JP2017062832A - サーバファーム冷却システムのための冷気列封入 - Google Patents
サーバファーム冷却システムのための冷気列封入 Download PDFInfo
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- JP2017062832A JP2017062832A JP2016223052A JP2016223052A JP2017062832A JP 2017062832 A JP2017062832 A JP 2017062832A JP 2016223052 A JP2016223052 A JP 2016223052A JP 2016223052 A JP2016223052 A JP 2016223052A JP 2017062832 A JP2017062832 A JP 2017062832A
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- rack
- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20618—Air circulating in different modes under control of air guidance flaps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Abstract
Description
502 冷却モジュール
504 冷却コイル
506 冷気列封入構造
508 サーバラックポート
510 サーバラック
512 ダンパ
514 天井ダンパ
516 天井排気ファン
518 混合チャンバ
Claims (16)
- 内部空間を定めるとともに、ラックに係合するように構成されたラックポートを含むエンクロージャと、
前記エンクロージャにより定められる前記内部空間に冷却空気を供給する冷却及び混合モジュールと、
1又はそれ以上のファンレスラックマウント式ユニットを内部に設置し、前記エンクロージャにより定められる前記内部空間に前記1又はそれ以上のラックマウント式ユニットのそれぞれの前面が連結するように前記ラックポートに嵌め込まれたラックと、
前記1又はそれ以上のファンレスラックマウント式ユニットのそれぞれの後面に動作可能に取り付けられて、前記内部空間から前記1又はそれ以上のファンレスラックマウント式ユニットを通じて空気を引き込む1又はそれ以上の冷却ファンと、
を備えることを特徴とするサーバ冷却システム。 - 前記1又はそれ以上の冷却ファンが、ファンユニットに入れられる、
ことを特徴とする請求項1に記載のサーバ冷却システム。 - 前記ファンユニットが、前記1又はそれ以上のファンレスラックマウント式ユニットの前記それぞれの後面が連結する前記ラックの後面に取り付けられる、
ことを特徴とする請求項2に記載のサーバ冷却システム。 - 1又はそれ以上の管が、前記ファンユニットを前記1又はそれ以上のファンレスラックマウント式ユニットの前記それぞれの後面に接続する、
ことを特徴とする請求項2に記載のサーバ冷却システム。 - 個々の管が1又はそれ以上のホースを含む、
ことを特徴とする請求項4に記載のサーバ冷却システム。 - 前記冷却及び混合モジュールが、該冷却及び混合モジュールを通過する空気を冷却するために、内部に冷水が流れる1又はそれ以上の蛇行したコイルを含む、
ことを特徴とする請求項1に記載のサーバ冷却システム。 - 前記冷却及び混合モジュールが、前記エンクロージャの上面から前記内部空間に前記冷却空気を供給する、
ことを特徴とする請求項1に記載のサーバ冷却システム。 - 個々のファンレスラックマウント式ユニットが、ブレードコンピュータラックサーバを含む、
ことを特徴とする請求項1に記載のサーバ冷却システム。 - 前記1又はそれ以上の冷却ファンにより前記内部空間から前記1又はそれ以上のファンレスラックマウント式ユニットを通じて引き込まれる空気が、前記ラック内に設置された前記1又はそれ以上のファンレスラックマウント式ユニットを冷却する、
ことを特徴とする請求項1に記載のサーバ冷却システム。 - 内部空間を定めるとともに、ラックに係合するように構成されたラックポートを含むエンクロージャと、
前記エンクロージャにより定められる前記内部空間に冷却空気を供給する冷却及び混合モジュールと、
1又はそれ以上のファンレスラックマウント式ユニットを内部に設置し、前記エンクロージャにより定められる前記内部空間に前記1又はそれ以上のラックマウント式ユニットのそれぞれの前面が連結するように前記ラックポートに嵌め込まれたラックと、
前記エンクロージャの上面に動作可能に取り付けられて、前記冷却空気を前記内部空間内に押し進め、前記1又はそれ以上のファンレスラックマウント式ユニットを通じて出す1又はそれ以上の冷却ファンと、
ことを特徴とするサーバ冷却システム。 - 内部空間を定めるとともに、ラックに係合するように構成されたラックポートを含むエンクロージャと、
前記エンクロージャにより定められる前記内部空間に冷却空気を供給する冷却及び混合モジュールと、
1又はそれ以上のファンレスラックマウント式ユニットを内部に設置し、前記エンクロージャにより定められる前記内部空間に前記1又はそれ以上のラックマウント式ユニットのそれぞれの前面が連結するように前記ラックポートに嵌め込まれたラックと、
前記冷却及び混合モジュールの1又はそれ以上の側面に動作可能に取り付けられて、前記冷却空気を前記内部空間内に押し進め、前記1又はそれ以上のファンレスラックマウント式ユニットを通じて出す1又はそれ以上の冷却ファンと、
ことを特徴とするサーバ冷却システム。 - 内部に1又はそれ以上のファンレスラックマウント式ユニットを設置する少なくとも1つのラックの全面により定められる少なくとも1つの側部を有する内部空間を実質的に封入するステップと、
冷却空気源を導入して、前記定められた空間に冷却空気を供給するステップと、
前記少なくとも1つのラック内に設置された前記1又はそれ以上のファンレスラックマウント式ユニットのそれぞれの後面に1又はそれ以上の冷却ファンを動作可能に取り付けて、前記定められた空間から前記1又はそれ以上のファンレスラックマウント式ユニットを通じて前記冷却空気を引き込むステップと、
を含むことを特徴とするサーバ冷却方法。 - 前記冷却空気源が、前記定められた空間の上面から冷却空気を供給する、
ことを特徴とする請求項12に記載のサーバ冷却方法。 - 前記1又はそれ以上の冷却ファンが、ファンユニットに入れられる、
ことを特徴とする請求項12に記載のサーバ冷却方法。 - 1又はそれ以上の管が、前記ファンユニットを前記1又はそれ以上のファンレスラックマウント式ユニットの前記それぞれの後面に接続する、
