CN102763328B - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN102763328B
CN102763328B CN201180009464.3A CN201180009464A CN102763328B CN 102763328 B CN102763328 B CN 102763328B CN 201180009464 A CN201180009464 A CN 201180009464A CN 102763328 B CN102763328 B CN 102763328B
Authority
CN
China
Prior art keywords
electrode
insulator
inductor
elastic wave
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180009464.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102763328A (zh
Inventor
中山英明
鹰野敦
古川光弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Industrial Co Ltd
Original Assignee
Tiangong Panasonic Filter Solutions Japan Co ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tiangong Panasonic Filter Solutions Japan Co ltd, Matsushita Electric Industrial Co Ltd filed Critical Tiangong Panasonic Filter Solutions Japan Co ltd
Priority to CN201510172638.8A priority Critical patent/CN104767499B/zh
Publication of CN102763328A publication Critical patent/CN102763328A/zh
Application granted granted Critical
Publication of CN102763328B publication Critical patent/CN102763328B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/0023—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output
    • H03H9/0028—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices
    • H03H9/0047—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/12—Mounting in enclosures for networks with interaction of optical and acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14544—Transducers of particular shape or position
    • H03H9/14588—Horizontally-split transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
CN201180009464.3A 2010-12-16 2011-12-14 弹性波装置 Active CN102763328B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510172638.8A CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-280146 2010-12-16
JP2010280146 2010-12-16
JP2011051194 2011-03-09
JP2011-051194 2011-03-09
PCT/JP2011/006977 WO2012081240A1 (ja) 2010-12-16 2011-12-14 弾性波装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201510172638.8A Division CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置

Publications (2)

Publication Number Publication Date
CN102763328A CN102763328A (zh) 2012-10-31
CN102763328B true CN102763328B (zh) 2015-12-02

Family

ID=46244359

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180009464.3A Active CN102763328B (zh) 2010-12-16 2011-12-14 弹性波装置
CN201510172638.8A Active CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201510172638.8A Active CN104767499B (zh) 2010-12-16 2011-12-14 弹性波装置

Country Status (4)

Country Link
US (2) US9124239B2 (enExample)
JP (3) JP5569587B2 (enExample)
CN (2) CN102763328B (enExample)
WO (1) WO2012081240A1 (enExample)

