JP5208769B2 - 取付装置 - Google Patents
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- JP5208769B2 JP5208769B2 JP2008555400A JP2008555400A JP5208769B2 JP 5208769 B2 JP5208769 B2 JP 5208769B2 JP 2008555400 A JP2008555400 A JP 2008555400A JP 2008555400 A JP2008555400 A JP 2008555400A JP 5208769 B2 JP5208769 B2 JP 5208769B2
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- 238000001816 cooling Methods 0.000 claims description 230
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 239000000463 material Substances 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 10
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
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- 230000002411 adverse Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (81)
- 2つの熱交換器を連結する取付装置において、
a.第1の熱交換器を有するサーバラックと、
b.上記サーバラックに電気的インタフェースを介して接続され、第2の熱交換器をそれぞれ有する1つ以上の電子サーバと、
c.上記第1の熱交換器及び上記第2の熱交換器に連結され、該第1の熱交換器及び該第2の熱交換器に係合力を印加して、該第1の熱交換器と該第2の熱交換器との間にサーマルインタフェースを形成する並進運動機構と、
d.上記並進運動機構に連結された力封込めアセンブリとを備え、
上記力封込めアセンブリは、上記電子サーバに連結されたシャーシガイドと、上記サーバラックに連結されたラックチャネルとを有し、上記シャーシガイドは、ラックチャネルに連結されて、上記電気的インタフェースから上記係合力を分離するインタロックチャネルを形成する取付装置。 - 上記並進運動機構は、上記第2の熱交換器の係合面の全体が上記第1の熱交換器の係合面に対して同時に押し付けられるように、該第1の熱交換器と該第2の熱交換器との間に均一な係合プロファイルを提供することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構は、上記第2の熱交換器の係合面の第1の部分が、該第2の熱交換器の係合面の第2の部分より前に、上記第1の熱交換器の係合面に対して押し付けられるように、該第1の熱交換器と該第2の熱交換器との間に不均一な係合プロファイルを提供することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構に連結され、該並進運動機構を駆動して、上記係合力を印加する駆動機構を更に備える請求項1記載の取付装置。
- 上記並進運動機構及び上記駆動機構は、該駆動機構に印加された駆動力を上記係合力に変換することを特徴とする請求項4記載の取付装置。
- 上記駆動力は、第1のベクトルに沿って加えられ、上記係合力は、該第1のベクトルとは異なる第2のベクトルに沿って加えられることを特徴とする請求項5記載の取付装置。
- 上記並進運動機構は、更に、解放力を印加することを特徴とする請求項4記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器の係合面の全体が、上記第2の熱交換器の係合面から同時に分離されるように、該第1の熱交換器と該第2の熱交換器との間に均一な解放プロファイルを提供することを特徴とする請求項7記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器の係合面の第1の部分が、該第1の熱交換器の係合面の第2の部分より前に、上記第2の熱交換器の係合面から分離されるように、該第1の熱交換器と該第2の熱交換器との間に不均一な解放プロファイルを提供することを特徴とする請求項7記載の取付装置。
- 上記駆動機構は、更に、上記並進運動機構を駆動して、上記解放力を印加することを特徴とする請求項7記載の取付装置。
- 上記駆動機構は、駆動ロッドであることを特徴とする請求項4記載の取付装置。
- 上記駆動機構は、ネジであることを特徴とする請求項4記載の取付装置。
- 上記駆動機構は、電気機械式アクチュエータ、空気圧アクチュエータ及び油圧アクチュエータの1つ以上を有することを特徴とする請求項4記載の取付装置。
- 上記力封込めアセンブリは、上記シャーシガイドと上記電子サーバのシャーシとの間にフロート領域を提供することを特徴とする請求項1記載の取付装置。
