CN104427781B - 树脂掩模层用洗涤剂组合物及电路基板的制造方法 - Google Patents
树脂掩模层用洗涤剂组合物及电路基板的制造方法 Download PDFInfo
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- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- DTIFFPXSSXFQCJ-UHFFFAOYSA-N tetrahexylazanium Chemical compound CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC DTIFFPXSSXFQCJ-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/645—Mixtures of compounds all of which are cationic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910364110.9A CN110225667B (zh) | 2013-09-11 | 2014-09-10 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
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|---|---|---|---|
| JP2013-188618 | 2013-09-11 | ||
| JP2013188618 | 2013-09-11 |
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|---|---|---|---|
| CN201910364110.9A Division CN110225667B (zh) | 2013-09-11 | 2014-09-10 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104427781A CN104427781A (zh) | 2015-03-18 |
| CN104427781B true CN104427781B (zh) | 2019-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410458834.7A Active CN104427781B (zh) | 2013-09-11 | 2014-09-10 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
| CN201910364110.9A Active CN110225667B (zh) | 2013-09-11 | 2014-09-10 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
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| CN201910364110.9A Active CN110225667B (zh) | 2013-09-11 | 2014-09-10 | 树脂掩模层用洗涤剂组合物及电路基板的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6412377B2 (ja) |
| KR (1) | KR102257405B1 (ja) |
| CN (2) | CN104427781B (ja) |
| TW (1) | TWI647303B (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6808714B2 (ja) * | 2015-08-03 | 2021-01-06 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 洗浄組成物 |
| JP6670100B2 (ja) * | 2015-12-25 | 2020-03-18 | 花王株式会社 | 樹脂マスク剥離用洗浄剤組成物 |
| JP6824719B2 (ja) * | 2015-12-28 | 2021-02-03 | 花王株式会社 | ネガ型樹脂マスク剥離用洗浄剤組成物 |
| JP2017119782A (ja) * | 2015-12-28 | 2017-07-06 | 花王株式会社 | 水溶性フラックス用洗浄剤組成物 |
| TWI685718B (zh) * | 2016-06-20 | 2020-02-21 | 日商三菱製紙股份有限公司 | 阻焊劑圖型之形成方法 |
| JP6860276B2 (ja) | 2016-09-09 | 2021-04-14 | 花王株式会社 | 樹脂マスク剥離用洗浄剤組成物 |
| JP6924690B2 (ja) * | 2017-12-21 | 2021-08-25 | 花王株式会社 | 樹脂マスク剥離洗浄方法 |
| US10948826B2 (en) * | 2018-03-07 | 2021-03-16 | Versum Materials Us, Llc | Photoresist stripper |
| JP7036212B2 (ja) * | 2018-04-26 | 2022-03-15 | 栗田工業株式会社 | 第四級トリアルキルアルカノールアミン水酸化物を含む組成物の安定化 |
| KR102029127B1 (ko) * | 2019-02-08 | 2019-10-07 | 영창케미칼 주식회사 | 반도체 제조 공정에 있어서 실리콘 또는 실리콘 화합물 패턴을 형성하기 위한 신규 방법 |
| CN114008539A (zh) * | 2019-06-27 | 2022-02-01 | 花王株式会社 | 清洗方法 |
| CN112764330B (zh) * | 2021-01-08 | 2022-08-02 | 绵阳艾萨斯电子材料有限公司 | Pfa光刻胶再生剥离液及其制备方法与应用 |
| CN113437204A (zh) * | 2021-05-18 | 2021-09-24 | 深圳市隆利科技股份有限公司 | 一种灯板制备方法 |
| CN115475797B (zh) * | 2022-09-30 | 2024-04-05 | 肇庆绿宝石电子科技股份有限公司 | 一种叠层电容器及其制造方法、载条清洗液及制备方法 |
| WO2024128210A1 (ja) * | 2022-12-12 | 2024-06-20 | 三菱瓦斯化学株式会社 | フォトレジスト除去用組成物およびフォトレジストの除去方法 |
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- 2014-09-10 CN CN201410458834.7A patent/CN104427781B/zh active Active
- 2014-09-10 CN CN201910364110.9A patent/CN110225667B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6412377B2 (ja) | 2018-10-24 |
| TW201516143A (zh) | 2015-05-01 |
| CN104427781A (zh) | 2015-03-18 |
| CN110225667A (zh) | 2019-09-10 |
| CN110225667B (zh) | 2023-01-10 |
| TWI647303B (zh) | 2019-01-11 |
| KR20150030175A (ko) | 2015-03-19 |
| JP2015079244A (ja) | 2015-04-23 |
| KR102257405B1 (ko) | 2021-05-27 |
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