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JP2011188255A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 弾性波素子
JP5654303B2 (ja) * 2010-09-21 2015-01-14 太陽誘電株式会社 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス
CN102763328B (zh) * 2010-12-16 2015-12-02 天工松下滤波方案日本有限公司 弹性波装置
JP5823219B2 (ja) * 2011-09-08 2015-11-25 太陽誘電株式会社 電子部品
WO2013108608A1 (ja) * 2012-01-20 2013-07-25 パナソニック株式会社 弾性波センサ
JP6006086B2 (ja) * 2012-11-01 2016-10-12 太陽誘電株式会社 弾性波フィルタ及びモジュール
US9264016B2 (en) * 2012-11-15 2016-02-16 Nihon Dempa Kogyo Co., Ltd. Piezoelectric component having a cover layer including resin that contains translucent filler
DE102013102210B4 (de) * 2013-03-06 2016-04-07 Epcos Ag Zur Miniaturisierung geeignetes elektrisches Bauelement mit verringerter Verkopplung
US9209380B2 (en) * 2013-03-08 2015-12-08 Triquint Semiconductor, Inc. Acoustic wave device
JP5907195B2 (ja) * 2014-02-27 2016-04-26 株式会社村田製作所 電子部品及び電子部品の製造方法
CN106464231B (zh) * 2014-05-20 2019-02-22 株式会社村田制作所 弹性波器件及其制造方法
WO2016042972A1 (ja) * 2014-09-16 2016-03-24 株式会社村田製作所 電子部品及び樹脂モールド型電子部品装置
KR101706257B1 (ko) * 2015-01-13 2017-02-13 (주)와이솔 압전소자 디바이스
WO2016189952A1 (ja) * 2015-05-22 2016-12-01 株式会社村田製作所 電子部品
JP6222406B2 (ja) * 2015-06-24 2017-11-01 株式会社村田製作所 マルチプレクサ、送信装置、受信装置、高周波フロントエンド回路、通信装置、およびマルチプレクサのインピーダンス整合方法
US10069474B2 (en) 2015-11-17 2018-09-04 Qualcomm Incorporated Encapsulation of acoustic resonator devices
WO2017100255A1 (en) 2015-12-08 2017-06-15 Skyworks Solutions, Inc. Method of providing protective cavity and integrated passive components in wafer-level chip-scale package using a carrier wafer
JP6547617B2 (ja) * 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
WO2017221518A1 (ja) * 2016-06-21 2017-12-28 株式会社村田製作所 弾性波装置及びその製造方法
JP6298861B2 (ja) * 2016-09-07 2018-03-20 太陽誘電株式会社 弾性波フィルタ及びモジュール
US11031919B2 (en) * 2017-03-31 2021-06-08 Kyocera Corporation Elastic wave device, duplexer, and communication device
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP6669132B2 (ja) * 2017-06-23 2020-03-18 株式会社村田製作所 マルチプレクサ、送信装置および受信装置
CN109478877B (zh) * 2017-06-30 2023-06-09 株式会社村田制作所 弹性波装置
CN111052606B (zh) * 2017-08-31 2023-04-14 株式会社村田制作所 弹性波装置以及具备该弹性波装置的弹性波模块
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
EP3511977B1 (en) 2018-01-16 2021-11-03 Infineon Technologies AG Semiconductor module and method for producing the same
SG11202101990TA (en) 2018-08-30 2021-03-30 Skyworks Solutions Inc Packaged surface acoustic wave devices
JP6958525B2 (ja) * 2018-09-25 2021-11-02 株式会社村田製作所 インダクタ部品
CN114128144A (zh) * 2019-06-28 2022-03-01 京瓷株式会社 弹性波装置以及弹性波装置的制造方法
KR20210013955A (ko) 2019-07-29 2021-02-08 삼성전기주식회사 반도체 패키지
JP7461810B2 (ja) * 2020-06-29 2024-04-04 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 圧電デバイス
JP7527873B2 (ja) 2020-07-15 2024-08-05 太陽誘電株式会社 弾性波デバイス
WO2022080462A1 (ja) * 2020-10-14 2022-04-21 株式会社村田製作所 弾性波装置及び弾性波装置の製造方法
US12407315B2 (en) 2021-11-08 2025-09-02 Skyworks Solutions, Inc. Stacked filter package having multiple types of acoustic wave devices
US12494766B2 (en) 2022-03-02 2025-12-09 Skyworks Solutions, Inc. Acoustic wave device with interdigital transducer electrode having buffer layer
CN118923040A (zh) * 2022-03-29 2024-11-08 株式会社村田制作所 复合滤波器装置
CN121058157A (zh) * 2023-05-10 2025-12-02 株式会社村田制作所 复合滤波器装置

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JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法

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JPH08330890A (ja) 1995-05-29 1996-12-13 Kyocera Corp 弾性表面波共振器
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JP2009010121A (ja) 2007-06-27 2009-01-15 Hitachi Media Electoronics Co Ltd 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器
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Publication number Priority date Publication date Assignee Title
JP2001217674A (ja) * 2000-01-31 2001-08-10 Kyocera Corp 弾性表面波装置
CN1751436A (zh) * 2003-12-01 2006-03-22 株式会社村田制作所 滤波器装置
CN101107776A (zh) * 2005-06-16 2008-01-16 株式会社村田制作所 压电器件及其制作方法
WO2008105199A1 (ja) * 2007-02-28 2008-09-04 Murata Manufacturing Co., Ltd. 分波器及びその製造方法

Also Published As

Publication number Publication date
CN104767499B (zh) 2017-09-22
US20120280768A1 (en) 2012-11-08
US9124239B2 (en) 2015-09-01
JP2014140249A (ja) 2014-07-31
US20160036416A1 (en) 2016-02-04
JP2013236401A (ja) 2013-11-21
JP5895016B2 (ja) 2016-03-30
HK1210327A1 (en) 2016-04-15
CN104767499A (zh) 2015-07-08
JPWO2012081240A1 (ja) 2014-05-22
WO2012081240A1 (ja) 2012-06-21
JP5785228B2 (ja) 2015-09-24
JP5569587B2 (ja) 2014-08-13
CN102763328A (zh) 2012-10-31
US9325295B2 (en) 2016-04-26

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SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SKYWORKS PANASONIC FILTRATE SOLUTIONS JAPAN CO., L

Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD.

Effective date: 20150105

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20150105

Address after: Osaka Japan

Applicant after: PANASONIC CORPORATION

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Applicant before: Matsushita Electric Industrial Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Osaka Japan

Patentee after: Japan Industrial Co., Ltd.

Address before: Osaka Japan

Patentee before: PANASONIC CORPORATION