- 上記力封込めアセンブリは、フロート領域を有することを特徴とする請求項1記載の取付装置。
- 上記サーバラックの第1の部分は、上記第1の熱交換器を含み、上記電子サーバの第1の部分は、上記第2の熱交換器を含み、上記力封込めアセンブリは、該電子サーバの残りの部分から及び該サーバラックの残りの部分から上記係合力を分離することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構は、上記第2の熱交換器に連結されたスプリングを有し、
上記第1の熱交換器は、上記力封込めアセンブリ内の固定面に連結されていることを特徴とする請求項1記載の取付装置。 - 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結された1つ以上のカムとを有することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結された第1のスプリングと、上記第2の熱交換器に連結された拡張板とを有し、
上記拡張板は、上記第2の熱交換器の並進運動を定義する1つ以上の傾斜プロファイルを有することを特徴とする請求項1記載の取付装置。 - 上記傾斜プロファイルのそれぞれは、同じであることを特徴とする請求項19記載の取付装置。
- 上記傾斜プロファイルの1つ以上は、異なることを特徴とする請求項19記載の取付装置。
- 上記拡張板の1つ以上の傾斜プロファイルに対して滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上の傾斜プロファイルを有する、上記並進運動機構に連結された駆動機構を更に備える請求項19記載の取付装置。
- 上記拡張板の1つ以上の傾斜プロファイルに沿って回転し、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のローラを有する、上記並進運動機構に連結された駆動機構を更に備える請求項19記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結された拡張板とを有し、
上記拡張板は、上記第2の熱交換器の並進運動を定義する1つ以上のスロットプロファイルを有することを特徴とする請求項1記載の取付装置。 - 上記スロットプロファイルのそれぞれは、同じであることを特徴とする請求項24記載の取付装置。
- 上記スロットプロファイルの1つ以上は、異なることを特徴とする請求項24記載の取付装置。
- 少なくとも1つが上記拡張板のスロットプロファイル内に配設され、それぞれが傾斜プロファイル内で滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のピンを有する、上記並進運動機構に連結された駆動機構を更に備える請求項24記載の取付装置。
- 上記並進運動機構は、冷却板の拡張部に連結された1つ以上のカムを有し、
上記各カムは、少なくとも1つが上記拡張板のスロットプロファイル内に配設され、それぞれが傾斜プロファイル内で滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のピンを有することを特徴とする請求項24記載の取付装置。 - 上記1つ以上のカムに連結され、該1つ以上のカムを駆動して、上記係合力を印加する駆動機構を更に備える請求項28記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結されたシザージャッキとを有することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構は、上記第2の熱交換器連結された拡張可能なデバイスを有することを特徴とする請求項1記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結された拡張可能なデバイスを有することを特徴とする請求項1記載の取付装置。
- 上記サーバラックは、1つ以上の第1の熱交換器を含むことを特徴とする請求項1記載の取付装置。
- 上記各電子サーバは、1つ以上の第2の熱交換器を含むことを特徴とする請求項1記載の取付装置。
- 上記力封込めアセンブリは、上記サーバラックから上記係合力を分離することを特徴とする請求項1記載の取付装置。
- 上記力封込めアセンブリは、上記電子サーバから上記係合力を分離することを特徴とする請求項1記載の取付装置。
- 上記各電子サーバは、ブレードサーバであることを特徴とする請求項1記載の取付装置。
- 上記各電子サーバは、ラックサーバであることを特徴とする請求項1記載の取付装置。
- 上記第1の熱交換器は、固定されており、上記第2の熱交換器は、上記電子サーバに対して可動であることを特徴とする請求項1記載の取付装置。
- 上記第1の熱交換器は、上記サーバラックに対して可動であり、上記第2の熱交換器は、上記電子サーバに対して可動であることを特徴とする請求項1記載の取付装置。
- 2つの熱交換器間にサーマルインタフェースを形成する取付装置において、
a.第1の熱交換器を有するサーバラックと、
