JP6267928B2 - ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 - Google Patents
ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 Download PDFInfo
- Publication number
- JP6267928B2 JP6267928B2 JP2013224460A JP2013224460A JP6267928B2 JP 6267928 B2 JP6267928 B2 JP 6267928B2 JP 2013224460 A JP2013224460 A JP 2013224460A JP 2013224460 A JP2013224460 A JP 2013224460A JP 6267928 B2 JP6267928 B2 JP 6267928B2
- Authority
- JP
- Japan
- Prior art keywords
- maintenance
- test head
- case
- wafer inspection
- carriage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012423 maintenance Methods 0.000 title claims description 87
- 238000007689 inspection Methods 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 11
- 238000012360 testing method Methods 0.000 claims description 124
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000000523 sample Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000008531 maintenance mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Description
15 テストヘッド
17 フランジ
27 整備用台車
29 台車基部
30 リフト機構
31 テストヘッドケース
35 水平位置調整ステージ
37 スライドレール
38 ストッパ機構
41 ガイドレール
43 ガイド部
43b ローラ
Claims (6)
- 多段積みで配置されるテストヘッドを有するウエハ検査装置の整備用台車であって、
車輪を有して移動自在な台車基部と、
前記テストヘッドを収容するケースと、
前記ケースを昇降させるリフト機構と、
該リフト機構及び前記ケースの間に介在し、前記ケースを前記リフト機構に対して水平に移動させる水平位置調整機構とを備え、
前記ケースは直方体状を呈するとともに、長手方向に関する両端に開口部を有することを特徴とするウエハ検査装置の整備用台車。 - 各前記開口部は前記ウエハ検査装置に配置された各前記テストヘッドに対向することを特徴とする請求項1記載のウエハ検査装置の整備用台車。
- 前記ケースの側面上部には前記ケースの長手方向に前記テストヘッドをスライドさせるスライドレールが配され、該スライドレールは前記テストヘッドの位置を固定させる固定機構を有することを特徴とする請求項1又は2記載のウエハ検査装置の整備用台車。
- 前記ウエハ検査装置の下部に設けられたガイドレールと遊合するガイド機構をさらに備えることを特徴とする請求項1乃至3のいずれか1項に記載のウエハ検査装置の整備用台車。
- 前記ガイド機構は前記台車基部から側方へ突出するブラケットと、該ブラケットに設けられたローラとを有し、前記ガイドレールの断面は矩形であり、前記ローラ及び前記台車基部の間には前記ガイドレールの側壁が介在することを特徴とする請求項4記載のウエハ検査装置の整備用台車。
- 車輪を有して移動自在な台車基部と、ウエハ検査装置に多段積みで配置されるテストヘッドを収容するケースと、前記ケースを昇降させるリフト機構と、該リフト機構及び前記ケースの間に介在し、前記ケースを前記リフト機構に対して水平に移動させる水平位置調整機構とを備え、前記ケースは直方体状を呈するとともに、長手方向に関する両端に開口部を有する整備用台車を用いるウエハ検査装置の整備方法であって、
前記整備用台車全体を移動させ、
前記台車基部の位置を固定した後、整備を行う前記テストヘッドが存在する位置まで前記ケースを昇降させ、
前記ケースの位置を固定した後、前記水平位置調整機構を用いて前記ケースを、前記整備を行うテストヘッドに正対させて前記開口部を前記テストヘッドに対向させることを特徴とするウエハ検査装置の整備方法。
Priority Applications (17)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013224460A JP6267928B2 (ja) | 2013-10-29 | 2013-10-29 | ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 |
TW103136442A TWI640779B (zh) | 2013-10-29 | 2014-10-22 | 晶圓檢查裝置之整備用台車及晶圓檢查裝置之整備方法 |
KR1020140147195A KR101777737B1 (ko) | 2013-10-29 | 2014-10-28 | 웨이퍼 검사 장치의 정비용 대차 및 웨이퍼 검사 장치의 정비 방법 |
CN201811608811.4A CN110058138A (zh) | 2013-10-29 | 2014-10-28 | 晶片检查装置 |
CN201410589928.8A CN104569775B (zh) | 2013-10-29 | 2014-10-28 | 晶片检查装置的维修用台车和晶片检查装置的维修方法 |
US14/525,431 US9671459B2 (en) | 2013-10-29 | 2014-10-28 | Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatus |
US15/582,848 US10753972B2 (en) | 2013-10-29 | 2017-05-01 | Wafer inspection system, wafer inspection apparatus and prober |
KR1020170113313A KR102211088B1 (ko) | 2013-10-29 | 2017-09-05 | 기판 검사 시스템, 웨이퍼 검사 장치, 및 프로버 |
US16/671,410 US20200064400A1 (en) | 2013-10-29 | 2019-11-01 | Wafer inspection system, wafer inspection apparatus and prober |
US16/930,751 US10976364B2 (en) | 2013-10-29 | 2020-07-16 | Test head and wafer inspection apparatus |
US17/007,203 US11061071B2 (en) | 2013-10-29 | 2020-08-31 | Wafer inspection system, wafer inspection apparatus and prober |
KR1020200145665A KR102305278B1 (ko) | 2013-10-29 | 2020-11-04 | 피정비 테스트 헤드 및 웨이퍼 검사 장치 |
US17/197,252 US11567123B2 (en) | 2013-10-29 | 2021-03-10 | Wafer inspection system |
KR1020210100029A KR102641433B1 (ko) | 2013-10-29 | 2021-07-29 | 기판 검사 시스템 |
US18/147,091 US11762012B2 (en) | 2013-10-29 | 2022-12-28 | Wafer inspection system |
