KR101324348B1 - 웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치 - Google Patents

웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치 Download PDF

Info

Publication number
KR101324348B1
KR101324348B1 KR1020110092498A KR20110092498A KR101324348B1 KR 101324348 B1 KR101324348 B1 KR 101324348B1 KR 1020110092498 A KR1020110092498 A KR 1020110092498A KR 20110092498 A KR20110092498 A KR 20110092498A KR 101324348 B1 KR101324348 B1 KR 101324348B1
Authority
KR
South Korea
Prior art keywords
wafer
inspection
probe card
region
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110092498A
Other languages
English (en)
Korean (ko)
Other versions
KR20120028835A (ko
Inventor
히로시 야마다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120028835A publication Critical patent/KR20120028835A/ko
Application granted granted Critical
Publication of KR101324348B1 publication Critical patent/KR101324348B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020110092498A 2010-09-15 2011-09-14 웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치 Expired - Fee Related KR101324348B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-207224 2010-09-15
JP2010207224A JP5675239B2 (ja) 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置

Publications (2)

Publication Number Publication Date
KR20120028835A KR20120028835A (ko) 2012-03-23
KR101324348B1 true KR101324348B1 (ko) 2013-10-31

Family

ID=45806058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110092498A Expired - Fee Related KR101324348B1 (ko) 2010-09-15 2011-09-14 웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치

Country Status (5)

Country Link
US (1) US8975904B2 (https=)
JP (1) JP5675239B2 (https=)
KR (1) KR101324348B1 (https=)
CN (1) CN102401874B (https=)
TW (1) TWI525727B (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012023180A1 (ja) * 2010-08-17 2013-10-28 株式会社アドバンテスト 接続装置、それを備えた半導体ウェハ試験装置、及び接続方法
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP6001326B2 (ja) * 2012-05-23 2016-10-05 東京エレクトロン株式会社 プローブ装置及びプローブ装置用ウエハ載置台
JP5952645B2 (ja) 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
JP6099347B2 (ja) 2012-10-03 2017-03-22 東京エレクトロン株式会社 ウエハ取り付け方法及びウエハ検査装置
KR102138794B1 (ko) * 2013-03-18 2020-07-28 삼성전자주식회사 반도체 패키지 위치정렬트레이, 그를 이용하는 테스트 핸들러, 반도체 패키지 위치 정렬 방법, 그리고 그를 이용하는 반도체 패키지 테스트 방법
JP6267928B2 (ja) 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
CN105181157B (zh) * 2014-06-20 2017-07-28 沈阳芯源微电子设备有限公司 一种测温晶圆微调装置
JP5858312B1 (ja) * 2014-07-25 2016-02-10 株式会社東京精密 プロービング装置及びプローブコンタクト方法
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
JP6625423B2 (ja) * 2015-12-17 2019-12-25 東京エレクトロン株式会社 ウエハ検査装置及びそのメンテナンス方法
JP6283760B2 (ja) * 2017-03-14 2018-02-21 東京エレクトロン株式会社 ウエハ検査装置
JP6785375B2 (ja) * 2017-06-21 2020-11-18 東京エレクトロン株式会社 検査システム
JP3214100U (ja) * 2017-10-06 2017-12-21 ワイエイシイガーター株式会社 測定装置、及び分類装置
US10566256B2 (en) 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
JP7018368B2 (ja) * 2018-07-12 2022-02-10 東京エレクトロン株式会社 検査装置及び検査装置の清浄化方法
JP7170494B2 (ja) * 2018-10-15 2022-11-14 東京エレクトロン株式会社 中間接続部材及び検査装置
JP6700366B2 (ja) * 2018-11-05 2020-05-27 東京エレクトロン株式会社 ウエハ検査装置
JP6655703B2 (ja) * 2018-12-26 2020-02-26 東京エレクトロン株式会社 被整備テストヘッド及びウエハ検査装置
JP6903725B2 (ja) * 2018-12-26 2021-07-14 東京エレクトロン株式会社 ウエハ検査システム
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法
JPWO2021064788A1 (https=) * 2019-09-30 2021-04-08
JP7308776B2 (ja) * 2020-02-17 2023-07-14 東京エレクトロン株式会社 プローブカード保持装置及び検査装置
JP7382888B2 (ja) * 2020-04-06 2023-11-17 東京エレクトロン株式会社 検査装置、及び、検査装置の制御方法
JP2020145446A (ja) * 2020-04-30 2020-09-10 東京エレクトロン株式会社 ウエハ検査装置
TWM641397U (zh) * 2022-12-30 2023-05-21 致茂電子股份有限公司 晶圓檢測系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124725A (en) 1997-11-29 2000-09-26 Tokyo Electron Limited Apparatus and method for testing semiconductor devices formed on a semiconductor wafer
JP2009295686A (ja) 2008-06-03 2009-12-17 Micronics Japan Co Ltd プロービング装置
JP2010186998A (ja) 2009-02-12 2010-08-26 Advantest Corp 半導体ウェハ試験装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648699B2 (ja) * 1997-02-03 2005-05-18 東京エレクトロン株式会社 ウエハの一括検査装置及びウエハの一括検査方法
JP3388271B2 (ja) * 1997-05-19 2003-03-17 東京エレクトロン株式会社 プローブ装置
JPH11186349A (ja) 1997-12-24 1999-07-09 Matsushita Electric Ind Co Ltd ウェハバーンイン装置
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6483336B1 (en) * 2000-05-03 2002-11-19 Cascade Microtech, Inc. Indexing rotatable chuck for a probe station
JP4544707B2 (ja) * 2000-07-17 2010-09-15 アピックヤマダ株式会社 ワークの搬送治具
JP3891798B2 (ja) * 2001-06-19 2007-03-14 松下電器産業株式会社 プローブ装置
US6885206B2 (en) * 2003-02-11 2005-04-26 Strasbaugh Device for supporting thin semiconductor wafers
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
TW200846668A (en) * 2007-01-23 2008-12-01 Nictech Co Ltd Probe and probe card having the same
JP5134864B2 (ja) * 2007-05-30 2013-01-30 株式会社日本マイクロニクス 半導体検査装置
JP4999615B2 (ja) * 2007-08-31 2012-08-15 東京エレクトロン株式会社 検査装置及び検査方法
KR100959372B1 (ko) * 2008-03-24 2010-05-24 미래산업 주식회사 반도체 소자 이송장치, 핸들러, 및 반도체 소자 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124725A (en) 1997-11-29 2000-09-26 Tokyo Electron Limited Apparatus and method for testing semiconductor devices formed on a semiconductor wafer
JP2009295686A (ja) 2008-06-03 2009-12-17 Micronics Japan Co Ltd プロービング装置
JP2010186998A (ja) 2009-02-12 2010-08-26 Advantest Corp 半導体ウェハ試験装置