b.上記サーバラックに電気的インタフェースを介して接続され、第2の熱交換器をそれぞれ有する1つ以上の電子サーバと、
c.上記第1の熱交換器及び上記第2の熱交換器に連結され、該第1の熱交換器及び該第2の熱交換器に係合力を印加して、該第1の熱交換器と該第2の熱交換器との間にサーマルインタフェースを形成する並進運動機構と、
d.上記並進運動機構を収容し、上記電子サーバに連結されたシャーシガイドと、上記サーバラックに連結されたラックチャネルとを有する力封込めアセンブリとを備え、
上記シャーシガイドは、上記ラックチャネルに連結されて、係合力を封じ込めるインタロックチャネルを形成することを特徴とする取付装置。 - 上記並進運動機構は、上記第1の熱交換器の係合面の全体が上記第2の熱交換器の係合面に対して同時に押し付けられるように、該第1の熱交換器と該第2の熱交換器との間に均一な係合プロファイルを提供することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器の係合面の第1の部分が、該第1の熱交換器の係合面の第2の部分より前に、上記第2の熱交換器の係合面に対して押し付けられるように、該第1の熱交換器と該第2の熱交換器との間に不均一な係合プロファイルを提供することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構に連結され、該並進運動機構を駆動して、上記係合力を印加する駆動機構を更に備える請求項41記載の取付装置。
- 上記並進運動機構及び上記駆動機構は、該駆動機構に印加された駆動力を上記係合力に変換することを特徴とする請求項44記載の取付装置。
- 上記駆動力は、第1のベクトルに沿って加えられ、上記係合力は、該第1のベクトルとは異なる第2のベクトルに沿って加えられることを特徴とする請求項45記載の取付装置。
- 上記並進運動機構は、更に、解放力を印加することを特徴とする請求項44記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器の係合面の全体が、上記第2の熱交換器の係合面から同時に分離されるように、該第1の熱交換器と該第2の熱交換器との間に均一な解放プロファイルを提供することを特徴とする請求項47記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器の係合面の第1の部分が、該第1の熱交換器の係合面の第2の部分より前に、上記第2の熱交換器の係合面から分離されるように、該第1の熱交換器と該第2の熱交換器との間に不均一な解放プロファイルを提供することを特徴とする請求項47記載の取付装置。
- 上記駆動機構は、更に、上記並進運動機構を駆動して、上記解放力を印加することを特徴とする請求項47記載の取付装置。
- 上記駆動機構は、駆動ロッドであることを特徴とする請求項44記載の取付装置。
- 上記駆動機構は、ネジであることを特徴とする請求項44記載の取付装置。
- 上記駆動機構は、電気機械式アクチュエータ、空気圧アクチュエータ及び油圧アクチュエータの1つ以上を有することを特徴とする請求項44記載の取付装置。
- 上記力封込めアセンブリは、上記シャーシガイドと上記電子サーバのシャーシとの間にフロート領域を提供することを特徴とする請求項41記載の取付装置。
- 上記力封込めアセンブリは、フロート領域を有することを特徴とする請求項41記載の取付装置。
- 上記サーバラックの第1の部分は、上記第1の熱交換器を含み、上記電子サーバの第1の部分は、上記第2の熱交換器を含み、上記力封込めアセンブリは、該電子サーバの残りの部分から及び該サーバラックの残りの部分から上記係合力を分離することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構は、上記第2の熱交換器に連結されたスプリングを有し、
上記第1の熱交換器は、上記力封込めアセンブリ内の固定面に連結されていることを特徴とする請求項41記載の取付装置。 - 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結された1つ以上のカムとを有することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結された第1のスプリングと、上記第2の熱交換器に連結された拡張板とを有し、
上記拡張板は、上記第2の熱交換器の並進運動を定義する1つ以上の傾斜プロファイルを有することを特徴とする請求項41記載の取付装置。 - 上記傾斜プロファイルのそれぞれは、同じであることを特徴とする請求項59記載の取付装置。
- 上記傾斜プロファイルの1つ以上は、異なることを特徴とする請求項59記載の取付装置。
- 上記拡張板の1つ以上の傾斜プロファイルに対して滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上の傾斜プロファイルを有する、上記並進運動機構に連結された駆動機構を更に備える請求項59記載の取付装置。
