TWI647303B - 樹脂遮罩層用洗淨劑組合物及電路基板之製造方法 - Google Patents
樹脂遮罩層用洗淨劑組合物及電路基板之製造方法 Download PDFInfo
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- TWI647303B TWI647303B TW103131435A TW103131435A TWI647303B TW I647303 B TWI647303 B TW I647303B TW 103131435 A TW103131435 A TW 103131435A TW 103131435 A TW103131435 A TW 103131435A TW I647303 B TWI647303 B TW I647303B
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- 239000003599 detergent Substances 0.000 title claims abstract description 160
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- 239000011133 lead Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- DVUVKWLUHXXIHK-UHFFFAOYSA-N tetraazanium;tetrahydroxide Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[OH-].[OH-].[OH-].[OH-] DVUVKWLUHXXIHK-UHFFFAOYSA-N 0.000 description 1
- GJSGYPDDPQRWPK-UHFFFAOYSA-N tetrapentylammonium Chemical compound CCCCC[N+](CCCCC)(CCCCC)CCCCC GJSGYPDDPQRWPK-UHFFFAOYSA-N 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- GZBUMTPCIKCWFW-UHFFFAOYSA-N triethylcholine Chemical compound CC[N+](CC)(CC)CCO GZBUMTPCIKCWFW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/645—Mixtures of compounds all of which are cationic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-188618 | 2013-09-11 | ||
| JP2013188618 | 2013-09-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201516143A TW201516143A (zh) | 2015-05-01 |
| TWI647303B true TWI647303B (zh) | 2019-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103131435A TWI647303B (zh) | 2013-09-11 | 2014-09-11 | 樹脂遮罩層用洗淨劑組合物及電路基板之製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6412377B2 (ja) |
| KR (1) | KR102257405B1 (ja) |
| CN (2) | CN104427781B (ja) |
| TW (1) | TWI647303B (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102637508B1 (ko) | 2015-08-03 | 2024-02-15 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 세정 조성물 |
| JP6670100B2 (ja) * | 2015-12-25 | 2020-03-18 | 花王株式会社 | 樹脂マスク剥離用洗浄剤組成物 |
| JP6824719B2 (ja) * | 2015-12-28 | 2021-02-03 | 花王株式会社 | ネガ型樹脂マスク剥離用洗浄剤組成物 |
| JP2017119782A (ja) * | 2015-12-28 | 2017-07-06 | 花王株式会社 | 水溶性フラックス用洗浄剤組成物 |
| TWI685718B (zh) * | 2016-06-20 | 2020-02-21 | 日商三菱製紙股份有限公司 | 阻焊劑圖型之形成方法 |
| JP6860276B2 (ja) | 2016-09-09 | 2021-04-14 | 花王株式会社 | 樹脂マスク剥離用洗浄剤組成物 |
| JP6924690B2 (ja) * | 2017-12-21 | 2021-08-25 | 花王株式会社 | 樹脂マスク剥離洗浄方法 |
| US10948826B2 (en) * | 2018-03-07 | 2021-03-16 | Versum Materials Us, Llc | Photoresist stripper |
| ES2912801T3 (es) * | 2018-04-26 | 2022-05-27 | Kurita Water Ind Ltd | Estabilización de composiciones que comprenden hidróxido de trialquilalcanolamina cuaternaria |
| KR102029127B1 (ko) * | 2019-02-08 | 2019-10-07 | 영창케미칼 주식회사 | 반도체 제조 공정에 있어서 실리콘 또는 실리콘 화합물 패턴을 형성하기 위한 신규 방법 |
| WO2020262448A1 (ja) * | 2019-06-27 | 2020-12-30 | 花王株式会社 | 洗浄方法 |
| CN112764330B (zh) * | 2021-01-08 | 2022-08-02 | 绵阳艾萨斯电子材料有限公司 | Pfa光刻胶再生剥离液及其制备方法与应用 |
| CN113437204A (zh) * | 2021-05-18 | 2021-09-24 | 深圳市隆利科技股份有限公司 | 一种灯板制备方法 |
| CN115475797B (zh) * | 2022-09-30 | 2024-04-05 | 肇庆绿宝石电子科技股份有限公司 | 一种叠层电容器及其制造方法、载条清洗液及制备方法 |
| WO2024128210A1 (ja) * | 2022-12-12 | 2024-06-20 | 三菱瓦斯化学株式会社 | フォトレジスト除去用組成物およびフォトレジストの除去方法 |
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| TW200928619A (en) * | 2007-09-28 | 2009-07-01 | Samsung Electronics Co Ltd | Composition for striipping and stripping method |
| TW201137117A (en) * | 2010-03-25 | 2011-11-01 | Fujifilm Corp | Cleaning composition, cleaning process, and process for producing semiconductor device |
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-
2014
- 2014-09-10 CN CN201410458834.7A patent/CN104427781B/zh active Active
- 2014-09-10 JP JP2014184510A patent/JP6412377B2/ja active Active
- 2014-09-10 CN CN201910364110.9A patent/CN110225667B/zh active Active
- 2014-09-11 TW TW103131435A patent/TWI647303B/zh active
- 2014-09-11 KR KR1020140119918A patent/KR102257405B1/ko active IP Right Grant
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| TW545099B (en) * | 2002-06-17 | 2003-08-01 | Via Tech Inc | Bump forming technology with high resolution |
| TW200928619A (en) * | 2007-09-28 | 2009-07-01 | Samsung Electronics Co Ltd | Composition for striipping and stripping method |
| TW201137117A (en) * | 2010-03-25 | 2011-11-01 | Fujifilm Corp | Cleaning composition, cleaning process, and process for producing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201516143A (zh) | 2015-05-01 |
| CN110225667A (zh) | 2019-09-10 |
| JP6412377B2 (ja) | 2018-10-24 |
| CN104427781B (zh) | 2019-05-17 |
| JP2015079244A (ja) | 2015-04-23 |
| KR20150030175A (ko) | 2015-03-19 |
| CN110225667B (zh) | 2023-01-10 |
| CN104427781A (zh) | 2015-03-18 |
| KR102257405B1 (ko) | 2021-05-27 |
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