Also Published As

Publication number Publication date
US20120062258A1 (en) 2012-03-15
KR20120028835A (ko) 2012-03-23
JP2012063227A (ja) 2012-03-29
CN102401874A (zh) 2012-04-04
TWI525727B (zh) 2016-03-11
JP5675239B2 (ja) 2015-02-25
CN102401874B (zh) 2014-10-08
US8975904B2 (en) 2015-03-10
TW201232688A (en) 2012-08-01

Similar Documents

Publication Publication Date Title
KR101324348B1 (ko) 웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치
KR101335146B1 (ko) 프로브 카드 검출 장치, 웨이퍼의 위치 정렬 장치 및 웨이퍼의 위치 정렬 방법
KR101346391B1 (ko) 웨이퍼 검사 장치
KR101386331B1 (ko) 웨이퍼 반송 장치
JP4491513B1 (ja) 半導体ウェハ試験装置
US11067624B2 (en) Inspection system
JP7018784B2 (ja) コンタクト精度保証方法および検査装置
JPH05136218A (ja) 検査装置
KR20110050365A (ko) 프로브 장치 및 기판 반송 방법
KR101218507B1 (ko) 프로브 장치
KR20180015203A (ko) 액정표시패널의 양면 검사장치
CN113341289A (zh) 探针卡保持装置以及检查装置
JP2010135397A (ja) 検査装置及びプローブカードの交換方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160930

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170929

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20181019

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20191026

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20191026

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000