CN104339088A - 用于在透明材料内执行激光成丝的系统 - Google Patents
用于在透明材料内执行激光成丝的系统 Download PDFInfo
- Publication number
- CN104339088A CN104339088A CN201410380104.XA CN201410380104A CN104339088A CN 104339088 A CN104339088 A CN 104339088A CN 201410380104 A CN201410380104 A CN 201410380104A CN 104339088 A CN104339088 A CN 104339088A
- Authority
- CN
- China
- Prior art keywords
- filament
- laser
- transparent material
- pulse
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012780 transparent material Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 224
- 239000000463 material Substances 0.000 claims abstract description 215
- 230000008569 process Effects 0.000 claims abstract description 121
- 230000003287 optical effect Effects 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 49
- 238000012545 processing Methods 0.000 claims description 73
- 238000000926 separation method Methods 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 32
- 230000004075 alteration Effects 0.000 claims description 25
- 230000001066 destructive effect Effects 0.000 claims description 20
- 238000013532 laser treatment Methods 0.000 claims description 17
- 230000010287 polarization Effects 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 9
- 230000003252 repetitive effect Effects 0.000 claims description 9
- 238000000608 laser ablation Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 238000010977 unit operation Methods 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 230000009467 reduction Effects 0.000 claims description 2
- 238000012806 monitoring device Methods 0.000 claims 5
- 238000012544 monitoring process Methods 0.000 abstract description 7
- 238000003491 array Methods 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 63
- 239000011521 glass Substances 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 43
- 238000002679 ablation Methods 0.000 description 37
- 229910052751 metal Inorganic materials 0.000 description 29
- 239000002184 metal Substances 0.000 description 29
- 238000005520 cutting process Methods 0.000 description 26
- 239000000523 sample Substances 0.000 description 25
- 238000013519 translation Methods 0.000 description 24
- 239000013077 target material Substances 0.000 description 21
- 238000012986 modification Methods 0.000 description 20
- 230000004048 modification Effects 0.000 description 20
- 238000011282 treatment Methods 0.000 description 20
- 230000011218 segmentation Effects 0.000 description 19
- 230000006378 damage Effects 0.000 description 17
- 230000006835 compression Effects 0.000 description 15
- 238000007906 compression Methods 0.000 description 15
- 238000009826 distribution Methods 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 15
- 230000009021 linear effect Effects 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000003860 storage Methods 0.000 description 12
- 230000001276 controlling effect Effects 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 11
- 238000003672 processing method Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 10
- 229910052594 sapphire Inorganic materials 0.000 description 10
- 239000010980 sapphire Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 230000003993 interaction Effects 0.000 description 8
- 230000000670 limiting effect Effects 0.000 description 8
- 230000001172 regenerating effect Effects 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 230000004438 eyesight Effects 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000005361 soda-lime glass Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 230000005374 Kerr effect Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 238000011068 loading method Methods 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000010438 granite Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000008093 supporting effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000005461 Bremsstrahlung Effects 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 3
- 230000006399 behavior Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000005400 gorilla glass Substances 0.000 description 3
- 230000001976 improved effect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 241000272165 Charadriidae Species 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 239000011222 crystalline ceramic Substances 0.000 description 2
