CN104332454B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN104332454B
CN104332454B CN201410486030.8A CN201410486030A CN104332454B CN 104332454 B CN104332454 B CN 104332454B CN 201410486030 A CN201410486030 A CN 201410486030A CN 104332454 B CN104332454 B CN 104332454B
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CN
China
Prior art keywords
pattern
heat dissipation
chip
lead
semiconductor device
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CN201410486030.8A
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English (en)
Chinese (zh)
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CN104332454A (zh
Inventor
江川秀范
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication date
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Publication of CN104332454A publication Critical patent/CN104332454A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201410486030.8A 2009-07-15 2010-06-30 半导体装置 Active CN104332454B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009166975A JP5325684B2 (ja) 2009-07-15 2009-07-15 半導体装置
JP2009-166975 2009-07-15
CN201010222675.2A CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201010222675.2A Division CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Publications (2)

Publication Number Publication Date
CN104332454A CN104332454A (zh) 2015-02-04
CN104332454B true CN104332454B (zh) 2017-04-12

Family

ID=43464699

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置

Country Status (3)

Country Link
US (5) US8384230B2 (https=)
JP (1) JP5325684B2 (https=)
CN (4) CN104332454B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
JP5405679B2 (ja) * 2013-01-25 2014-02-05 ルネサスエレクトロニクス株式会社 半導体装置
JP2016115751A (ja) * 2014-12-12 2016-06-23 ラピスセミコンダクタ株式会社 半導体パッケージ
WO2017195605A1 (ja) * 2016-05-10 2017-11-16 オリンパス株式会社 電子回路ユニット、撮像ユニット、撮像モジュールおよび内視鏡
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR102628847B1 (ko) * 2019-06-12 2024-01-25 삼성디스플레이 주식회사 디스플레이 장치
JP6973861B2 (ja) * 2019-08-28 2021-12-01 Ｎｅｃプラットフォームズ株式会社 半導体装置、電子機器及び半導体装置の製造方法
TWI873949B (zh) * 2022-11-11 2025-02-21 財團法人工業技術研究院 模塑電子組件
JP2024169133A (ja) * 2023-05-25 2024-12-05 オムロン株式会社 基板及びモジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package
CN1514422A (zh) * 2002-08-30 2004-07-21 ������������ʽ���� 电子模块及其制造方法、驱动方法、电子仪器