ことを特徴とする請求項14に記載のサーバ冷却方法。 - 個々の管が1又はそれ以上のホースを含む、
ことを特徴とする請求項15に記載のサーバ冷却方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/427,660 US8054625B2 (en) | 2009-04-21 | 2009-04-21 | Cold row encapsulation for server farm cooling system |
US12/427,660 | 2009-04-21 |
Related Parent Applications (1)
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JP2014201540A Division JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
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JP2017062832A true JP2017062832A (ja) | 2017-03-30 |
JP6290361B2 JP6290361B2 (ja) | 2018-03-07 |
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JP2012507236A Expired - Fee Related JP5628292B2 (ja) | 2009-04-21 | 2010-03-31 | サーバファーム冷却システムのための冷気列封入 |
JP2014201540A Expired - Fee Related JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
JP2016223052A Expired - Fee Related JP6290361B2 (ja) | 2009-04-21 | 2016-11-16 | サーバファーム冷却システムのための冷気列封入 |
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JP2012507236A Expired - Fee Related JP5628292B2 (ja) | 2009-04-21 | 2010-03-31 | サーバファーム冷却システムのための冷気列封入 |
JP2014201540A Expired - Fee Related JP6046093B2 (ja) | 2009-04-21 | 2014-09-30 | サーバファーム冷却システムのための冷気列封入 |
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US (4) | US8054625B2 (ja) |
EP (2) | EP3171243A1 (ja) |
JP (3) | JP5628292B2 (ja) |
KR (1) | KR101354366B1 (ja) |
CN (1) | CN102405451B (ja) |
HK (1) | HK1166868A1 (ja) |
MY (1) | MY154645A (ja) |
RU (1) | RU2532846C2 (ja) |
SG (1) | SG175740A1 (ja) |
TW (1) | TWI551975B (ja) |
WO (1) | WO2010123662A2 (ja) |
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- 2010-03-31 KR KR1020117026124A patent/KR101354366B1/ko active IP Right Grant
- 2010-03-31 WO PCT/US2010/029360 patent/WO2010123662A2/en active Application Filing
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Publication number | Publication date |
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JP2015035218A (ja) | 2015-02-19 |
US8755182B2 (en) | 2014-06-17 |
US20120012278A1 (en) | 2012-01-19 |
US10117362B2 (en) | 2018-10-30 |
JP6046093B2 (ja) | 2016-12-14 |
CN102405451A (zh) | 2012-04-04 |
WO2010123662A2 (en) | 2010-10-28 |
SG175740A1 (en) | 2011-12-29 |
KR101354366B1 (ko) | 2014-01-22 |
RU2532846C2 (ru) | 2014-11-10 |
US8054625B2 (en) | 2011-11-08 |
JP6290361B2 (ja) | 2018-03-07 |
JP5628292B2 (ja) | 2014-11-19 |
US20140301027A1 (en) | 2014-10-09 |
US20160081230A1 (en) | 2016-03-17 |
EP3171243A1 (en) | 2017-05-24 |
EP2422259A2 (en) | 2012-02-29 |
WO2010123662A3 (en) | 2011-01-13 |
CN102405451B (zh) | 2014-10-22 |
JP2012524940A (ja) | 2012-10-18 |
EP2422259A4 (en) | 2016-08-24 |
TW201042434A (en) | 2010-12-01 |
HK1166868A1 (en) | 2012-11-09 |
TWI551975B (zh) | 2016-10-01 |
US9204577B2 (en) | 2015-12-01 |
RU2011142243A (ru) | 2013-05-27 |
KR20120010253A (ko) | 2012-02-02 |
MY154645A (en) | 2015-07-15 |
US20100263825A1 (en) | 2010-10-21 |
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