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 241000736800 Vernonia Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000005391 art glass Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000005395 beveled glass Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000012010 growth Effects 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 238000001155 isoelectric focusing Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000004705 lumbosacral region Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004973 motor coordination Effects 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- -1 protection window Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/002—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of fibres, filaments, yarns, felts or woven material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/02—Fibres; Filaments; Yarns; Felts; Woven material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Surface Treatment Of Glass (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361861880P | 2013-08-02 | 2013-08-02 | |
US61/861,880 | 2013-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104339088A true CN104339088A (zh) | 2015-02-11 |
CN104339088B CN104339088B (zh) | 2017-03-01 |
Family
ID=51265551
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410380147.8A Active CN104339081B (zh) | 2013-08-02 | 2014-08-04 | 用于在透明材料内执行激光成丝的方法和设备 |
CN201410380104.XA Active CN104339088B (zh) | 2013-08-02 | 2014-08-04 | 用于在透明材料内执行激光成丝的系统 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410380147.8A Active CN104339081B (zh) | 2013-08-02 | 2014-08-04 | 用于在透明材料内执行激光成丝的方法和设备 |
Country Status (10)
Country | Link |
---|---|
US (4) | US9102007B2 (zh) |
EP (3) | EP2859983B1 (zh) |
JP (4) | JP2015030040A (zh) |
KR (5) | KR20150016176A (zh) |
CN (2) | CN104339081B (zh) |
CA (2) | CA2857820C (zh) |
HK (2) | HK1205715A1 (zh) |
MY (1) | MY177289A (zh) |
SG (2) | SG10201404459UA (zh) |
TW (3) | TWI653115B (zh) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107402151A (zh) * | 2017-07-31 | 2017-11-28 | 水利部交通运输部国家能源局南京水利科学研究院 | 一种超声激励控制脆性材料表面及贯穿裂纹尺寸的方法 |
CN107922237A (zh) * | 2015-03-24 | 2018-04-17 | 康宁股份有限公司 | 显示器玻璃组合物的激光切割和加工 |
CN107921580A (zh) * | 2015-06-29 | 2018-04-17 | 肖特股份有限公司 | 一种借助于激光加工在多相透明工件之中或之上产生修改的方法;多相复合材料 |
CN108549160A (zh) * | 2018-04-20 | 2018-09-18 | 北京工业大学 | 一种连续调整激光成丝长度的装置及方法 |
CN109270764A (zh) * | 2018-11-26 | 2019-01-25 | 西安交通大学 | 基于反馈迭代波前整形技术飞秒激光成丝调控装置与方法 |
CN109373243A (zh) * | 2018-11-28 | 2019-02-22 | 江苏集萃有机光电技术研究所有限公司 | 一种oled灯片和灯具 |
CN109693032A (zh) * | 2019-02-27 | 2019-04-30 | 大族激光科技产业集团股份有限公司 | 激光切割方法和装置 |
CN109786584A (zh) * | 2017-11-15 | 2019-05-21 | 三星显示有限公司 | 显示装置及制造显示装置的方法 |
CN110220469A (zh) * | 2018-03-01 | 2019-09-10 | 株式会社三丰 | 用于透明管的内径测量的方法和设备 |
CN110579935A (zh) * | 2017-08-08 | 2019-12-17 | 广东弘景光电科技股份有限公司 | 生成与待测摄像头模组对应的测试标板的方法及系统 |
CN110788500A (zh) * | 2019-10-28 | 2020-02-14 | 北京航天控制仪器研究所 | 一种硬脆材料复杂构件飞秒激光精密成型加工系统 |
CN111716025A (zh) * | 2019-03-19 | 2020-09-29 | 柯马杜股份有限公司 | 用于为蓝宝石表镜加标记的方法 |
CN111886107A (zh) * | 2018-03-19 | 2020-11-03 | 美敦力公司 | 使用能量脉冲的表面纹理化 |
CN112775539A (zh) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | 激光加工方法及装置 |
CN112775569A (zh) * | 2020-12-24 | 2021-05-11 | 苏州禾弘电子科技有限公司 | 一种电路板的激光钻孔方法 |
CN112798574A (zh) * | 2020-12-19 | 2021-05-14 | 北京工业大学 | 一种超快激光成丝对大气组分的远程实时探测系统 |
RU2806353C1 (ru) * | 2022-08-19 | 2023-10-31 | Владимир Николаевич Токарев | Способ и устройство для обработки хрупких прозрачных и полупрозрачных материалов |
WO2024039266A3 (ru) * | 2022-08-19 | 2024-04-11 | Владимир Николаевич ТОКАРЕВ | Способ и устройство для обработки хрупких прозрачных и полупрозрачных материалов |
Families Citing this family (174)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
JP6186016B2 (ja) * | 2013-04-04 | 2017-08-23 | エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト | 基板に貫通穴を開ける方法及び装置 |
EP2964416B1 (de) | 2013-04-04 | 2023-07-19 | LPKF Laser & Electronics SE | Verfahren zum trennen eines substrates |
IL227458A0 (en) * | 2013-07-11 | 2013-12-31 | Technion Res & Dev Foundation | A method and cave for transmitting light |
US9102011B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
US10252507B2 (en) | 2013-11-19 | 2019-04-09 | Rofin-Sinar Technologies Llc | Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy |
US10005152B2 (en) | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
CN107241904B (zh) * | 2013-12-17 | 2019-08-30 | 康宁股份有限公司 | 玻璃的3d成形 |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
US20150165560A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9687936B2 (en) * | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9815730B2 (en) * | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US10189117B2 (en) | 2013-12-31 | 2019-01-29 | The United States Of America, As Represented By The Secretary Of The Navy | Adhesion improvement via material nanostructuring or texturizing |
US10106880B2 (en) | 2013-12-31 | 2018-10-23 | The United States Of America, As Represented By The Secretary Of The Navy | Modifying the surface chemistry of a material |
