HK1166868A1 - 用於服務器群冷卻系統的冷排封裝 - Google Patents

用於服務器群冷卻系統的冷排封裝

Info

Publication number
HK1166868A1
HK1166868A1 HK12107457.7A HK12107457A HK1166868A1 HK 1166868 A1 HK1166868 A1 HK 1166868A1 HK 12107457 A HK12107457 A HK 12107457A HK 1166868 A1 HK1166868 A1 HK 1166868A1
Authority
HK
Hong Kong
Prior art keywords
cooling system
server farm
cold row
row encapsulation
farm cooling
Prior art date
Application number
HK12107457.7A
Other languages
English (en)
Inventor
斯科特．諾特布姆
艾伯特．戴爾．羅賓森
Original Assignee
雅虎公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 雅虎公司 filed Critical 雅虎公司
Publication of HK1166868A1 publication Critical patent/HK1166868A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20618—Air circulating in different modes under control of air guidance flaps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
HK12107457.7A 2009-04-21 2012-07-31 用於服務器群冷卻系統的冷排封裝 HK1166868A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/427,660 US8054625B2 (en) 2009-04-21 2009-04-21 Cold row encapsulation for server farm cooling system
PCT/US2010/029360 WO2010123662A2 (en) 2009-04-21 2010-03-31 Cold row encapsulation for server farm cooling system

Publications (1)

Publication Number Publication Date
HK1166868A1 true HK1166868A1 (zh) 2012-11-09

Family

ID=42980110

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12107457.7A HK1166868A1 (zh) 2009-04-21 2012-07-31 用於服務器群冷卻系統的冷排封裝

Country Status (11)

Country Link
US (4) US8054625B2 (zh)
EP (2) EP3171243A1 (zh)
JP (3) JP5628292B2 (zh)
KR (1) KR101354366B1 (zh)
CN (1) CN102405451B (zh)
HK (1) HK1166868A1 (zh)
MY (1) MY154645A (zh)
RU (1) RU2532846C2 (zh)
SG (1) SG175740A1 (zh)
TW (1) TWI551975B (zh)
WO (1) WO2010123662A2 (zh)

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WO2010123662A2 (en) 2010-10-28
SG175740A1 (en) 2011-12-29
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RU2532846C2 (ru) 2014-11-10
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US20140301027A1 (en) 2014-10-09
US20160081230A1 (en) 2016-03-17
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TWI551975B (zh) 2016-10-01
US9204577B2 (en) 2015-12-01
RU2011142243A (ru) 2013-05-27
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