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484625A (en) * 1987-09-28 1989-03-29 Toshiba Corp Semiconductor integrated circuit device using film carrier
JP2000174075A (ja) 1991-09-20 2000-06-23 Hitachi Ltd 液晶ドライバ用テ―プキャリアパッケ―ジ及び液晶表示装置
JPH06252285A (ja) * 1993-02-24 1994-09-09 Fuji Xerox Co Ltd 回路基板
US6683594B1 (en) * 1995-04-20 2004-01-27 Canon Kabushiki Kaisha Display apparatus and assembly of its driving circuit
DE69629982T2 (de) 1995-06-30 2004-07-22 Eastman Kodak Co. Zoomobjektiv ###
JP3524549B1 (ja) * 1996-03-26 2004-05-10 キヤノン株式会社 接続構造体及び表示装置
US6497477B1 (en) * 1998-11-04 2002-12-24 Matsushita Electric Industrial Co., Ltd. Ink-jet head mounted with a driver IC, method for manufacturing thereof and ink-jet printer having the same
WO2000054323A1 (en) 1999-03-11 2000-09-14 Seiko Epson Corporation Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device
JP3666318B2 (ja) * 1999-09-27 2005-06-29 セイコーエプソン株式会社 電気光学装置及びそれを用いた電子機器並びに表示駆動ｉｃ
JP2002093861A (ja) 2000-09-12 2002-03-29 Mitsui Mining & Smelting Co Ltd ２メタルｔａｂ及び両面ｃｓｐ、ｂｇａテープ、並びにその製造方法
JP3536023B2 (ja) * 2000-10-13 2004-06-07 シャープ株式会社 Ｃｏｆ用テープキャリアおよびこれを用いて製造されるｃｏｆ構造の半導体装置
JP2003068804A (ja) 2001-08-22 2003-03-07 Mitsui Mining & Smelting Co Ltd 電子部品実装用基板
JP4176979B2 (ja) * 2001-09-27 2008-11-05 パイオニア株式会社 フラットパネル型表示装置
JP4776861B2 (ja) * 2002-09-26 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
JP2004207296A (ja) 2002-12-24 2004-07-22 Seiko Epson Corp 半導体装置及びその製造方法
JP2004296998A (ja) * 2003-03-28 2004-10-21 Matsushita Electric Ind Co Ltd 半導体装置
JP4689202B2 (ja) * 2004-07-07 2011-05-25 ルネサスエレクトロニクス株式会社 駆動装置及び表示装置
JP4573103B2 (ja) 2004-11-24 2010-11-04 Ｏｋｉセミコンダクタ株式会社 チップオンフィルム用フィルムキャリアおよびそれを用いた半導体装置
KR100632807B1 (ko) * 2004-11-26 2006-10-16 삼성전자주식회사 반도체 칩 및 그를 포함하는 탭 패키지
JP4485460B2 (ja) * 2004-12-16 2010-06-23 三井金属鉱業株式会社 フレキシブルプリント配線板
JP2006269496A (ja) * 2005-03-22 2006-10-05 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基板、および半導体装置
JP2006286837A (ja) * 2005-03-31 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄ装置
KR100652519B1 (ko) 2005-07-18 2006-12-01 삼성전자주식회사 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
JP4781097B2 (ja) 2005-12-05 2011-09-28 ルネサスエレクトロニクス株式会社 テープキャリアパッケージ及びそれを搭載した表示装置
KR100987479B1 (ko) * 2005-12-19 2010-10-13 삼성전자주식회사 반도체 칩 및 이를 이용한 반도체 칩 패키지
KR100681398B1 (ko) * 2005-12-29 2007-02-15 삼성전자주식회사 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지
KR100729537B1 (ko) 2006-02-28 2007-06-18 주식회사 탑 엔지니어링 본딩 장비의 테잎 피딩 방법
JP4806313B2 (ja) * 2006-08-18 2011-11-02 Ｎｅｃ液晶テクノロジー株式会社 テープキャリア、液晶表示装置用テープキャリア、及び液晶表示装置
JP4283292B2 (ja) 2006-09-08 2009-06-24 シャープ株式会社 半導体装置用テープキャリア、および半導体装置の製造方法
TWI317547B (en) * 2006-10-14 2009-11-21 Chipmos Technologies Inc Substrate with heat-dissipating dummy pattern for semiconductor packages
JP4143666B2 (ja) 2006-12-08 2008-09-03 シャープ株式会社 Ｉｃチップ実装パッケージ、及びこれを備えた画像表示装置
JP5273333B2 (ja) * 2006-12-28 2013-08-28 株式会社ジャパンディスプレイ 表示装置
TWI337402B (en) * 2007-01-03 2011-02-11 Chipmos Technologies Inc Semiconductor packaging substrate improving capability of electrostatic dissipation
JP4185954B2 (ja) 2007-01-19 2008-11-26 シャープ株式会社 フレキシブル基板及び半導体装置
JP2008205142A (ja) * 2007-02-20 2008-09-04 Sumitomo Metal Mining Package Materials Co Ltd Ｃｏｆ用配線基板とその製造方法、並びに半導体装置
JP4378387B2 (ja) 2007-02-27 2009-12-02 Ｏｋｉセミコンダクタ株式会社 半導体パッケージ及びその製造方法
JP4983386B2 (ja) * 2007-05-15 2012-07-25 住友金属鉱山株式会社 Ｃｏｆ用配線基板
US20090020316A1 (en) * 2007-07-19 2009-01-22 Chia-Hui Wu Method of manufacturing chip on film and structure thereof
JP4975584B2 (ja) 2007-10-26 2012-07-11 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法。
JP4344766B2 (ja) * 2007-11-30 2009-10-14 シャープ株式会社 ソースドライバ、ソースドライバの製造方法、および液晶モジュール
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package
CN1514422A (zh) * 2002-08-30 2004-07-21 ������������ʽ���� 电子模块及其制造方法、驱动方法、电子仪器

Also Published As

Publication number Publication date
CN104037156B (zh) 2019-01-11
JP5325684B2 (ja) 2013-10-23
JP2011023528A (ja) 2011-02-03
US20140167258A1 (en) 2014-06-19
US8384230B2 (en) 2013-02-26
CN104037156A (zh) 2014-09-10
CN103500735B (zh) 2015-05-06
HK1199554A1 (zh) 2015-07-03
US20200066611A1 (en) 2020-02-27
US8686574B2 (en) 2014-04-01
US20130147039A1 (en) 2013-06-13
CN104332454A (zh) 2015-02-04
US20150123274A1 (en) 2015-05-07
US11244883B2 (en) 2022-02-08
CN101958295A (zh) 2011-01-26
CN101958295B (zh) 2014-10-01
US20110012265A1 (en) 2011-01-20
US8975762B2 (en) 2015-03-10
CN103500735A (zh) 2014-01-08
HK1204507A1 (en) 2015-11-20

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