EA032743B1 (ru) * | 2014-03-04 | 2019-07-31 | Сэн-Гобэн Гласс Франс | Способ резки ламинированного сверхтонкого стеклянного слоя |
JP6262039B2 (ja) | 2014-03-17 | 2018-01-17 | 株式会社ディスコ | 板状物の加工方法 |
US10369663B1 (en) * | 2014-05-30 | 2019-08-06 | Gentex Corporation | Laser process with controlled polarization |
JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
RU2661977C1 (ru) * | 2014-07-03 | 2018-07-23 | Ниппон Стил Энд Сумитомо Метал Корпорейшн | Устройство лазерной обработки |
KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
US9873628B1 (en) | 2014-12-02 | 2018-01-23 | Coherent Kaiserslautern GmbH | Filamentary cutting of brittle materials using a picosecond pulsed laser |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
TWI558044B (zh) * | 2014-12-09 | 2016-11-11 | 國立清華大學 | 連續光譜產生裝置及其組裝方法 |
CN107406293A (zh) | 2015-01-12 | 2017-11-28 | 康宁股份有限公司 | 使用多光子吸收方法来对经热回火的基板进行激光切割 |
WO2016114934A1 (en) | 2015-01-13 | 2016-07-21 | Rofin-Sinar Technologies Inc. | Method and system for scribing brittle material followed by chemical etching |
EP3274313A1 (en) | 2015-03-27 | 2018-01-31 | Corning Incorporated | Gas permeable window and method of fabricating the same |
JP6654813B2 (ja) * | 2015-06-02 | 2020-02-26 | 川崎重工業株式会社 | 面取り加工装置および面取り加工方法 |
US10384306B1 (en) | 2015-06-10 | 2019-08-20 | Seagate Technology Llc | Laser cutting array with multiple laser source arrangement |
JP2018525233A (ja) * | 2015-06-16 | 2018-09-06 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 透明な材料を加工する方法及び装置 |
EP3109208A1 (de) | 2015-06-22 | 2016-12-28 | Flabeg France SAS | Verfahren zum vereinzeln eines glassubstrats |
EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
US11307475B2 (en) * | 2015-07-10 | 2022-04-19 | View, Inc. | Bird friendly electrochromic devices |
DE102015111491A1 (de) * | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum Abtrennen von Glas- oder Glaskeramikteilen |
DE102015111490A1 (de) | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement |
KR102077667B1 (ko) | 2015-08-10 | 2020-02-14 | 쌩-고벵 글래스 프랑스 | 박형 유리 층의 절단 방법 |
EP3145036B1 (en) | 2015-09-17 | 2020-03-18 | Academia Sinica | Supercontinuum generation apparatus and method |
DE102015116846A1 (de) * | 2015-10-05 | 2017-04-06 | Schott Ag | Verfahren zum Filamentieren eines Werkstückes mit einer von der Sollkontur abweichenden Form sowie durch Filamentation erzeugtes Werkstück |
JP6529414B2 (ja) * | 2015-10-15 | 2019-06-12 | 株式会社ディスコ | ウエーハの加工方法 |
JP6757491B2 (ja) * | 2015-10-20 | 2020-09-23 | 日本電気硝子株式会社 | 管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法 |
DE102015120950B4 (de) * | 2015-12-02 | 2022-03-03 | Schott Ag | Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement |
DE102015225929B4 (de) * | 2015-12-18 | 2018-01-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Überprüfung eines Trennschrittes bei der Zerteilung eines flachen Werkstückes in Teilstücke |
JP6858780B2 (ja) * | 2015-12-22 | 2021-04-14 | ヘレウス ドイチュラント ゲーエムベーハー ウント カンパニー カーゲー | ピコレーザを用いる金属−セラミック基材の製造方法 |
US20170189992A1 (en) * | 2015-12-31 | 2017-07-06 | Nlight, Inc. | Black sub-anodized marking using picosecond bursts |
JP6602207B2 (ja) | 2016-01-07 | 2019-11-06 | 株式会社ディスコ | SiCウエーハの生成方法 |
CN107030390A (zh) * | 2016-02-04 | 2017-08-11 | 苏州沃特维自动化系统有限公司 | 一种太阳能电池片切割装置 |
DE102016102768A1 (de) * | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
JP6755705B2 (ja) * | 2016-05-09 | 2020-09-16 | 株式会社ディスコ | レーザー加工装置 |
JP6755707B2 (ja) * | 2016-05-12 | 2020-09-16 | 株式会社ディスコ | レーザー加工装置 |
JP6770340B2 (ja) * | 2016-05-30 | 2020-10-14 | 株式会社ディスコ | ウエーハの生成方法 |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
JP6705014B2 (ja) * | 2016-06-08 | 2020-06-03 | ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド | サファイアを切断するための方法及び装置 |
KR102548461B1 (ko) | 2016-06-10 | 2023-06-28 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
LT3468742T (lt) * | 2016-06-14 | 2022-12-12 | Evana Technologies, Uab | Daugiasegmentis fokusavimo lęšis ir lazerinio apdirbimo sistema plokštelių sudalinimui arba pjaustymui |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
EP3507057A1 (en) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
TWI583982B (zh) | 2016-09-26 | 2017-05-21 | 峰安車業股份有限公司 | 位移量測裝置及加工系統 |
JP6775822B2 (ja) * | 2016-09-28 | 2020-10-28 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
JP6944703B2 (ja) * | 2016-09-28 | 2021-10-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の改質層形成方法 |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
EP3529214B1 (en) * | 2016-10-24 | 2020-12-23 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US20180118602A1 (en) * | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
