JP5569587B2 - 弾性波装置 - Google Patents

弾性波装置 Download PDF

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Publication number
JP5569587B2
JP5569587B2 JP2012529029A JP2012529029A JP5569587B2 JP 5569587 B2 JP5569587 B2 JP 5569587B2 JP 2012529029 A JP2012529029 A JP 2012529029A JP 2012529029 A JP2012529029 A JP 2012529029A JP 5569587 B2 JP5569587 B2 JP 5569587B2
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JP
Japan
Prior art keywords
electrode
insulator
inductor
wave device
acoustic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012529029A
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English (en)
Japanese (ja)
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JPWO2012081240A1 (ja
Inventor
英明 中山
敦 鷹野
光弘 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2012529029A priority Critical patent/JP5569587B2/ja
Publication of JPWO2012081240A1 publication Critical patent/JPWO2012081240A1/ja
Application granted granted Critical
Publication of JP5569587B2 publication Critical patent/JP5569587B2/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/0023—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output
    • H03H9/0028—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices
    • H03H9/0047—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/12—Mounting in enclosures for networks with interaction of optical and acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14588—Horizontally-split transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
JP2012529029A 2010-12-16 2011-12-14 弾性波装置 Active JP5569587B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012529029A JP5569587B2 (ja) 2010-12-16 2011-12-14 弾性波装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010280146 2010-12-16
JP2010280146 2010-12-16
JP2011051194 2011-03-09
JP2011051194 2011-03-09
JP2012529029A JP5569587B2 (ja) 2010-12-16 2011-12-14 弾性波装置
PCT/JP2011/006977 WO2012081240A1 (ja) 2010-12-16 2011-12-14 弾性波装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2013160938A Division JP5785228B2 (ja) 2010-12-16 2013-08-02 弾性波装置
JP2014085155A Division JP5895016B2 (ja) 2010-12-16 2014-04-17 弾性波装置

Publications (2)

Publication Number Publication Date
JPWO2012081240A1 JPWO2012081240A1 (ja) 2014-05-22
JP5569587B2 true JP5569587B2 (ja) 2014-08-13

Family

ID=46244359

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012529029A Active JP5569587B2 (ja) 2010-12-16 2011-12-14 弾性波装置
JP2013160938A Active JP5785228B2 (ja) 2010-12-16 2013-08-02 弾性波装置
JP2014085155A Active JP5895016B2 (ja) 2010-12-16 2014-04-17 弾性波装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013160938A Active JP5785228B2 (ja) 2010-12-16 2013-08-02 弾性波装置
JP2014085155A Active JP5895016B2 (ja) 2010-12-16 2014-04-17 弾性波装置

Country Status (4)

Country Link
US (2) US9124239B2 (enExample)
JP (3) JP5569587B2 (enExample)
CN (2) CN102763328B (enExample)
WO (1) WO2012081240A1 (enExample)

