弾性表面波装置及びその製造方法 |
JP2004274574A (ja) * | 2003-03-11 | 2004-09-30 | Toyo Commun Equip Co Ltd | 弾性表面波装置とその製造方法 |
JP4795891B2 (ja) * | 2006-08-10 | 2011-10-19 | 株式会社日立メディアエレクトロニクス | 立体配線を有する実装構造体 |
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