US10668561B2 (en) | 2016-11-15 | 2020-06-02 | Coherent, Inc. | Laser apparatus for cutting brittle material |
CN108122807A (zh) * | 2016-11-30 | 2018-06-05 | 北大方正集团有限公司 | 一种晶圆承载盒、晶圆激光打标系统及方法 |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
KR102356415B1 (ko) * | 2017-03-06 | 2022-02-08 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법 |
US20180257170A1 (en) | 2017-03-13 | 2018-09-13 | Coherent Lasersystems Gmbh & Co. Kg | Controlled separation of laser processed brittle material |
CN110869845A (zh) * | 2017-04-12 | 2020-03-06 | 法国圣戈班玻璃厂 | 电致变色结构及分离电致变色结构的方法 |
WO2018213294A1 (en) * | 2017-05-15 | 2018-11-22 | The Trustees Of The University Of Pennsylvania | Systems and methods for laser cleaving diamonds |
CN115259646B (zh) * | 2017-05-19 | 2024-05-17 | 肖特股份有限公司 | 一种包括玻璃或玻璃陶瓷的组件及用于生产该组件的方法 |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
DE102018005010A1 (de) * | 2017-07-13 | 2019-01-17 | Wika Alexander Wiegand Se & Co. Kg | Transfer und Aufschmelzen von Schichten |
JP6923158B2 (ja) * | 2017-07-27 | 2021-08-18 | 三菱重工業株式会社 | レーザービーム照射装置及びレーザービーム照射システム |
US20190067049A1 (en) * | 2017-08-23 | 2019-02-28 | Asm Technology Singapore Pte Ltd | Radiative wafer cutting using selective focusing depths |
CO2017012225A1 (es) | 2017-08-23 | 2018-02-20 | Agp America Sa | Blindaje transparente multi impacto |
CN111065485B (zh) * | 2017-08-25 | 2022-06-21 | 康宁股份有限公司 | 使用无焦光束调整组件激光加工透明工件的设备和方法 |
EP3460520B1 (en) * | 2017-09-25 | 2023-07-19 | Hexagon Technology Center GmbH | Multi-beam laser scanner |
JP6893691B2 (ja) * | 2017-09-29 | 2021-06-23 | 三星ダイヤモンド工業株式会社 | 複層脆性材料基板の作製方法および作製システム |
KR101870137B1 (ko) | 2017-10-25 | 2018-07-19 | 영원산업개발 주식회사 | 친환경 식생토낭을 이용한 사면보강 및 녹화공법 |
JP6925945B2 (ja) * | 2017-11-30 | 2021-08-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP6925745B2 (ja) * | 2017-11-30 | 2021-08-25 | 株式会社ディスコ | ウェーハのレーザー加工方法 |
US10705327B2 (en) | 2018-01-02 | 2020-07-07 | Industrial Technology Research Institute | Light emitting method and light emitting device |
TWI699252B (zh) * | 2018-01-02 | 2020-07-21 | 財團法人工業技術研究院 | 出光方法及出光裝置 |
DE102018200029A1 (de) * | 2018-01-03 | 2019-07-04 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Laserbearbeitungsmaschine zur Oberflächenstrukturierung lasertransparenter Werkstücke |
RU2685288C1 (ru) * | 2018-01-09 | 2019-04-17 | Александр Андреевич Никитин | Устройство для лазерной обработки изделий |
RU2691806C1 (ru) * | 2018-01-09 | 2019-06-18 | Александр Андреевич Никитин | Устройство для лазерной обработки изделий |
DE102018100443A1 (de) | 2018-01-10 | 2019-07-11 | Schott Ag | Verfahren und Vorrichtung zur Herstellung von Glasvorprodukten und von Glasprodukten |
JP6783401B2 (ja) * | 2018-01-31 | 2020-11-11 | Hoya株式会社 | 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法 |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US20190263709A1 (en) * | 2018-02-26 | 2019-08-29 | Corning Incorporated | Methods for laser forming transparent articles from a transparent mother sheet and processing the transparent articles in-situ |
US11524366B2 (en) | 2018-07-26 | 2022-12-13 | Coherent Munich GmbH & Co. KG | Separation and release of laser-processed brittle material |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
US20200061750A1 (en) | 2018-08-22 | 2020-02-27 | Coherent Munich GmbH & Co. KG | Mitigating low surface quality |
JP6740299B2 (ja) * | 2018-08-24 | 2020-08-12 | ファナック株式会社 | 加工条件調整装置及び機械学習装置 |
DE102018216440A1 (de) * | 2018-09-26 | 2020-03-26 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines laminierten Verbundelements, insbesondere eines Verbundglaselements, und Schneidsystem |
DE102018216873A1 (de) * | 2018-10-01 | 2020-04-02 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks |
TW202400349A (zh) | 2018-10-08 | 2024-01-01 | 美商伊雷克托科學工業股份有限公司 | 用於在基板中形成穿孔的方法 |
EP3867003B1 (en) * | 2018-11-16 | 2024-08-28 | University of Rochester | Scalable manufacturing with laser induced refractive index change |
KR102631826B1 (ko) * | 2018-12-18 | 2024-01-30 | 니프로 가부시키가이샤 | 의료용 글라스 제품 절단을 위한 절단 부위의 데미징 가공 장치 및 방법 |
CN109631948B (zh) * | 2018-12-29 | 2022-06-24 | 中国电子科技集团公司第四十一研究所 | 一种用于全站仪校准的光纤传递装置及方法 |
KR20200111421A (ko) | 2019-03-19 | 2020-09-29 | 삼성전자주식회사 | 레이저 장치 및 이를 이용한 기판 다이싱 장치 및 방법 |
JP7287084B2 (ja) | 2019-04-17 | 2023-06-06 | セイコーエプソン株式会社 | 電気光学装置の製造方法、および有機エレクトロルミネッセンス装置の製造方法 |
JP7330771B2 (ja) * | 2019-06-14 | 2023-08-22 | 株式会社ディスコ | ウエーハの生成方法およびウエーハの生成装置 |
WO2020252729A1 (en) * | 2019-06-20 | 2020-12-24 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for laser dicing of bonded structures |
