SG11202101990TA - Packaged surface acoustic wave devices - Google Patents

Packaged surface acoustic wave devices

Info

Publication number
SG11202101990TA
SG11202101990TA SG11202101990TA SG11202101990TA SG11202101990TA SG 11202101990T A SG11202101990T A SG 11202101990TA SG 11202101990T A SG11202101990T A SG 11202101990TA SG 11202101990T A SG11202101990T A SG 11202101990TA SG 11202101990T A SG11202101990T A SG 11202101990TA
Authority
SG
Singapore
Prior art keywords
acoustic wave
surface acoustic
wave devices
packaged surface
packaged
Prior art date
Application number
SG11202101990TA
Inventor
Li Ann Koo
Takashi Inoue
Vivian Sing Zhi Lee
Ping Yi Tan
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Publication of SG11202101990TA publication Critical patent/SG11202101990TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG11202101990TA 2018-08-30 2019-08-29 Packaged surface acoustic wave devices SG11202101990TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862725133P 2018-08-30 2018-08-30
PCT/US2019/048904 WO2020047315A1 (en) 2018-08-30 2019-08-29 Packaged surface acoustic wave devices

Publications (1)

Publication Number Publication Date
SG11202101990TA true SG11202101990TA (en) 2021-03-30

Family

ID=69639258

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202101990TA SG11202101990TA (en) 2018-08-30 2019-08-29 Packaged surface acoustic wave devices

Country Status (6)

Country Link
US (5) US11894824B2 (en)
JP (1) JP2021535663A (en)
CN (1) CN112997402A (en)
SG (1) SG11202101990TA (en)
TW (1) TW202025523A (en)
WO (1) WO2020047315A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10744595B2 (en) * 2018-05-09 2020-08-18 Trumpf Inc. Transversal laser cutting machine
US11894824B2 (en) 2018-08-30 2024-02-06 Skyworks Solutions, Inc. Laser-marked packaged surface acoustic wave devices
WO2022061884A1 (en) * 2020-09-28 2022-03-31 福建晶安光电有限公司 Method for blackening wafer, blackened wafer, and surface acoustic wave filter
CN115632628B (en) * 2022-09-30 2024-05-24 锐石创芯(重庆)科技有限公司 Filter structure, manufacturing method thereof, filter chip and electronic equipment

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407459B2 (en) * 1995-03-23 2003-05-19 株式会社村田製作所 Surface wave resonator filter
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
JP3892370B2 (en) * 2002-09-04 2007-03-14 富士通メディアデバイス株式会社 Surface acoustic wave element, filter device, and manufacturing method thereof
JP2004274574A (en) 2003-03-11 2004-09-30 Toyo Commun Equip Co Ltd Surface acoustic wave device and manufacturing method thereof
US7239023B2 (en) * 2003-09-24 2007-07-03 Tai-Saw Technology Co., Ltd. Package assembly for electronic device
JP4044090B2 (en) 2003-12-26 2008-02-06 シャープ株式会社 Color filter substrate, liquid crystal display device including the same, and method for manufacturing color filter substrate
JP2005303980A (en) 2004-03-15 2005-10-27 Matsushita Electric Ind Co Ltd Surface acoustic wave device and method for forming the same
JP2006108993A (en) 2004-10-04 2006-04-20 Hitachi Media Electoronics Co Ltd Surface acoustic wave device and manufacturing method thereof
JP4706907B2 (en) * 2005-06-15 2011-06-22 株式会社村田製作所 Piezoelectric device and manufacturing method thereof
WO2006134928A1 (en) 2005-06-16 2006-12-21 Murata Manufacturing Co., Ltd. Piezoelectric device and manufacturing method thereof
JP4585419B2 (en) 2005-10-04 2010-11-24 富士通メディアデバイス株式会社 Surface acoustic wave device and manufacturing method thereof
JP4811409B2 (en) 2005-11-14 2011-11-09 株式会社村田製作所 Manufacturing method of surface acoustic wave device
TWI431380B (en) 2006-05-12 2014-03-21 Photon Dynamics Inc Deposition repair apparatus and methods
JP4952781B2 (en) 2007-02-28 2012-06-13 株式会社村田製作所 Demultiplexer and manufacturing method thereof
JP2009010559A (en) 2007-06-27 2009-01-15 Nippon Dempa Kogyo Co Ltd Piezoelectric component and method of manufacturing the same
JP5363991B2 (en) * 2007-11-20 2013-12-11 日本無線株式会社 Surface acoustic wave device and liquid property measuring apparatus
US8900931B2 (en) 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
JP4638530B2 (en) 2008-08-19 2011-02-23 日本電波工業株式会社 Piezoelectric component and manufacturing method thereof
JP5424973B2 (en) 2009-05-26 2014-02-26 日本電波工業株式会社 Piezoelectric component and manufacturing method thereof
JP5537096B2 (en) * 2009-08-28 2014-07-02 京セラ株式会社 Elastic wave device and circuit board
JP2011188255A (en) * 2010-03-09 2011-09-22 Panasonic Corp Acoustic wave device
WO2012081240A1 (en) 2010-12-16 2012-06-21 パナソニック株式会社 Elastic wave device
JP5910636B2 (en) 2012-02-03 2016-04-27 株式会社村田製作所 Surface acoustic wave device and composite module including the same
WO2015151514A1 (en) 2014-03-31 2015-10-08 ナガセケムテックス株式会社 Circuit member having hollow section, mounting structure, and mounting structure manufacturing method
WO2016103925A1 (en) 2014-12-25 2016-06-30 株式会社村田製作所 Elastic wave device and method for manufacturing same
WO2016185866A1 (en) * 2015-05-18 2016-11-24 株式会社村田製作所 Surface acoustic wave device, high frequency module and method for manufacturing surface acoustic wave device
US10090820B2 (en) 2015-07-31 2018-10-02 Qorvo Us, Inc. Stealth-dicing compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices
KR20180031713A (en) 2015-08-25 2018-03-28 가부시키가이샤 무라타 세이사쿠쇼 Seismic wave device
US10574202B2 (en) 2016-04-01 2020-02-25 Skyworks Filter Solutions Japan Co., Ltd. Electronic package including cavity formed by removal of sacrificial material from within a cap
WO2019078234A1 (en) 2017-10-19 2019-04-25 株式会社村田製作所 Acoustic wave device
JP7057690B2 (en) 2018-03-19 2022-04-20 株式会社村田製作所 Elastic wave device
US11894824B2 (en) 2018-08-30 2024-02-06 Skyworks Solutions, Inc. Laser-marked packaged surface acoustic wave devices

Also Published As

Publication number Publication date
US20200076402A1 (en) 2020-03-05
US20200076400A1 (en) 2020-03-05
US11159137B2 (en) 2021-10-26
US20220006439A1 (en) 2022-01-06
JP2021535663A (en) 2021-12-16
US11923817B2 (en) 2024-03-05
US20200076398A1 (en) 2020-03-05
US11777465B2 (en) 2023-10-03
CN112997402A (en) 2021-06-18
US11894824B2 (en) 2024-02-06
US20200076399A1 (en) 2020-03-05
WO2020047315A1 (en) 2020-03-05
US11784622B2 (en) 2023-10-10
TW202025523A (en) 2020-07-01

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