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JP2011188255A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 弾性波素子
JP5654303B2 (ja) * 2010-09-21 2015-01-14 太陽誘電株式会社 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス
CN102763328B (zh) * 2010-12-16 2015-12-02 天工松下滤波方案日本有限公司 弹性波装置
JP5823219B2 (ja) * 2011-09-08 2015-11-25 太陽誘電株式会社 電子部品
WO2013108608A1 (ja) * 2012-01-20 2013-07-25 パナソニック株式会社 弾性波センサ
JP6006086B2 (ja) * 2012-11-01 2016-10-12 太陽誘電株式会社 弾性波フィルタ及びモジュール
TW201419596A (zh) * 2012-11-15 2014-05-16 日本電波工業股份有限公司 壓電零件
DE102013102210B4 (de) * 2013-03-06 2016-04-07 Epcos Ag Zur Miniaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung
US9209380B2 (en) * 2013-03-08 2015-12-08 Triquint Semiconductor, Inc. Acoustic wave device
JP5907195B2 (ja) * 2014-02-27 2016-04-26 株式会社村田製作所 電子部品及び電子部品の製造方法
WO2015178227A1 (ja) * 2014-05-20 2015-11-26 株式会社村田製作所 弾性波デバイス及びその製造方法
WO2016042972A1 (ja) * 2014-09-16 2016-03-24 株式会社村田製作所 電子部品及び樹脂モールド型電子部品装置
KR101706257B1 (ko) * 2015-01-13 2017-02-13 (주)와이솔 압전소자 디바이스
WO2016189952A1 (ja) * 2015-05-22 2016-12-01 株式会社村田製作所 電子部品
WO2016208670A1 (ja) * 2015-06-24 2016-12-29 株式会社村田製作所 マルチプレクサ、送信装置、受信装置、高周波フロントエンド回路、通信装置、およびマルチプレクサのインピーダンス整合方法
US10069474B2 (en) 2015-11-17 2018-09-04 Qualcomm Incorporated Encapsulation of acoustic resonator devices
TW201730994A (zh) 2015-12-08 2017-09-01 天工方案公司 使用一載體晶圓以在晶圓級晶片尺寸封裝中提供保護空腔及整合式被動組件之方法
JP6547617B2 (ja) * 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
WO2017221518A1 (ja) * 2016-06-21 2017-12-28 株式会社村田製作所 弾性波装置及びその製造方法
JP6298861B2 (ja) * 2016-09-07 2018-03-20 太陽誘電株式会社 弾性波フィルタ及びモジュール
CN110447169B (zh) * 2017-03-31 2023-06-20 京瓷株式会社 弹性波装置、分波器以及通信装置
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP6669132B2 (ja) * 2017-06-23 2020-03-18 株式会社村田製作所 マルチプレクサ、送信装置および受信装置
CN109478877B (zh) * 2017-06-30 2023-06-09 株式会社村田制作所 弹性波装置
WO2019044178A1 (ja) * 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
FR3073354B1 (fr) 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
EP3511977B1 (en) 2018-01-16 2021-11-03 Infineon Technologies AG Semiconductor module and method for producing the same
JP2021535663A (ja) * 2018-08-30 2021-12-16 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. パッケージ状弾性表面波デバイス
JP6958525B2 (ja) * 2018-09-25 2021-11-02 株式会社村田製作所 インダクタ部品
WO2020262607A1 (ja) * 2019-06-28 2020-12-30 京セラ株式会社 弾性波装置及び弾性波装置の製造方法
KR20210013955A (ko) 2019-07-29 2021-02-08 삼성전기주식회사 반도체 패키지
JP7461810B2 (ja) * 2020-06-29 2024-04-04 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 圧電デバイス
JP7527873B2 (ja) 2020-07-15 2024-08-05 太陽誘電株式会社 弾性波デバイス
WO2022080462A1 (ja) * 2020-10-14 2022-04-21 株式会社村田製作所 弾性波装置及び弾性波装置の製造方法
US12407315B2 (en) 2021-11-08 2025-09-02 Skyworks Solutions, Inc. Stacked filter package having multiple types of acoustic wave devices
US12494766B2 (en) 2022-03-02 2025-12-09 Skyworks Solutions, Inc. Acoustic wave device with interdigital transducer electrode having buffer layer
CN118923040A (zh) * 2022-03-29 2024-11-08 株式会社村田制作所 复合滤波器装置
WO2024232260A1 (ja) * 2023-05-10 2024-11-14 株式会社村田製作所 複合フィルタ装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
JP2002217673A (ja) * 2001-01-15 2002-08-02 Matsushita Electric Ind Co Ltd Ｓａｗデバイスとその製造方法及びこのｓａｗデバイスを用いた電子部品
WO2005055423A1 (ja) * 2003-12-01 2005-06-16 Murata Manufacturing Co., Ltd. フィルタ装置
WO2006134928A1 (ja) * 2005-06-16 2006-12-21 Murata Manufacturing Co., Ltd. 圧電デバイス及びその製造方法
JP2007214169A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 電子部品パッケージ
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
JP2010136143A (ja) * 2008-12-05 2010-06-17 Murata Mfg Co Ltd 電子部品モジュール

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JP2009010121A (ja) 2007-06-27 2009-01-15 Hitachi Media Electoronics Co Ltd 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器
JP5214627B2 (ja) 2007-10-30 2013-06-19 京セラ株式会社 弾性波装置
JP2009182188A (ja) * 2008-01-31 2009-08-13 Panasonic Corp チップコイルおよびその製造方法
JP2010062412A (ja) * 2008-09-05 2010-03-18 Panasonic Corp 電子部品
JP5453787B2 (ja) 2008-12-03 2014-03-26 パナソニック株式会社 弾性表面波デバイス
JP5277971B2 (ja) 2009-01-05 2013-08-28 パナソニック株式会社 弾性表面波デバイス
JP5434138B2 (ja) 2009-02-27 2014-03-05 パナソニック株式会社 弾性表面波部品およびその製造方法
JP5056885B2 (ja) 2010-03-29 2012-10-24 パナソニック株式会社 集積回路装置
CN102763328B (zh) * 2010-12-16 2015-12-02 天工松下滤波方案日本有限公司 弹性波装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330890A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
JP2002217673A (ja) * 2001-01-15 2002-08-02 Matsushita Electric Ind Co Ltd Ｓａｗデバイスとその製造方法及びこのｓａｗデバイスを用いた電子部品
WO2005055423A1 (ja) * 2003-12-01 2005-06-16 Murata Manufacturing Co., Ltd. フィルタ装置
WO2006134928A1 (ja) * 2005-06-16 2006-12-21 Murata Manufacturing Co., Ltd. 圧電デバイス及びその製造方法
JP2007214169A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 電子部品パッケージ
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法
JP2010136143A (ja) * 2008-12-05 2010-06-17 Murata Mfg Co Ltd 電子部品モジュール

Also Published As

Publication number Publication date
CN102763328B (zh) 2015-12-02
JP5895016B2 (ja) 2016-03-30
HK1210327A1 (en) 2016-04-15
CN104767499A (zh) 2015-07-08
US20120280768A1 (en) 2012-11-08
US9124239B2 (en) 2015-09-01
JP2014140249A (ja) 2014-07-31
JP5785228B2 (ja) 2015-09-24
WO2012081240A1 (ja) 2012-06-21
JPWO2012081240A1 (ja) 2014-05-22
CN104767499B (zh) 2017-09-22
JP2013236401A (ja) 2013-11-21
US20160036416A1 (en) 2016-02-04
US9325295B2 (en) 2016-04-26
CN102763328A (zh) 2012-10-31

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