EP3990209B1 (en) * | 2019-07-01 | 2023-10-04 | Corning Incorporated | Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams |
US20210035767A1 (en) * | 2019-07-29 | 2021-02-04 | Applied Materials, Inc. | Methods for repairing a recess of a chamber component |
CN110426306B (zh) * | 2019-08-31 | 2024-03-26 | 山东省计量科学研究院 | 室内加热器玻璃面板耐受热冲击试验装置 |
US12094621B2 (en) * | 2019-09-11 | 2024-09-17 | Max-Planck-Gesellschaft, Zur Förderung der Wissenschaften e.V. | System comprising an aperture and a dispersing element for applying electromagnetic radiation onto a source material, and method for aligning an aperture |
CN110539085A (zh) * | 2019-09-11 | 2019-12-06 | 华东师范大学重庆研究院 | 一种飞秒光丝隐切方法及装置 |
DE102019125124A1 (de) * | 2019-09-18 | 2021-03-18 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
CN110550873A (zh) * | 2019-09-20 | 2019-12-10 | 中国建筑材料科学研究总院有限公司 | 一种镀膜夹层玻璃内标识的制备方法 |
CN110837215B (zh) * | 2019-11-05 | 2021-02-26 | 中国科学院光电技术研究所 | 一种可实现长焦深小焦斑结构的高效率激光直写光刻方法 |
CN110773871B (zh) * | 2019-11-08 | 2021-10-12 | 合肥工业大学 | 一种在空速管的非平表面上制备防结冰表面的制备方法 |
US11383430B2 (en) | 2019-11-21 | 2022-07-12 | Arevo, Inc. | Heating system for fiber-reinforced thermoplastic feedstock and workpiece |
DE112020005047T5 (de) * | 2019-11-21 | 2022-11-03 | AGC Inc. | Glasplattenverarbeitungsverfahren und glasplatte |
US11383431B2 (en) | 2019-11-21 | 2022-07-12 | Arevo, Inc. | Heating system for fiber-reinforced thermoplastic feedstock and workpiece |
US11312068B2 (en) | 2019-11-21 | 2022-04-26 | Arevo, Inc. | Heating system for fiber-reinforced thermoplastic feedstock and workpiece |
US11390024B2 (en) | 2019-11-21 | 2022-07-19 | Arevo, Inc. | Heating system for fiber-reinforced thermoplastic feedstock and workpiece |
DE102019219462A1 (de) * | 2019-12-12 | 2021-06-17 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines Glaselements und Schneidsystem |
KR20210080718A (ko) | 2019-12-20 | 2021-07-01 | 삼성전자주식회사 | 반도체 패키지 |
JP7436212B2 (ja) * | 2020-01-06 | 2024-02-21 | 株式会社ディスコ | ウエーハ加工方法、及びウエーハ加工装置 |
CN113210879A (zh) * | 2020-01-17 | 2021-08-06 | 大族激光科技产业集团股份有限公司 | 屏幕倒角加工方法 |
JP7421951B2 (ja) | 2020-02-26 | 2024-01-25 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
KR20210113501A (ko) | 2020-03-06 | 2021-09-16 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
US12064830B2 (en) * | 2020-03-12 | 2024-08-20 | Rohr, Inc. | Substrate perforation system and method using beamlets |
KR20210141870A (ko) | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 웨이퍼 처리 장치 및 이를 이용한 반도체 소자 제조 방법 |
KR20230020498A (ko) * | 2020-06-04 | 2023-02-10 | 코닝 인코포레이티드 | 수정된 펄스 버스트 프로파일을 사용하여 투명 작업편을 레이저 처리하는 방법 |
CN111822886B (zh) * | 2020-06-11 | 2022-11-22 | 华东师范大学重庆研究院 | 一种微流控芯片微通道的多焦点超快激光制备装置及方法 |
US12006245B2 (en) * | 2020-09-11 | 2024-06-11 | Corning Incorporated | Laser forming non-square edges in transparent workpieces using low intensity airy beams |
JP7170694B2 (ja) * | 2020-09-11 | 2022-11-14 | ソフトバンク株式会社 | 顧客管理装置、通信システム、プログラム及び通信用表示名の管理方法 |
DE102020126231A1 (de) | 2020-10-07 | 2022-04-07 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren und Maschine zum Schneiden und Entnehmen von Werkstückteilen aus einem plattenförmigen Material |
CN112404705A (zh) * | 2020-10-30 | 2021-02-26 | 山东师范大学 | 一种飞秒激光微纳加工装置及其使用方法与应用 |
DE102020132700A1 (de) | 2020-12-08 | 2022-06-09 | Trumpf Laser- Und Systemtechnik Gmbh | Hochenergieglasschneiden |
DE102020134197A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
DE102020134198A1 (de) | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
CN112589286B (zh) * | 2020-12-21 | 2022-05-27 | 天津长荣科技集团股份有限公司 | 一种快速添加激光模板的方法及装置 |
CN112723733B (zh) * | 2020-12-22 | 2022-12-02 | 武汉锐科光纤激光技术股份有限公司 | 用于玻璃管切割的激光切割装置 |
CN113228310A (zh) * | 2020-12-30 | 2021-08-06 | 泉州三安半导体科技有限公司 | 一种半导体发光元件及其制备方法 |
DE102021100675B4 (de) * | 2021-01-14 | 2022-08-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zum Zerteilen eines transparenten Werkstücks |
DE102021101598A1 (de) | 2021-01-26 | 2022-07-28 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Laserbearbeiten eines Werkstücks |
US20220267200A1 (en) * | 2021-02-19 | 2022-08-25 | Incom, Inc. | Glass structures and fabrication methods using laser induced deep etching |
CN113146051B (zh) * | 2021-04-23 | 2022-05-13 | 吉林大学 | 一种高灵活性的非晶合金表面大面积微结构制备方法 |
CN115401337B (zh) * | 2021-05-28 | 2024-08-30 | 大族激光科技产业集团股份有限公司 | 基于超快激光的陶瓷基板划片加工方法及系统 |
US20220399394A1 (en) * | 2021-06-11 | 2022-12-15 | Raytheon Company | Thin film obscurant for microelectronics |
US12091349B2 (en) | 2021-06-30 | 2024-09-17 | Applied Materials, Inc. | Laser dicing glass wafers using advanced laser sources |
NL2029054B1 (en) * | 2021-07-28 | 2023-02-02 | Corning Inc | Phase modified quasi-non-diffracting laser beams for simultaneous high angle laser processing of transparent workpieces |
