JP2018207045A - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP2018207045A JP2018207045A JP2017113673A JP2017113673A JP2018207045A JP 2018207045 A JP2018207045 A JP 2018207045A JP 2017113673 A JP2017113673 A JP 2017113673A JP 2017113673 A JP2017113673 A JP 2017113673A JP 2018207045 A JP2018207045 A JP 2018207045A
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- 239000000758 substrate Substances 0.000 claims abstract description 137
- 230000035699 permeability Effects 0.000 claims description 7
- 239000010408 film Substances 0.000 description 26
- 230000005540 biological transmission Effects 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 101150060282 PLB1 gene Proteins 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0523—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezo-electric or electrostrictive material including passive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
- H03H9/605—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J1/00—Frequency-division multiplex systems
- H04J1/02—Details
- H04J1/04—Frequency-transposition arrangements
- H04J1/045—Filters applied to frequency transposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Abstract
【解決手段】第1面を有する第1基板と、前記第1面と空隙を挟み対向する第2面を有する第2基板と、前記第2面と前記空隙を挟み対向するように前記第1面に設けられた第1コイルパターンと、前記第1コイルパターンが設けられた領域および前記第1コイルパターンによって囲まれる領域である第1領域と平面視において少なくとも一部で重なる第2面上の領域である第2領域に設けられ、前記第1面と前記空隙を挟み対向する第2コイルパターンと、前記第1コイルパターンと前記第2コイルパターンとを接続する接続端子と、を具備する電子部品。
【選択図】図2
Description
12、22 弾性波素子
14、14a、14b、24、24a、24b コイル
16、26 配線
17 ビア配線
18 端子
28 バンプ
36 空隙
38 コア
Claims (11)
- 第1面を有する第1基板と、
前記第1面と空隙を挟み対向する第2面を有する第2基板と、
前記第2面と前記空隙を挟み対向するように前記第1面に設けられた第1コイルパターンと、
前記第1コイルパターンが設けられた領域および前記第1コイルパターンによって囲まれる領域である第1領域と平面視において少なくとも一部で重なる第2面上の領域である第2領域に設けられ、前記第1面と前記空隙を挟み対向する第2コイルパターンと、
前記第1コイルパターンと前記第2コイルパターンとを接続する接続端子と、
を具備する電子部品。 - 平面視において、前記第1コイルパターンと前記第2コイルパターンは重なる請求項1に記載の電子部品。
- 前記第1コイルパターンと前記第2コイルパターンとは和動接続されている請求項1または2に記載の電子部品。
- 前記第1コイルパターンおよび前記第2コイルパターンはスパイラル形状である請求項1から3のいずれか一項に記載の電子部品。
- 前記第1コイルパターンおよび前記第2コイルパターンの少なくとも一方内の前記第1基板と前記第2基板との間に設けられ、前記空隙の透磁率より高いコアを具備する請求項1から4のいずれか一項記載の電子部品。
- 前記第1コイルパターンと接続され、前記第2面と前記空隙を挟み対向するように前記第1基板に設けられた第1弾性波素子を具備する請求項1から5のいずれか一項に記載の電子部品。
- 前記第1基板は、
前記第2基板側の第3面を有する圧電基板と、
前記第2面と前記空隙を挟み対向するように前記第3面に設けられた第1弾性波素子と、
前記圧電基板より誘電率が低く、前記第2基板側の面が前記第1面であり、前記第1弾性波素子が設けられた領域には設けられないように前記第3面に設けられた絶縁層と、
を有する請求項1から5のいずれか一項に記載の電子部品 - 前記第1基板は、
前記第1面を有する支持基板と、
前記支持基板より誘電率が高く、前記第2基板側の第3面と反対側の面が前記第1面に接合され、前記第1コイルパターンが設けられた領域には設けられていない圧電基板と、
前記第2面と前記空隙を挟み対向するように前記第3面に設けられた第1弾性波素子と、
を有する請求項1から5のいずれか一項に記載の電子部品 - 前記第2コイルパターンと接続され、前記第1面と前記空隙を挟み対向するように前記第2基板に設けられた第2弾性波素子を具備する請求項6から8いずれか一項に記載の電子部品。
- 前記第1弾性波素子を含むフィルタを具備する請求項6から9のいずれか一項に記載の電子部品。
- 前記フィルタを含むマルチプレクサを具備する請求項10に記載の電子部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017113673A JP6909060B2 (ja) | 2017-06-08 | 2017-06-08 | 電子部品 |
US15/985,967 US11569019B2 (en) | 2017-06-08 | 2018-05-22 | Electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017113673A JP6909060B2 (ja) | 2017-06-08 | 2017-06-08 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018207045A true JP2018207045A (ja) | 2018-12-27 |
JP6909060B2 JP6909060B2 (ja) | 2021-07-28 |
Family
ID=64564314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017113673A Active JP6909060B2 (ja) | 2017-06-08 | 2017-06-08 | 電子部品 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11569019B2 (ja) |
JP (1) | JP6909060B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020150514A (ja) * | 2019-03-15 | 2020-09-17 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法、フィルタ及びマルチプレクサ |
JP2021034745A (ja) * | 2019-08-13 | 2021-03-01 | 太陽誘電株式会社 | マルチプレクサ |
JP2021180575A (ja) * | 2020-05-14 | 2021-11-18 | 株式会社デンソー | 電力変換装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111510107B (zh) * | 2020-04-30 | 2022-07-12 | 诺思(天津)微系统有限责任公司 | 滤波器元件、多工器和通信设备 |
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JP2014075534A (ja) * | 2012-10-05 | 2014-04-24 | Toyota Industries Corp | 基板間接続構造、接合基板、及び誘導機器 |
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JP4762531B2 (ja) | 2004-11-30 | 2011-08-31 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
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-
2018
- 2018-05-22 US US15/985,967 patent/US11569019B2/en active Active
Patent Citations (7)
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JPH06215951A (ja) * | 1993-01-19 | 1994-08-05 | Yokogawa Electric Corp | プリントコイル形トランス |
JP2007059839A (ja) * | 2005-08-26 | 2007-03-08 | Matsushita Electric Works Ltd | Lc複合部品 |
JP2007067236A (ja) * | 2005-08-31 | 2007-03-15 | Fujitsu Ltd | 集積型電子部品および集積型電子部品製造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020150514A (ja) * | 2019-03-15 | 2020-09-17 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法、フィルタ及びマルチプレクサ |
JP7426196B2 (ja) | 2019-03-15 | 2024-02-01 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法、フィルタ及びマルチプレクサ |
JP2021034745A (ja) * | 2019-08-13 | 2021-03-01 | 太陽誘電株式会社 | マルチプレクサ |
JP7347989B2 (ja) | 2019-08-13 | 2023-09-20 | 太陽誘電株式会社 | マルチプレクサ |
JP2021180575A (ja) * | 2020-05-14 | 2021-11-18 | 株式会社デンソー | 電力変換装置 |
JP7419963B2 (ja) | 2020-05-14 | 2024-01-23 | 株式会社デンソー | 電力変換装置 |
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JP6909060B2 (ja) | 2021-07-28 |
US11569019B2 (en) | 2023-01-31 |
US20180358167A1 (en) | 2018-12-13 |
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