JP5521417B2 - 弾性波素子とこれを用いた電子機器 - Google Patents
弾性波素子とこれを用いた電子機器 Download PDFInfo
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- JP5521417B2 JP5521417B2 JP2009166541A JP2009166541A JP5521417B2 JP 5521417 B2 JP5521417 B2 JP 5521417B2 JP 2009166541 A JP2009166541 A JP 2009166541A JP 2009166541 A JP2009166541 A JP 2009166541A JP 5521417 B2 JP5521417 B2 JP 5521417B2
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- 238000005536 corrosion prevention Methods 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 92
- 239000012212 insulator Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 23
- 238000009713 electroplating Methods 0.000 description 15
- 230000003014 reinforcing effect Effects 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000002787 reinforcement Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
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- 238000000206 photolithography Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Description
以下、本発明の実施の形態1における弾性波素子について図面を参照しながら説明する。
2 圧電基板
3 IDT電極
4 内部電極
5 側壁
6 接着層
7 蓋体
8 空間
9 電極下地層
10 絶縁体
11 外部電極
12 接続電極
13 蓋体下地層
14 蓋体補強層
15 腐食防止層
Claims (6)
- 圧電基板と、
前記圧電基板の上に設けられたIDT電極と、
前記圧電基板の上に設けられると共に前記IDT電極に電気的に接続された内部電極と、
前記内部電極の上であって前記IDT電極の周囲に設けられた側壁と、
前記側壁の上に前記IDT電極上の空間を覆うように設けられた蓋体と、
前記内部電極の上であって前記空間及び前記側壁の外側に設けられた電極下地層と、
前記電極下地層の上に設けられた接続電極とを備え、
前記内部電極と前記側壁との間に設けられかつ前記側壁の外側に突出すると共に前記内部電極よりもメッキ液溶解性の低い材質からなる腐食防止層を備え、
前記腐食防止層は、前記側壁の底面の外側縁部と前記内部電極との間に設けられて、前記外側縁部以外の前記側壁の底面と前記内部電極との間において、前記腐食防止層が設けられていない部分が存在し、
前記腐食防止層は、窒化ケイ素、酸窒化ケイ素、酸化ケイ素を主成分とする媒質からなる弾性波素子。 - 圧電基板と、
前記圧電基板の上に設けられたIDT電極と、
前記圧電基板の上に設けられると共に前記IDT電極に電気的に接続された内部電極と、
前記内部電極の上であって前記IDT電極の周囲に設けられた側壁と、
前記側壁の上に前記IDT電極上の空間を覆うように設けられた蓋体と、
前記内部電極の上であって前記空間及び前記側壁の外側に設けられた電極下地層と、
前記電極下地層の上に設けられた接続電極とを備え、
前記内部電極と前記側壁との間に設けられかつ前記側壁の外側に突出すると共に前記内部電極よりもメッキ液溶解性の低い材質からなる腐食防止層を備え、
前記腐食防止層は、前記側壁の底面の外側縁部と前記内部電極との間に設けられて、
前記外側縁部以外の前記側壁の底面と前記内部電極との間において、前記腐食防止層が設けられていない部分が存在し、
前記腐食防止層は酸化金属からなる弾性波素子。 - 圧電基板と、
前記圧電基板の上に設けられたIDT電極と、
前記圧電基板の上に設けられると共に前記IDT電極に電気的に接続された内部電極と、
前記内部電極の上であって前記IDT電極の周囲に設けられた側壁と、
前記側壁の上に前記IDT電極上の空間を覆うように設けられた蓋体と、
前記内部電極の上であって前記空間及び前記側壁の外側に設けられた電極下地層と、
前記電極下地層の上に設けられた接続電極とを備え、
前記内部電極と前記側壁との間に設けられかつ前記側壁の外側に突出すると共に前記内部電極よりもメッキ液溶解性の低い材質からなる腐食防止層を備え、
前記腐食防止層は前記側壁の底面全面と前記内部電極との間に設けられた弾性波素子。 - 前記腐食防止層はチタン、クロム、モリブデン、タングステン、金、白金の少なくとも一種からなる単体金属、又はこれらを主成分とする合金からなる請求項3に記載の弾性波素子。
- 前記蓋体は前記側壁の上面の外縁部より内側に形成された請求項1から3のいずれかに記載の弾性波素子。
- 請求項1から3のいずれかに記載の弾性波素子と、
前記弾性波素子に接続された半導体集積回路素子と、
前記半導体集積回路素子に接続された再生装置とを備えた電子機器。