WO2023009331A1 (en) * | 2021-07-28 | 2023-02-02 | Corning Incorporated | Phase modified quasi-non-diffracting laser beams for simultaneous high angle laser processing of transparent workpieces |
CN113732511B (zh) * | 2021-08-30 | 2023-01-06 | 中国科学院西安光学精密机械研究所 | 光纤表面包层微纳结构飞秒激光加工方法及装置 |
US20230116921A1 (en) * | 2021-10-15 | 2023-04-20 | Alcon Inc. | Dynamic laser pulse control |
US11999013B2 (en) | 2021-12-29 | 2024-06-04 | PlasmaTex, LLC | Pulsed laser processing of medical devices |
CN118648199A (zh) * | 2022-03-02 | 2024-09-13 | 极光先进雷射株式会社 | 激光装置、谱线宽度的计测方法和电子器件的制造方法 |
CN116237654B (zh) * | 2023-02-22 | 2023-07-21 | 武汉荣科激光自动化设备有限公司 | 一种激光加工设备的智能控制方法 |
CN116674108B (zh) * | 2023-07-07 | 2024-05-28 | 安徽华晟新材料有限公司 | 一种晶棒切割中出现断线处理的方法 |
CN117139870B (zh) * | 2023-10-23 | 2024-06-21 | 深圳铭创智能装备有限公司 | 一种MiniLED遮光膜激光修切方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000061677A (ja) * | 1998-08-26 | 2000-02-29 | Samsung Electronics Co Ltd | レ―ザ切断装置および切断方法 |
US20030006221A1 (en) * | 2001-07-06 | 2003-01-09 | Minghui Hong | Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
US7303977B2 (en) * | 2004-11-10 | 2007-12-04 | Intel Corporation | Laser micromachining method |
US20070298529A1 (en) * | 2006-05-31 | 2007-12-27 | Toyoda Gosei, Co., Ltd. | Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
CN101663125A (zh) * | 2007-04-05 | 2010-03-03 | 彩覇阳光株式会社 | 激光加工方法及切割方法以及具有多层基板的结构体的分割方法 |
CN103079747A (zh) * | 2010-07-12 | 2013-05-01 | 费拉瑟美国有限公司 | 由激光成丝作用进行材料处理的方法 |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58151085A (ja) * | 1982-03-03 | 1983-09-08 | Toshiba Corp | 半導体レ−ザ装置の製造法 |
US5107510A (en) | 1989-09-29 | 1992-04-21 | Seguin Herb J J | Apparatus and method for burst-mode operation of a pulsed laser |
US5291008A (en) * | 1992-01-10 | 1994-03-01 | Welch Allyn, Inc. | Optical assembly and apparatus employing same using an aspherical lens and an aperture stop |
JP2724993B2 (ja) | 1995-08-31 | 1998-03-09 | 株式会社小松製作所 | レーザ加工装置およびレーザ装置 |
US6154593A (en) | 1996-03-18 | 2000-11-28 | Japan Science & Technology Corp | Optical device and formation of optical waveguide using light-induced effect on refractive index |
US8005314B2 (en) * | 2005-12-09 | 2011-08-23 | Amnis Corporation | Extended depth of field imaging for high speed object analysis |
US6552301B2 (en) | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
CA2332154C (en) | 2000-01-25 | 2009-09-15 | Peter R. Herman | Burst-ultrafast laser machining method |
US7253032B2 (en) * | 2001-04-20 | 2007-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Method of flattening a crystallized semiconductor film surface by using a plate |
CN100355031C (zh) * | 2002-03-12 | 2007-12-12 | 浜松光子学株式会社 | 基板的分割方法 |
US7749867B2 (en) * | 2002-03-12 | 2010-07-06 | Hamamatsu Photonics K.K. | Method of cutting processed object |
DE10213044B3 (de) * | 2002-03-22 | 2004-01-29 | Freie Universität Berlin, Körperschaft des öffentlichen Rechts | Verfahren zur Materialbearbeitung und/oder Materialanalyse mit Lasern |
US20040017428A1 (en) | 2002-07-25 | 2004-01-29 | John Cronin | Method of using a sacrificial layer to create smooth exit holes using a laser drilling system |
US7168935B1 (en) * | 2002-08-02 | 2007-01-30 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solid freeform fabrication apparatus and methods |
GB0302590D0 (en) | 2003-02-05 | 2003-03-12 | Koninkl Philips Electronics Nv | Communications systems and methods |
JP4357944B2 (ja) * | 2003-12-05 | 2009-11-04 | トヨタ自動車株式会社 | 固体レーザ加工装置およびレーザ溶接方法 |
US7486705B2 (en) * | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
JP4418282B2 (ja) * | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
JP4781661B2 (ja) * | 2004-11-12 | 2011-09-28 | 浜松ホトニクス株式会社 | レーザ加工方法 |
US20060207976A1 (en) | 2005-01-21 | 2006-09-21 | Bovatsek James M | Laser material micromachining with green femtosecond pulses |
US20070031056A1 (en) * | 2005-08-02 | 2007-02-08 | Perz Cynthia B | System for and method of focusing in automated microscope systems |
DE102005039833A1 (de) | 2005-08-22 | 2007-03-01 | Rowiak Gmbh | Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen |
US7626138B2 (en) | 2005-09-08 | 2009-12-01 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
US7838331B2 (en) * | 2005-11-16 | 2010-11-23 | Denso Corporation | Method for dicing semiconductor substrate |
US20070117287A1 (en) * | 2005-11-23 | 2007-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus |
US8835802B2 (en) * | 2006-01-24 | 2014-09-16 | Stephen C. Baer | Cleaving wafers from silicon crystals |
JP5221007B2 (ja) * | 2006-05-31 | 2013-06-26 | アイシン精機株式会社 | 発光ダイオードチップ及びウェハ分割加工方法 |
