JP5277971B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
- Publication number
- JP5277971B2 JP5277971B2 JP2009000080A JP2009000080A JP5277971B2 JP 5277971 B2 JP5277971 B2 JP 5277971B2 JP 2009000080 A JP2009000080 A JP 2009000080A JP 2009000080 A JP2009000080 A JP 2009000080A JP 5277971 B2 JP5277971 B2 JP 5277971B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric substrate
- acoustic wave
- surface acoustic
- side wall
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000005284 excitation Effects 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000005336 cracking Methods 0.000 abstract description 6
- 230000006378 damage Effects 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000007789 sealing Methods 0.000 description 16
- 239000004020 conductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
13 櫛形電極
13a 櫛形電極
13b 櫛形電極
15 配線
15a 配線
15b 配線
16 側壁
17 天板
19 励振空間
22 外部端子
23 抜き穴
27 抜き穴
Claims (1)
- 圧電基板と、この圧電基板の表面に設けられた複数の櫛形電極と、これらの複数の櫛形電極間を接続する配線と、前記圧電基板の上に設けられ、かつ前記櫛形電極を囲む側壁と、この側壁の上に設けられ、かつ前記櫛形電極の励振空間を覆う天板と、前記配線と電気的に接続された外部端子とを備え、前記側壁に前記圧電基板の垂直方向に貫通するダミーの抜き穴を複数個設け、かつこの抜き穴は圧電基板の熱膨張率と側壁の熱膨張率との差が大きい方向よりも小さい方向の寸法を大きくした弾性表面波デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009000080A JP5277971B2 (ja) | 2009-01-05 | 2009-01-05 | 弾性表面波デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009000080A JP5277971B2 (ja) | 2009-01-05 | 2009-01-05 | 弾性表面波デバイス |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013059509A Division JP5467375B2 (ja) | 2013-03-22 | 2013-03-22 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010157956A JP2010157956A (ja) | 2010-07-15 |
JP5277971B2 true JP5277971B2 (ja) | 2013-08-28 |
Family
ID=42575508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009000080A Active JP5277971B2 (ja) | 2009-01-05 | 2009-01-05 | 弾性表面波デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5277971B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140354114A1 (en) * | 2013-06-03 | 2014-12-04 | Taiyo Yuden Co., Ltd. | Acoustic wave device and method of fabricating the same |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5654303B2 (ja) * | 2010-09-21 | 2015-01-14 | 太陽誘電株式会社 | 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス |
CN102763328B (zh) | 2010-12-16 | 2015-12-02 | 天工松下滤波方案日本有限公司 | 弹性波装置 |
CN103460599B (zh) * | 2011-03-28 | 2016-08-17 | 株式会社村田制作所 | 电子部件及其制造方法 |
JP5823219B2 (ja) * | 2011-09-08 | 2015-11-25 | 太陽誘電株式会社 | 電子部品 |
JP6006086B2 (ja) | 2012-11-01 | 2016-10-12 | 太陽誘電株式会社 | 弾性波フィルタ及びモジュール |
JP6612529B2 (ja) * | 2015-05-28 | 2019-11-27 | 京セラ株式会社 | 弾性波装置および通信装置 |
KR102018504B1 (ko) * | 2016-04-14 | 2019-09-05 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 및 그 제조 방법 |
WO2018110057A1 (ja) * | 2016-12-16 | 2018-06-21 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
CN110114972B (zh) * | 2016-12-21 | 2023-07-18 | 株式会社村田制作所 | 弹性波装置的制造方法、弹性波装置、高频前端电路以及通信装置 |
CN118381482A (zh) * | 2023-01-20 | 2024-07-23 | 华为技术有限公司 | 谐振器、滤波器、电子设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4691787B2 (ja) * | 2001-01-15 | 2011-06-01 | パナソニック株式会社 | Sawデバイス |
JP2003115734A (ja) * | 2001-10-09 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 弾性表面波装置とその製造方法 |
JP2006333130A (ja) * | 2005-05-26 | 2006-12-07 | Alps Electric Co Ltd | 表面弾性波装置 |
JP5117083B2 (ja) * | 2007-03-09 | 2013-01-09 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法 |
-
2009
- 2009-01-05 JP JP2009000080A patent/JP5277971B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140354114A1 (en) * | 2013-06-03 | 2014-12-04 | Taiyo Yuden Co., Ltd. | Acoustic wave device and method of fabricating the same |
US9751109B2 (en) * | 2013-06-03 | 2017-09-05 | Taiyo Yuden Co., Ltd. | Acoustic wave device and method of fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
JP2010157956A (ja) | 2010-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5277971B2 (ja) | 弾性表面波デバイス | |
US10200010B2 (en) | Elastic wave filter device | |
US9751109B2 (en) | Acoustic wave device and method of fabricating the same | |
JP4645233B2 (ja) | 弾性表面波装置 | |
US8564171B2 (en) | Acoustic wave element and electronic device including the same | |
JP2008060382A (ja) | 電子部品及びその製造方法 | |
JP5206377B2 (ja) | 電子部品モジュール | |
JP2009010559A (ja) | 圧電部品及びその製造方法 | |
JP2007318058A (ja) | 電子部品及びその製造方法 | |
JP5453787B2 (ja) | 弾性表面波デバイス | |
JP2015156626A (ja) | 弾性波素子、分波器および通信装置 | |
JP6026829B2 (ja) | 弾性表面波デバイス | |
JPWO2018003283A1 (ja) | 弾性波装置及び電子部品 | |
JP4906557B2 (ja) | 弾性表面波装置の製造方法 | |
JP2011160024A (ja) | 弾性波装置およびその製造方法 | |
JP5873311B2 (ja) | 弾性波デバイス及び多層基板 | |
JP2016010026A (ja) | 弾性波素子および通信装置 | |
JP2011023930A (ja) | 弾性波素子とこれを用いた電子機器 | |
US11367677B2 (en) | Electronic component module | |
JP5467375B2 (ja) | 弾性表面波デバイス | |
JP4655796B2 (ja) | 弾性境界波装置の製造方法及び弾性境界波装置 | |
JP5338575B2 (ja) | 弾性波素子とこれを用いた電子機器 | |
JP6166190B2 (ja) | 弾性波素子および弾性波装置 | |
JP2011023929A (ja) | 弾性波素子とこれを用いた電子機器 | |
JP6185125B2 (ja) | 弾性表面波デバイスの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111202 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20120112 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20121214 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130124 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130205 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130328 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130423 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130506 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5277971 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |