JP6290361B2 - サーバファーム冷却システムのための冷気列封入 - Google Patents
サーバファーム冷却システムのための冷気列封入 Download PDFInfo
- Publication number
- JP6290361B2 JP6290361B2 JP2016223052A JP2016223052A JP6290361B2 JP 6290361 B2 JP6290361 B2 JP 6290361B2 JP 2016223052 A JP2016223052 A JP 2016223052A JP 2016223052 A JP2016223052 A JP 2016223052A JP 6290361 B2 JP6290361 B2 JP 6290361B2
- Authority
- JP
- Japan
- Prior art keywords
- server
- air
- encapsulation structure
- rack
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20618—Air circulating in different modes under control of air guidance flaps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
502 冷却モジュール
504 冷却コイル
506 冷気列封入構造
508 サーバラックポート
510 サーバラック
512 ダンパ
514 天井ダンパ
516 天井排気ファン
518 混合チャンバ
Claims (5)
- 高くされていない床面に取り付けられた冷気列封入構造であって、
1つ以上のサーバを受けるように構成された第1のサーバラック、及び
1つ以上のサーバを受けるように構成された第2のサーバラックであって、前記第1のサーバラックと前記第2のサーバラックの間に内部空間を形成するように前記第1のサーバラックに関して配置された第2のサーバラック、を含む冷気列封入構造と、
ファンユニットと、
空気を冷却し、前記冷却された空気を前記冷気列封入構造内の前記内部空間へと提供するための、前記冷気列封入構造の上部の冷却モジュールと、
前記ファンユニットを前記第2のサーバラックに結合する複数のチューブであって、それを通じた前記内部空間から前記ファンユニットへの前記冷却された空気の流れを可能にする複数のチューブと、
を具備するサーバ冷却システム。 - 前記ファンユニットは、前記ファンユニットの側面に1つ以上のファンを有する、請求項1に記載のサーバ冷却システム。
- 前記冷却モジュールは、前記第1のサーバラックと前記第2のサーバラックを有するエンクロージャの上部に位置し、前記冷却モジュールは、側面に複数のファンを有する、請求項1に記載のサーバ冷却システム。
- それぞれのチューブは、1つ以上のホースを含む請求項1に記載のサーバ冷却システム。
- それぞれのチューブは、柔軟な素材で作られている請求項1に記載のサーバ冷却システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/427,660 | 2009-04-21 | ||
US12/427,660 US8054625B2 (en) | 2009-04-21 | 2009-04-21 | Cold row encapsulation for server farm cooling system |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014201540A Division JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017062832A JP2017062832A (ja) | 2017-03-30 |
JP6290361B2 true JP6290361B2 (ja) | 2018-03-07 |
Family
ID=42980110
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012507236A Expired - Fee Related JP5628292B2 (ja) | 2009-04-21 | 2010-03-31 | サーバファーム冷却システムのための冷気列封入 |
JP2014201540A Expired - Fee Related JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
JP2016223052A Expired - Fee Related JP6290361B2 (ja) | 2009-04-21 | 2016-11-16 | サーバファーム冷却システムのための冷気列封入 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012507236A Expired - Fee Related JP5628292B2 (ja) | 2009-04-21 | 2010-03-31 | サーバファーム冷却システムのための冷気列封入 |
JP2014201540A Expired - Fee Related JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
Country Status (11)
Country | Link |
---|---|
US (4) | US8054625B2 (ja) |
EP (2) | EP2422259A4 (ja) |
JP (3) | JP5628292B2 (ja) |
KR (1) | KR101354366B1 (ja) |
CN (1) | CN102405451B (ja) |
HK (1) | HK1166868A1 (ja) |
MY (1) | MY154645A (ja) |
RU (1) | RU2532846C2 (ja) |
SG (1) | SG175740A1 (ja) |
TW (1) | TWI551975B (ja) |
WO (1) | WO2010123662A2 (ja) |
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US10117362B2 (en) | 2018-10-30 |
JP6046093B2 (ja) | 2016-12-14 |
US20120012278A1 (en) | 2012-01-19 |
EP2422259A2 (en) | 2012-02-29 |
US9204577B2 (en) | 2015-12-01 |
WO2010123662A2 (en) | 2010-10-28 |
SG175740A1 (en) | 2011-12-29 |
JP2015035218A (ja) | 2015-02-19 |
TW201042434A (en) | 2010-12-01 |
KR20120010253A (ko) | 2012-02-02 |
JP2017062832A (ja) | 2017-03-30 |
MY154645A (en) | 2015-07-15 |
JP2012524940A (ja) | 2012-10-18 |
US8054625B2 (en) | 2011-11-08 |
RU2532846C2 (ru) | 2014-11-10 |
US20140301027A1 (en) | 2014-10-09 |
CN102405451A (zh) | 2012-04-04 |
JP5628292B2 (ja) | 2014-11-19 |
EP2422259A4 (en) | 2016-08-24 |
WO2010123662A3 (en) | 2011-01-13 |
US20100263825A1 (en) | 2010-10-21 |
EP3171243A1 (en) | 2017-05-24 |
US8755182B2 (en) | 2014-06-17 |
CN102405451B (zh) | 2014-10-22 |
KR101354366B1 (ko) | 2014-01-22 |
HK1166868A1 (en) | 2012-11-09 |
TWI551975B (zh) | 2016-10-01 |
RU2011142243A (ru) | 2013-05-27 |
US20160081230A1 (en) | 2016-03-17 |
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