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JP2009166541A JP5521417B2 (ja) | 2009-07-15 | 2009-07-15 | 弾性波素子とこれを用いた電子機器 |
US12/836,867 US8334737B2 (en) | 2009-07-15 | 2010-07-15 | Acoustic wave device and electronic apparatus using the same |
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JP2009166541A JP5521417B2 (ja) | 2009-07-15 | 2009-07-15 | 弾性波素子とこれを用いた電子機器 |
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JP5521417B2 true JP5521417B2 (ja) | 2014-06-11 |
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Cited By (1)
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KR20160087292A (ko) * | 2015-01-13 | 2016-07-21 | (주)와이솔 | 압전소자 디바이스 |
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US9660171B2 (en) | 2011-04-19 | 2017-05-23 | Kyocera Corporation | Electronic component and acoustic wave device |
JP5873311B2 (ja) * | 2011-11-29 | 2016-03-01 | 太陽誘電株式会社 | 弾性波デバイス及び多層基板 |
JP2014099781A (ja) * | 2012-11-15 | 2014-05-29 | Nippon Dempa Kogyo Co Ltd | 圧電部品 |
JP2015012428A (ja) * | 2013-06-28 | 2015-01-19 | 京セラ株式会社 | 弾性波装置、電子部品モジュールおよび移動体端末 |
JP6093051B2 (ja) * | 2016-01-26 | 2017-03-08 | 京セラ株式会社 | 弾性波装置およびその製造方法 |
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JPH05275963A (ja) * | 1991-11-15 | 1993-10-22 | Oki Electric Ind Co Ltd | 弾性表面波フィルタ |
JPH10270975A (ja) * | 1996-03-08 | 1998-10-09 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
JP3394752B2 (ja) * | 2000-11-10 | 2003-04-07 | 沖電気工業株式会社 | 弾性表面波素子の製造方法 |
JP4691787B2 (ja) * | 2001-01-15 | 2011-06-01 | パナソニック株式会社 | Sawデバイス |
JP2004274574A (ja) * | 2003-03-11 | 2004-09-30 | Toyo Commun Equip Co Ltd | 弾性表面波装置とその製造方法 |
EP1736981A4 (en) * | 2004-04-08 | 2008-05-07 | Pioneer Corp | INFORMATION REPRODUCTION DEVICE FOR A FERROELECTRIC RECORDING MEDIUM |
JP2006067211A (ja) * | 2004-08-26 | 2006-03-09 | Seiko Epson Corp | 弾性表面波装置および弾性表面波装置の製造方法 |
JP4617917B2 (ja) * | 2005-02-21 | 2011-01-26 | セイコーエプソン株式会社 | 膜パターン形成方法、及び弾性表面波デバイスの製造方法 |
CN101107776B (zh) * | 2005-06-16 | 2010-05-19 | 株式会社村田制作所 | 压电器件及其制作方法 |
JP2007318058A (ja) * | 2006-04-27 | 2007-12-06 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
CN101573868B (zh) * | 2006-12-28 | 2012-05-30 | 京瓷株式会社 | 弹性表面波装置及其制造方法 |
JP5113394B2 (ja) * | 2007-01-23 | 2013-01-09 | 太陽誘電株式会社 | 弾性波デバイス |
WO2009057699A1 (ja) * | 2007-10-30 | 2009-05-07 | Kyocera Corporation | 弾性波装置 |
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US9935610B2 (en) | 2015-01-13 | 2018-04-03 | Wisol Co., Ltd. | Acoustic wave device |
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