CN103765494B - 显示装置及其制造方法 - Google Patents
显示装置及其制造方法 Download PDFInfo
- Publication number
- CN103765494B CN103765494B CN201280041110.1A CN201280041110A CN103765494B CN 103765494 B CN103765494 B CN 103765494B CN 201280041110 A CN201280041110 A CN 201280041110A CN 103765494 B CN103765494 B CN 103765494B
- Authority
- CN
- China
- Prior art keywords
- tft
- active layer
- insulating film
- circuit
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
Landscapes
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011140300 | 2011-06-24 | ||
| JP2011-140300 | 2011-06-24 | ||
| PCT/JP2012/003960 WO2012176422A1 (ja) | 2011-06-24 | 2012-06-18 | 表示装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103765494A CN103765494A (zh) | 2014-04-30 |
| CN103765494B true CN103765494B (zh) | 2016-05-04 |
Family
ID=47422280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280041110.1A Active CN103765494B (zh) | 2011-06-24 | 2012-06-18 | 显示装置及其制造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10177170B2 (enExample) |
| JP (2) | JP6215053B2 (enExample) |
| CN (1) | CN103765494B (enExample) |
| CA (1) | CA2845768A1 (enExample) |
| SG (2) | SG10201605237SA (enExample) |
| WO (1) | WO2012176422A1 (enExample) |
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| US8354674B2 (en) * | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| US8969154B2 (en) * | 2011-08-23 | 2015-03-03 | Micron Technology, Inc. | Methods for fabricating semiconductor device structures and arrays of vertical transistor devices |
| US9818765B2 (en) | 2013-08-26 | 2017-11-14 | Apple Inc. | Displays with silicon and semiconducting oxide thin-film transistors |
| US9412799B2 (en) | 2013-08-26 | 2016-08-09 | Apple Inc. | Display driver circuitry for liquid crystal displays with semiconducting-oxide thin-film transistors |
| WO2015052991A1 (ja) * | 2013-10-09 | 2015-04-16 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US9228717B2 (en) * | 2013-11-28 | 2016-01-05 | Lg Display Co., Ltd. | Quantum rod compound including electron acceptor and quantum rod luminescent display device including the same |
| CN103730485B (zh) * | 2013-12-27 | 2016-09-07 | 京东方科技集团股份有限公司 | 双面显示的oled阵列基板及其制备方法、显示装置 |
| EP2911200B1 (en) | 2014-02-24 | 2020-06-03 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US10985196B2 (en) | 2014-02-24 | 2021-04-20 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US10325937B2 (en) | 2014-02-24 | 2019-06-18 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US10186528B2 (en) | 2014-02-24 | 2019-01-22 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| KR102454382B1 (ko) * | 2014-02-24 | 2022-10-18 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| US10903246B2 (en) | 2014-02-24 | 2021-01-26 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US9214508B2 (en) | 2014-02-24 | 2015-12-15 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
| US9691799B2 (en) | 2014-02-24 | 2017-06-27 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| KR102401432B1 (ko) * | 2014-02-24 | 2022-05-26 | 엘지디스플레이 주식회사 | 표시장치 |
| US9721973B2 (en) | 2014-02-24 | 2017-08-01 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
| US9490276B2 (en) * | 2014-02-25 | 2016-11-08 | Lg Display Co., Ltd. | Display backplane and method of fabricating the same |
| US9449994B2 (en) | 2014-02-25 | 2016-09-20 | Lg Display Co., Ltd. | Display backplane having multiple types of thin-film-transistors |
