CN102405451A - 用于服务器群冷却系统的冷排封装 - Google Patents
用于服务器群冷却系统的冷排封装 Download PDFInfo
- Publication number
- CN102405451A CN102405451A CN2010800176066A CN201080017606A CN102405451A CN 102405451 A CN102405451 A CN 102405451A CN 2010800176066 A CN2010800176066 A CN 2010800176066A CN 201080017606 A CN201080017606 A CN 201080017606A CN 102405451 A CN102405451 A CN 102405451A
- Authority
- CN
- China
- Prior art keywords
- cooling
- server
- air
- unit
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20618—Air circulating in different modes under control of air guidance flaps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/427,660 | 2009-04-21 | ||
US12/427,660 US8054625B2 (en) | 2009-04-21 | 2009-04-21 | Cold row encapsulation for server farm cooling system |
PCT/US2010/029360 WO2010123662A2 (en) | 2009-04-21 | 2010-03-31 | Cold row encapsulation for server farm cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102405451A true CN102405451A (zh) | 2012-04-04 |
CN102405451B CN102405451B (zh) | 2014-10-22 |
Family
ID=42980110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080017606.6A Expired - Fee Related CN102405451B (zh) | 2009-04-21 | 2010-03-31 | 用于服务器群冷却系统的冷排封装 |
Country Status (11)
Country | Link |
---|---|
US (4) | US8054625B2 (zh) |
EP (2) | EP3171243A1 (zh) |
JP (3) | JP5628292B2 (zh) |
KR (1) | KR101354366B1 (zh) |
CN (1) | CN102405451B (zh) |
HK (1) | HK1166868A1 (zh) |
MY (1) | MY154645A (zh) |
RU (1) | RU2532846C2 (zh) |
SG (1) | SG175740A1 (zh) |
TW (1) | TWI551975B (zh) |
WO (1) | WO2010123662A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110191619A (zh) * | 2019-05-31 | 2019-08-30 | 西安工程大学 | 适用于数据中心间接蒸发自然冷却的模块化送风空调系统 |
Families Citing this family (73)
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US10212858B2 (en) | 2009-04-21 | 2019-02-19 | Excalibur Ip, Llc | Cold row encapsulation for server farm cooling system |
US8054625B2 (en) | 2009-04-21 | 2011-11-08 | Yahoo! Inc. | Cold row encapsulation for server farm cooling system |
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US9204577B2 (en) | 2015-12-01 |
US20100263825A1 (en) | 2010-10-21 |
RU2011142243A (ru) | 2013-05-27 |
US20140301027A1 (en) | 2014-10-09 |
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CN102405451B (zh) | 2014-10-22 |
JP6290361B2 (ja) | 2018-03-07 |
WO2010123662A3 (en) | 2011-01-13 |
TW201042434A (en) | 2010-12-01 |
JP5628292B2 (ja) | 2014-11-19 |
JP6046093B2 (ja) | 2016-12-14 |
RU2532846C2 (ru) | 2014-11-10 |
EP2422259A2 (en) | 2012-02-29 |
TWI551975B (zh) | 2016-10-01 |
JP2015035218A (ja) | 2015-02-19 |
MY154645A (en) | 2015-07-15 |
US8755182B2 (en) | 2014-06-17 |
SG175740A1 (en) | 2011-12-29 |
US20120012278A1 (en) | 2012-01-19 |
US8054625B2 (en) | 2011-11-08 |
HK1166868A1 (zh) | 2012-11-09 |
JP2012524940A (ja) | 2012-10-18 |
JP2017062832A (ja) | 2017-03-30 |
US20160081230A1 (en) | 2016-03-17 |
KR20120010253A (ko) | 2012-02-02 |
EP2422259A4 (en) | 2016-08-24 |
WO2010123662A2 (en) | 2010-10-28 |
KR101354366B1 (ko) | 2014-01-22 |
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