- 上記拡張板の1つ以上の傾斜プロファイルに沿って回転し、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のローラを有する、上記並進運動機構に連結された駆動機構を更に備える請求項59記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結された拡張板とを有し、
上記拡張板は、上記第2の熱交換器の並進運動を定義する1つ以上のスロットプロファイルを有することを特徴とする請求項41記載の取付装置。 - 上記スロットプロファイルのそれぞれは、同じであることを特徴とする請求項64記載の取付装置。
- 上記スロットプロファイルの1つ以上は、異なることを特徴とする請求項64記載の取付装置。
- 少なくとも1つが上記拡張板のスロットプロファイル内に配設され、それぞれが傾斜プロファイル内で滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のピンを有する、上記並進運動機構に連結された駆動機構を更に備える請求項64記載の取付装置。
- 上記並進運動機構は、冷却板の拡張部に連結された1つ以上のカムを有し、
上記各カムは、少なくとも1つが上記拡張板のスロットプロファイル内に配設され、それぞれが傾斜プロファイル内で滑り、定義された並進運動に基づいて、上記第2の熱交換器を並進させる1つ以上のピンを有することを特徴とする請求項64記載の取付装置。 - 上記1つ以上のカムに連結され、該1つ以上のカムを駆動して、上記係合力を印加する駆動機構を更に備える請求項68記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結されたスプリングと、上記第2の熱交換器に連結されたシザージャッキとを有することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構は、上記第2の熱交換器連結された拡張可能なデバイスを有することを特徴とする請求項41記載の取付装置。
- 上記並進運動機構は、上記第1の熱交換器に連結された拡張可能なデバイスを有することを特徴とする請求項41記載の取付装置。
- 上記サーバラックは、1つ以上の第1の熱交換器を含むことを特徴とする請求項41記載の取付装置。
- 上記各電子サーバは、1つ以上の第2の熱交換器を含むことを特徴とする請求項41記載の取付装置。
- 上記力封込めアセンブリは、上記サーバラックから上記係合力を分離することを特徴とする請求項41記載の取付装置。
- 上記力封込めアセンブリは、上記電子サーバから上記係合力を分離することを特徴とする請求項41記載の取付装置。
- 上記各電子サーバは、上記電気的インタフェースを介して上記サーバラックに接続され、上記力封込めアセンブリは、該電気的インタフェースから上記係合力を分離することを特徴とする請求項41記載の取付装置。
- 上記各電子サーバは、ブレードサーバであることを特徴とする請求項41記載の取付装置。
- 上記各電子サーバは、ラックサーバであることを特徴とする請求項41記載の取付装置。
- 上記第1の熱交換器は、固定されており、上記第2の熱交換器は、上記電子サーバに対して可動であることを特徴とする請求項41記載の取付装置。
- 上記第1の熱交換器は、上記サーバラックに対して可動であり、上記第2の熱交換器は、上記電子サーバに対して可動であることを特徴とする請求項41記載の取付装置。
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US7539020B2 (en) | 2009-05-26 |
WO2007098078A2 (en) | 2007-08-30 |
JP2009536754A (ja) | 2009-10-15 |
TWI371684B (en) | 2012-09-01 |
EP1989935A4 (en) | 2012-07-04 |
WO2007098077A3 (en) | 2008-09-18 |
WO2007098078A3 (en) | 2008-10-16 |
EP1987309A2 (en) | 2008-11-05 |
CN101438637B (zh) | 2013-01-02 |
TW200805042A (en) | 2008-01-16 |
WO2007098077A2 (en) | 2007-08-30 |
EP1987309A4 (en) | 2012-07-04 |
US7599184B2 (en) | 2009-10-06 |
EP1987309B1 (en) | 2014-04-16 |
CN101438637A (zh) | 2009-05-20 |
JP2009527897A (ja) | 2009-07-30 |
CN101438638B (zh) | 2015-01-14 |
TW200805041A (en) | 2008-01-16 |
US20070201210A1 (en) | 2007-08-30 |
US20070201204A1 (en) | 2007-08-30 |
CN101438638A (zh) | 2009-05-20 |
EP1989935A2 (en) | 2008-11-12 |
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