| WO2016108473A1 (en) * | 2014-12-31 | 2016-07-07 | LG Display Co.,Ltd. | Display backplane having multiple types of thin-film-transistors |
| US10074576B2 (en) * | 2014-02-28 | 2018-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| US9324747B2 (en) * | 2014-03-13 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| US10050015B2 (en) * | 2014-03-27 | 2018-08-14 | Intel Corporation | Multi-device flexible electronics system on a chip (SOC) process integration |
| JP6518890B2 (ja) * | 2014-03-31 | 2019-05-29 | 株式会社Joled | 表示装置および電子機器 |
| US9543370B2 (en) | 2014-09-24 | 2017-01-10 | Apple Inc. | Silicon and semiconducting oxide thin-film transistor displays |
| JP6570417B2 (ja) * | 2014-10-24 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
| CN104377167B (zh) * | 2014-11-13 | 2017-04-05 | 京东方科技集团股份有限公司 | 薄膜晶体管阵列基板及其制作方法、显示面板和显示装置 |
| CN104409514A (zh) * | 2014-11-21 | 2015-03-11 | 京东方科技集团股份有限公司 | 一种薄膜晶体管结构、其制作方法及相关装置 |
| CN104538401B (zh) * | 2014-12-23 | 2017-05-03 | 深圳市华星光电技术有限公司 | Tft基板结构 |
| EP3241241B1 (en) * | 2014-12-31 | 2022-06-08 | LG Display Co., Ltd. | Display backplane having multiple types of thin-film-transistors |
| KR101658716B1 (ko) * | 2014-12-31 | 2016-09-30 | 엘지디스플레이 주식회사 | 표시 장치 |
| US9685469B2 (en) * | 2015-04-03 | 2017-06-20 | Apple Inc. | Display with semiconducting oxide and polysilicon transistors |
| TW201704831A (zh) * | 2015-07-31 | 2017-02-01 | 凌巨科技股份有限公司 | 薄膜電晶體結構 |
| KR102178472B1 (ko) * | 2015-10-07 | 2020-11-16 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| KR102179378B1 (ko) * | 2015-10-07 | 2020-11-18 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| KR102179379B1 (ko) * | 2015-10-07 | 2020-11-18 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| CN105765709B (zh) * | 2015-10-29 | 2018-02-02 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示面板、显示装置 |
| US10038402B2 (en) | 2015-10-30 | 2018-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| KR102519942B1 (ko) * | 2015-11-26 | 2023-04-11 | 엘지디스플레이 주식회사 | 유기발광 다이오드 표시장치용 박막 트랜지스터 기판 |
| US9818344B2 (en) | 2015-12-04 | 2017-11-14 | Apple Inc. | Display with light-emitting diodes |
| CN105552085B (zh) * | 2015-12-25 | 2019-04-30 | 昆山国显光电有限公司 | 一种像素驱动电路及其制备方法 |
| CN108496244B (zh) * | 2016-01-27 | 2021-04-13 | 夏普株式会社 | 半导体装置及其制造方法 |
| CN108701719A (zh) * | 2016-02-22 | 2018-10-23 | 夏普株式会社 | 半导体装置和半导体装置的制造方法 |
| JP6673731B2 (ja) | 2016-03-23 | 2020-03-25 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| US10468434B2 (en) * | 2016-04-08 | 2019-11-05 | Innolux Corporation | Hybrid thin film transistor structure, display device, and method of making the same |
| JP6668160B2 (ja) * | 2016-05-06 | 2020-03-18 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
| TWI579926B (zh) * | 2016-05-25 | 2017-04-21 | 友達光電股份有限公司 | 主動元件陣列基板 |
| JP6727952B2 (ja) * | 2016-06-24 | 2020-07-22 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102458660B1 (ko) | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| JP2018036290A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102731378B1 (ko) * | 2016-08-31 | 2024-11-15 | 엘지디스플레이 주식회사 | 멀티 타입의 박막 트랜지스터를 포함하는 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| WO2018043426A1 (ja) * | 2016-09-05 | 2018-03-08 | シャープ株式会社 | アクティブマトリクス基板およびその製造方法 |
| JP6832656B2 (ja) | 2016-09-14 | 2021-02-24 | 株式会社ジャパンディスプレイ | 半導体装置の製造方法 |