JP5162163B2 (ja) * | 2007-06-27 | 2013-03-13 | 株式会社ディスコ | ウェーハのレーザ加工方法 |
KR100876502B1 (ko) * | 2007-09-21 | 2008-12-31 | 한국정보통신대학교 산학협력단 | 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법 |
US20090190108A1 (en) * | 2008-01-30 | 2009-07-30 | Toshiba America Electronic Components, Inc. | Method and system for leveling topography of semiconductor chip surface |
WO2010067042A1 (en) | 2008-12-13 | 2010-06-17 | M-Solv Limited | Method and apparatus for laser machining relatively narrow and relatively wide structures |
WO2010116917A1 (ja) * | 2009-04-07 | 2010-10-14 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
US20100279067A1 (en) * | 2009-04-30 | 2010-11-04 | Robert Sabia | Glass sheet having enhanced edge strength |
JP2011000631A (ja) * | 2009-06-22 | 2011-01-06 | Seiko Epson Corp | レーザー加工方法およびレーザー加工装置 |
US20120234807A1 (en) * | 2009-12-07 | 2012-09-20 | J.P. Sercel Associates Inc. | Laser scribing with extended depth affectation into a workplace |
US8450638B2 (en) * | 2010-01-28 | 2013-05-28 | Seishin Trading Co., Ltd. | Laser scribing method and apparatus |
JP2011187479A (ja) * | 2010-03-04 | 2011-09-22 | Disco Corp | ウエーハの加工方法 |
JP5528904B2 (ja) * | 2010-05-20 | 2014-06-25 | 株式会社ディスコ | サファイアウェーハの分割方法 |
JP2011248241A (ja) * | 2010-05-28 | 2011-12-08 | Disco Abrasive Syst Ltd | 板状物の加工方法及びレーザー加工装置 |
JP5476476B2 (ja) * | 2010-07-26 | 2014-04-23 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP5770446B2 (ja) * | 2010-09-30 | 2015-08-26 | 株式会社ディスコ | 分割方法 |
US8933367B2 (en) | 2011-02-09 | 2015-01-13 | Sumitomo Electric Industries, Ltd. | Laser processing method |
KR20130103623A (ko) | 2011-02-10 | 2013-09-23 | 신에츠 폴리머 가부시키가이샤 | 단결정 기판의 제조 방법 및 내부 개질층 형성 단결정 부재의 제조 방법 |
JP5789802B2 (ja) * | 2011-03-22 | 2015-10-07 | 株式会社ソシオネクスト | 半導体チップの製造方法 |
KR101285717B1 (ko) * | 2011-05-12 | 2013-07-12 | 한국기계연구원 | 극초단 펄스 레이저를 응용한 고종횡비 미세 형상 가공 장치 |
JP2012240107A (ja) * | 2011-05-23 | 2012-12-10 | Hamamatsu Photonics Kk | レーザ加工方法 |
JP5938416B2 (ja) | 2011-11-04 | 2016-06-22 | 株式会社フジクラ | 微細孔を備えた基板の製造方法 |
JP5930811B2 (ja) * | 2011-11-18 | 2016-06-08 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP2013133259A (ja) * | 2011-12-27 | 2013-07-08 | Fujikura Ltd | 微細孔を備えた基板及び該基板の製造方法 |
JP5980504B2 (ja) * | 2011-12-27 | 2016-08-31 | 株式会社ディスコ | ウエーハの加工方法およびレーザー加工装置 |
JP2013136071A (ja) * | 2011-12-28 | 2013-07-11 | Mitsuboshi Diamond Industrial Co Ltd | 被加工物の分断方法および光学素子パターン付き基板の分断方法 |
JP5727433B2 (ja) * | 2012-09-04 | 2015-06-03 | イムラ アメリカ インコーポレイテッド | 超短パルスレーザでの透明材料処理 |
JP2013031880A (ja) * | 2012-09-12 | 2013-02-14 | Hamamatsu Photonics Kk | レーザ加工装置およびレーザ加工方法 |
EP2754524B1 (de) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2964416B1 (de) * | 2013-04-04 | 2023-07-19 | LPKF Laser & Electronics SE | Verfahren zum trennen eines substrates |
DE102020132700A1 (de) * | 2020-12-08 | 2022-06-09 | Trumpf Laser- Und Systemtechnik Gmbh | Hochenergieglasschneiden |
-
2014
- 2014-07-21 US US14/336,819 patent/US9102007B2/en active Active
- 2014-07-21 US US14/336,912 patent/US20150034613A1/en not_active Abandoned
- 2014-07-25 CA CA2857820A patent/CA2857820C/en active Active
- 2014-07-25 CA CA2857814A patent/CA2857814C/en active Active
- 2014-07-30 SG SG10201404459UA patent/SG10201404459UA/en unknown
- 2014-07-30 SG SG10201404455QA patent/SG10201404455QA/en unknown
- 2014-07-30 TW TW106118930A patent/TWI653115B/zh active
- 2014-07-30 TW TW103126074A patent/TWI520804B/zh active
- 2014-07-30 TW TW103126070A patent/TWI592244B/zh active
- 2014-07-31 EP EP14179403.2A patent/EP2859983B1/en active Active
- 2014-07-31 MY MYPI2014702102A patent/MY177289A/en unknown
- 2014-07-31 EP EP14179404.0A patent/EP2859984B1/en active Active
- 2014-07-31 JP JP2014156274A patent/JP2015030040A/ja active Pending
- 2014-07-31 EP EP18160781.3A patent/EP3366413A1/en not_active Withdrawn
- 2014-07-31 JP JP2014156289A patent/JP6526396B2/ja active Active
- 2014-08-04 KR KR1020140099767A patent/KR20150016176A/ko active Application Filing
- 2014-08-04 KR KR1020140099768A patent/KR101753184B1/ko active IP Right Grant
- 2014-08-04 CN CN201410380147.8A patent/CN104339081B/zh active Active
- 2014-08-04 CN CN201410380104.XA patent/CN104339088B/zh active Active
-
2015
- 2015-03-05 HK HK15102226.5A patent/HK1205715A1/zh not_active IP Right Cessation
- 2015-03-05 HK HK15102225.6A patent/HK1202094A1/zh unknown
-
2016
- 2016-12-28 KR KR1020160181181A patent/KR101869796B1/ko active IP Right Grant
-
2017
- 2017-05-31 JP JP2017108217A patent/JP6505773B2/ja active Active
- 2017-05-31 JP JP2017108510A patent/JP6585120B2/ja active Active
- 2017-06-27 KR KR1020170081046A patent/KR20170081145A/ko active Search and Examination
