CN102401874B - 晶片检查用接口和晶片检查装置 - Google Patents

晶片检查用接口和晶片检查装置 Download PDF

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Publication number
CN102401874B
CN102401874B CN201110273307.5A CN201110273307A CN102401874B CN 102401874 B CN102401874 B CN 102401874B CN 201110273307 A CN201110273307 A CN 201110273307A CN 102401874 B CN102401874 B CN 102401874B
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CN
China
Prior art keywords
wafer
inspection
probe card
adsorption
alignment
Prior art date
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CN201110273307.5A
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English (en)
Chinese (zh)
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CN102401874A (zh
Inventor
山田浩史
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN102401874A publication Critical patent/CN102401874A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CN201110273307.5A 2010-09-15 2011-09-15 晶片检查用接口和晶片检查装置 Active CN102401874B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-207224 2010-09-15
JP2010207224A JP5675239B2 (ja) 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置

Publications (2)

Publication Number Publication Date
CN102401874A CN102401874A (zh) 2012-04-04
CN102401874B true CN102401874B (zh) 2014-10-08

Family

ID=45806058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110273307.5A Active CN102401874B (zh) 2010-09-15 2011-09-15 晶片检查用接口和晶片检查装置

Country Status (5)

Country Link
US (1) US8975904B2 (https=)
JP (1) JP5675239B2 (https=)
KR (1) KR101324348B1 (https=)
CN (1) CN102401874B (https=)
TW (1) TWI525727B (https=)

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JPWO2012023180A1 (ja) * 2010-08-17 2013-10-28 株式会社アドバンテスト 接続装置、それを備えた半導体ウェハ試験装置、及び接続方法
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP6001326B2 (ja) * 2012-05-23 2016-10-05 東京エレクトロン株式会社 プローブ装置及びプローブ装置用ウエハ載置台
JP5952645B2 (ja) 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
JP6099347B2 (ja) 2012-10-03 2017-03-22 東京エレクトロン株式会社 ウエハ取り付け方法及びウエハ検査装置
KR102138794B1 (ko) * 2013-03-18 2020-07-28 삼성전자주식회사 반도체 패키지 위치정렬트레이, 그를 이용하는 테스트 핸들러, 반도체 패키지 위치 정렬 방법, 그리고 그를 이용하는 반도체 패키지 테스트 방법
JP6267928B2 (ja) 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
CN105181157B (zh) * 2014-06-20 2017-07-28 沈阳芯源微电子设备有限公司 一种测温晶圆微调装置
JP5858312B1 (ja) * 2014-07-25 2016-02-10 株式会社東京精密 プロービング装置及びプローブコンタクト方法
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
JP6625423B2 (ja) * 2015-12-17 2019-12-25 東京エレクトロン株式会社 ウエハ検査装置及びそのメンテナンス方法
JP6283760B2 (ja) * 2017-03-14 2018-02-21 東京エレクトロン株式会社 ウエハ検査装置
JP6785375B2 (ja) * 2017-06-21 2020-11-18 東京エレクトロン株式会社 検査システム
JP3214100U (ja) * 2017-10-06 2017-12-21 ワイエイシイガーター株式会社 測定装置、及び分類装置
US10566256B2 (en) 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
JP7018368B2 (ja) * 2018-07-12 2022-02-10 東京エレクトロン株式会社 検査装置及び検査装置の清浄化方法
JP7170494B2 (ja) * 2018-10-15 2022-11-14 東京エレクトロン株式会社 中間接続部材及び検査装置
JP6700366B2 (ja) * 2018-11-05 2020-05-27 東京エレクトロン株式会社 ウエハ検査装置
JP6655703B2 (ja) * 2018-12-26 2020-02-26 東京エレクトロン株式会社 被整備テストヘッド及びウエハ検査装置
JP6903725B2 (ja) * 2018-12-26 2021-07-14 東京エレクトロン株式会社 ウエハ検査システム
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法
JPWO2021064788A1 (https=) * 2019-09-30 2021-04-08
JP7308776B2 (ja) * 2020-02-17 2023-07-14 東京エレクトロン株式会社 プローブカード保持装置及び検査装置
JP7382888B2 (ja) * 2020-04-06 2023-11-17 東京エレクトロン株式会社 検査装置、及び、検査装置の制御方法
JP2020145446A (ja) * 2020-04-30 2020-09-10 東京エレクトロン株式会社 ウエハ検査装置
TWM641397U (zh) * 2022-12-30 2023-05-21 致茂電子股份有限公司 晶圓檢測系統

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JP3648699B2 (ja) * 1997-02-03 2005-05-18 東京エレクトロン株式会社 ウエハの一括検査装置及びウエハの一括検査方法
JP3388271B2 (ja) * 1997-05-19 2003-03-17 東京エレクトロン株式会社 プローブ装置
JPH11163066A (ja) 1997-11-29 1999-06-18 Tokyo Electron Ltd ウエハ試験装置
JPH11186349A (ja) 1997-12-24 1999-07-09 Matsushita Electric Ind Co Ltd ウェハバーンイン装置
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6483336B1 (en) * 2000-05-03 2002-11-19 Cascade Microtech, Inc. Indexing rotatable chuck for a probe station
JP4544707B2 (ja) * 2000-07-17 2010-09-15 アピックヤマダ株式会社 ワークの搬送治具
JP3891798B2 (ja) * 2001-06-19 2007-03-14 松下電器産業株式会社 プローブ装置
US6885206B2 (en) * 2003-02-11 2005-04-26 Strasbaugh Device for supporting thin semiconductor wafers
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
TW200846668A (en) * 2007-01-23 2008-12-01 Nictech Co Ltd Probe and probe card having the same
JP5134864B2 (ja) * 2007-05-30 2013-01-30 株式会社日本マイクロニクス 半導体検査装置
JP4999615B2 (ja) * 2007-08-31 2012-08-15 東京エレクトロン株式会社 検査装置及び検査方法
KR100959372B1 (ko) * 2008-03-24 2010-05-24 미래산업 주식회사 반도체 소자 이송장치, 핸들러, 및 반도체 소자 제조방법
JP5258395B2 (ja) * 2008-06-03 2013-08-07 株式会社日本マイクロニクス プロービング装置
CN102301462A (zh) 2009-02-12 2011-12-28 株式会社爱德万测试 半导体晶片测试装置

Also Published As

Publication number Publication date
KR101324348B1 (ko) 2013-10-31
US20120062258A1 (en) 2012-03-15
KR20120028835A (ko) 2012-03-23
JP2012063227A (ja) 2012-03-29
CN102401874A (zh) 2012-04-04
TWI525727B (zh) 2016-03-11
JP5675239B2 (ja) 2015-02-25
US8975904B2 (en) 2015-03-10
TW201232688A (en) 2012-08-01

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