| JP2018049227A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社半導体エネルギー研究所 | 表示装置および電子機器 |
| KR102541552B1 (ko) | 2016-11-30 | 2023-06-07 | 엘지디스플레이 주식회사 | 트랜지스터 기판 및 이를 이용한 유기발광표시패널과 유기발광표시장치 |
| JP6706570B2 (ja) * | 2016-12-05 | 2020-06-10 | 株式会社Joled | 半導体装置、半導体装置の製造方法および表示装置 |
| KR102733082B1 (ko) * | 2016-12-30 | 2024-11-22 | 엘지디스플레이 주식회사 | 구동 박막 트랜지스터 및 이를 이용한 유기 발광 표시 장치 |
| KR102736793B1 (ko) | 2017-01-05 | 2024-12-04 | 삼성디스플레이 주식회사 | 주사 구동부 및 이를 포함하는 표시 장치 |
| WO2018179121A1 (ja) * | 2017-03-29 | 2018-10-04 | シャープ株式会社 | 半導体装置および半導体装置の製造方法 |
| CN106952928B (zh) * | 2017-03-30 | 2018-10-23 | 深圳市华星光电技术有限公司 | 一种tft背板的制作方法及tft背板 |
| CN107026178B (zh) * | 2017-04-28 | 2019-03-15 | 深圳市华星光电技术有限公司 | 一种阵列基板、显示装置及其制作方法 |
| JP7250558B2 (ja) | 2019-02-19 | 2023-04-03 | 株式会社ジャパンディスプレイ | 表示装置及び半導体装置 |
| WO2020184533A1 (ja) | 2019-03-11 | 2020-09-17 | 株式会社ジャパンディスプレイ | 表示装置及び半導体装置 |
| JP7464400B2 (ja) * | 2019-06-14 | 2024-04-09 | Tianma Japan株式会社 | 薄膜デバイス |
| CN110289269A (zh) * | 2019-06-26 | 2019-09-27 | 上海天马微电子有限公司 | 一种阵列基板、显示面板和显示装置 |
| CN111081719A (zh) * | 2019-12-12 | 2020-04-28 | 武汉华星光电半导体显示技术有限公司 | 一种阵列基板及其制造方法 |
| CN111179742A (zh) * | 2020-02-12 | 2020-05-19 | 武汉华星光电技术有限公司 | 一种显示面板、栅极驱动电路及电子装置 |
| CN113192986B (zh) * | 2021-04-27 | 2023-01-10 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
| WO2024166389A1 (ja) * | 2023-02-10 | 2024-08-15 | シャープディスプレイテクノロジー株式会社 | 表示装置 |
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| JP2000155313A (ja) * | 2000-01-01 | 2000-06-06 | Semiconductor Energy Lab Co Ltd | アクティブマトリクス型液晶表示装置 |
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| CN101740631A (zh) * | 2008-11-07 | 2010-06-16 | 株式会社半导体能源研究所 | 半导体装置及该半导体装置的制造方法 |
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2012
- 2012-06-18 SG SG10201605237SA patent/SG10201605237SA/en unknown
- 2012-06-18 WO PCT/JP2012/003960 patent/WO2012176422A1/ja not_active Ceased
- 2012-06-18 JP JP2013521441A patent/JP6215053B2/ja active Active
- 2012-06-18 CA CA2845768A patent/CA2845768A1/en not_active Abandoned
- 2012-06-18 SG SG2014013833A patent/SG2014013833A/en unknown
- 2012-06-18 CN CN201280041110.1A patent/CN103765494B/zh active Active
- 2012-06-18 US US14/128,437 patent/US10177170B2/en active Active
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2016
- 2016-06-16 JP JP2016120053A patent/JP2016194703A/ja active Pending
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2018
- 2018-11-29 US US16/203,732 patent/US10438973B2/en active Active
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| JP2000155313A (ja) * | 2000-01-01 | 2000-06-06 | Semiconductor Energy Lab Co Ltd | アクティブマトリクス型液晶表示装置 |
| TW201010084A (en) * | 2008-08-20 | 2010-03-01 | Ricoh Co Ltd | Field effect transistor, display element, image display device, and system |
| CN101740631A (zh) * | 2008-11-07 | 2010-06-16 | 株式会社半导体能源研究所 | 半导体装置及该半导体装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG10201605237SA (en) | 2016-08-30 |
| US10438973B2 (en) | 2019-10-08 |
| JPWO2012176422A1 (ja) | 2015-02-23 |
| JP6215053B2 (ja) | 2017-10-18 |
| CA2845768A1 (en) | 2012-12-27 |
| SG2014013833A (en) | 2014-10-30 |
| US10177170B2 (en) | 2019-01-08 |
| CN103765494A (zh) | 2014-04-30 |
| WO2012176422A1 (ja) | 2012-12-27 |
| US20190096922A1 (en) | 2019-03-28 |
| JP2016194703A (ja) | 2016-11-17 |
| US20140131703A1 (en) | 2014-05-15 |
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