-
2018
- 2018-06-15 KR KR1020180068708A patent/KR101998761B1/ko active IP Right Grant
-
2020
- 2020-06-24 US US16/911,147 patent/US20200324368A1/en not_active Abandoned
-
2024
- 2024-02-14 US US18/441,493 patent/US20240261893A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000061677A (ja) * | 1998-08-26 | 2000-02-29 | Samsung Electronics Co Ltd | レ―ザ切断装置および切断方法 |
US20030006221A1 (en) * | 2001-07-06 | 2003-01-09 | Minghui Hong | Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
US7303977B2 (en) * | 2004-11-10 | 2007-12-04 | Intel Corporation | Laser micromachining method |
US20070298529A1 (en) * | 2006-05-31 | 2007-12-27 | Toyoda Gosei, Co., Ltd. | Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
CN101663125A (zh) * | 2007-04-05 | 2010-03-03 | 彩覇阳光株式会社 | 激光加工方法及切割方法以及具有多层基板的结构体的分割方法 |
CN103079747A (zh) * | 2010-07-12 | 2013-05-01 | 费拉瑟美国有限公司 | 由激光成丝作用进行材料处理的方法 |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107922237A (zh) * | 2015-03-24 | 2018-04-17 | 康宁股份有限公司 | 显示器玻璃组合物的激光切割和加工 |
CN107921580A (zh) * | 2015-06-29 | 2018-04-17 | 肖特股份有限公司 | 一种借助于激光加工在多相透明工件之中或之上产生修改的方法;多相复合材料 |
CN107921580B (zh) * | 2015-06-29 | 2019-09-27 | 肖特股份有限公司 | 一种借助于激光加工在多相透明工件之中或之上产生修改的方法;多相复合材料 |
CN107402151B (zh) * | 2017-07-31 | 2020-06-05 | 水利部交通运输部国家能源局南京水利科学研究院 | 一种超声激励控制脆性材料表面及贯穿裂纹尺寸的方法 |
CN107402151A (zh) * | 2017-07-31 | 2017-11-28 | 水利部交通运输部国家能源局南京水利科学研究院 | 一种超声激励控制脆性材料表面及贯穿裂纹尺寸的方法 |
CN110579935A (zh) * | 2017-08-08 | 2019-12-17 | 广东弘景光电科技股份有限公司 | 生成与待测摄像头模组对应的测试标板的方法及系统 |
US11800760B2 (en) | 2017-11-15 | 2023-10-24 | Samsung Display Co., Ltd. | Display device having reduced occupied cell seal and realized narrow bezel structure |
CN109786584B (zh) * | 2017-11-15 | 2023-09-26 | 三星显示有限公司 | 显示装置及制造显示装置的方法 |
CN109786584A (zh) * | 2017-11-15 | 2019-05-21 | 三星显示有限公司 | 显示装置及制造显示装置的方法 |
CN110220469B (zh) * | 2018-03-01 | 2022-04-05 | 株式会社三丰 | 用于透明管的内径测量的方法和设备 |
CN110220469A (zh) * | 2018-03-01 | 2019-09-10 | 株式会社三丰 | 用于透明管的内径测量的方法和设备 |
CN111886107A (zh) * | 2018-03-19 | 2020-11-03 | 美敦力公司 | 使用能量脉冲的表面纹理化 |
US11548092B2 (en) | 2018-03-19 | 2023-01-10 | Medtronic, Inc. | Surface texturing using energy pulses |
US11969821B2 (en) | 2018-03-19 | 2024-04-30 | Medtronic, Inc. | Surface texturing using energy pulses |
CN108549160A (zh) * | 2018-04-20 | 2018-09-18 | 北京工业大学 | 一种连续调整激光成丝长度的装置及方法 |
CN109270764B (zh) * | 2018-11-26 | 2021-01-19 | 西安交通大学 | 基于反馈迭代波前整形技术飞秒激光成丝调控装置与方法 |
CN109270764A (zh) * | 2018-11-26 | 2019-01-25 | 西安交通大学 | 基于反馈迭代波前整形技术飞秒激光成丝调控装置与方法 |
CN109373243A (zh) * | 2018-11-28 | 2019-02-22 | 江苏集萃有机光电技术研究所有限公司 | 一种oled灯片和灯具 |
CN109373243B (zh) * | 2018-11-28 | 2023-11-14 | 江苏集萃有机光电技术研究所有限公司 | 一种oled灯片和灯具 |
CN109693032A (zh) * | 2019-02-27 | 2019-04-30 | 大族激光科技产业集团股份有限公司 | 激光切割方法和装置 |
US11320790B2 (en) | 2019-03-19 | 2022-05-03 | Comadur Sa | Method for marking a sapphire watch crystal |
CN111716025A (zh) * | 2019-03-19 | 2020-09-29 | 柯马杜股份有限公司 | 用于为蓝宝石表镜加标记的方法 |
CN110788500B (zh) * | 2019-10-28 | 2022-02-01 | 北京航天控制仪器研究所 | 一种硬脆材料复杂构件飞秒激光精密成型加工系统 |
CN110788500A (zh) * | 2019-10-28 | 2020-02-14 | 北京航天控制仪器研究所 | 一种硬脆材料复杂构件飞秒激光精密成型加工系统 |
CN112775539A (zh) * | 2019-11-07 | 2021-05-11 | 大族激光科技产业集团股份有限公司 | 激光加工方法及装置 |
CN112798574A (zh) * | 2020-12-19 | 2021-05-14 | 北京工业大学 | 一种超快激光成丝对大气组分的远程实时探测系统 |
CN112775569A (zh) * | 2020-12-24 | 2021-05-11 | 苏州禾弘电子科技有限公司 | 一种电路板的激光钻孔方法 |
RU2806353C1 (ru) * | 2022-08-19 | 2023-10-31 | Владимир Николаевич Токарев | Способ и устройство для обработки хрупких прозрачных и полупрозрачных материалов |
WO2024039266A3 (ru) * | 2022-08-19 | 2024-04-11 | Владимир Николаевич ТОКАРЕВ | Способ и устройство для обработки хрупких прозрачных и полупрозрачных материалов |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104339088B (zh) | 用于在透明材料内执行激光成丝的系统 | |
US10010971B1 (en) | Method and apparatus for performing laser curved filamentation within transparent materials | |
JP5089735B2 (ja) | レーザ加工装置 | |
JP5378314B2 (ja) | レーザ切断方法 | |
JP2009226457A (ja) | レーザ加工方法 | |
JP5613809B2 (ja) | レーザ切断方法およびレーザ加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: GILBERT ALBELO Inventor before: S * H * Husseini Inventor before: Luo Zhengen Inventor before: G*Alberto |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HOSSEINI S. ABBAS LUO ZHENGEN GILBERT ALBELO TO: HOSSEINI S. ABBAS |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1202094 Country of ref document: HK |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: michigan Patentee after: Roven - Sina Technology Co., Ltd. Address before: michigan Patentee before: ROFIN-SINAR TECHNOLOGIES INC. |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1202094 Country of ref document: HK |