US18/446,724 US20240019487A1 (en) | 2013-10-29 | 2023-08-09 | Wafer inspection system |
KR1020240025684A KR20240031274A (ko) | 2013-10-29 | 2024-02-22 | 웨이퍼 검사 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013224460A JP6267928B2 (ja) | 2013-10-29 | 2013-10-29 | ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017013791A Division JP6383022B2 (ja) | 2017-01-30 | 2017-01-30 | 基板検査システム |
JP2017048907A Division JP6283760B2 (ja) | 2017-03-14 | 2017-03-14 | ウエハ検査装置 |
JP2017062824A Division JP6467722B2 (ja) | 2017-03-28 | 2017-03-28 | プローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015088555A JP2015088555A (ja) | 2015-05-07 |
JP6267928B2 true JP6267928B2 (ja) | 2018-01-24 |
Family
ID=52994707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013224460A Active JP6267928B2 (ja) | 2013-10-29 | 2013-10-29 | ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 |
Country Status (5)
Country | Link |
---|---|
US (8) | US9671459B2 (ja) |
JP (1) | JP6267928B2 (ja) |
KR (5) | KR101777737B1 (ja) |
CN (2) | CN110058138A (ja) |
TW (1) | TWI640779B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5967510B1 (ja) * | 2015-03-24 | 2016-08-10 | 株式会社東京精密 | プローバ |
CN104952776B (zh) * | 2015-04-24 | 2019-04-26 | 沈阳拓荆科技有限公司 | 一款加热盘检验及拆装时存放专用车 |
KR101657179B1 (ko) * | 2015-06-15 | 2016-09-27 | 주식회사 마인즈아이 | 카메라 모듈의 제조 및 검사 장치 |
US10141288B2 (en) | 2015-07-31 | 2018-11-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Surface mount device/integrated passive device on package or device structure and methods of forming |
JP2018022813A (ja) * | 2016-08-05 | 2018-02-08 | 株式会社東京精密 | プローバ |
KR102136544B1 (ko) * | 2018-11-30 | 2020-07-22 | 주식회사 쎄믹스 | 유지 보수가 가능한 웨이퍼 검사 장치 |
JP6906128B2 (ja) * | 2019-06-26 | 2021-07-21 | 末晴 宮川 | ウエハー試験装置 |
JP2020074496A (ja) * | 2020-02-17 | 2020-05-14 | 株式会社東京精密 | プローバ |
KR102548389B1 (ko) * | 2021-06-21 | 2023-06-27 | 주식회사 쎄믹스 | 전장 유지보수 도어를 갖는 프로버 |
KR20220170635A (ko) * | 2021-06-23 | 2022-12-30 | 주식회사 쎄믹스 | 독립 모듈형 셀 구조를 갖는 프로버 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685404B2 (ja) | 1986-10-31 | 1994-10-26 | 東京エレクトロン株式会社 | プロ−ブ装置 |
JP2670705B2 (ja) | 1989-07-31 | 1997-10-29 | 東京エレクトロン株式会社 | 半導体試験装置 |
JP3215475B2 (ja) * | 1991-12-20 | 2001-10-09 | 東京エレクトロン株式会社 | プローブ装置 |
US5506512A (en) | 1993-11-25 | 1996-04-09 | Tokyo Electron Limited | Transfer apparatus having an elevator and prober using the same |
JPH0864645A (ja) | 1994-08-17 | 1996-03-08 | Tokyo Electron Ltd | プローブ装置 |
JP3237740B2 (ja) | 1995-11-16 | 2001-12-10 | 東京エレクトロン株式会社 | プローブ装置 |
JPH08335614A (ja) | 1995-06-08 | 1996-12-17 | Tokyo Electron Ltd | プロ−ブシステム |
US5741171A (en) * | 1996-08-19 | 1998-04-21 | Sagitta Engineering Solutions, Ltd. | Precision polishing system |
JPH10335395A (ja) * | 1997-05-28 | 1998-12-18 | Advantest Corp | プローブカードの接触位置検出方法 |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
JP2003160299A (ja) | 2001-11-26 | 2003-06-03 | Ando Electric Co Ltd | 重量物搭載用治具 |
JP4134289B2 (ja) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | プローブカード搬送装置及びアダプタ |
JP2004170267A (ja) * | 2002-11-20 | 2004-06-17 | Tokyo Seimitsu Co Ltd | プローブカード搬送台車 |
US7089782B2 (en) * | 2003-01-09 | 2006-08-15 | Applied Materials, Inc. | Polishing head test station |
DE20311615U1 (de) * | 2003-07-28 | 2003-10-23 | Heigl Helmuth | Handhabungsvorrichtung, insbesondere zum Positionieren eines Testkopfes an einer Prüfeinrichtung |
US7230437B2 (en) | 2004-06-15 | 2007-06-12 | Formfactor, Inc. | Mechanically reconfigurable vertical tester interface for IC probing |
US7919974B2 (en) * | 2004-07-23 | 2011-04-05 | Advantest Corporation | Electronic device test apparatus and method of configuring electronic device test apparatus |
US7312604B2 (en) | 2005-07-29 | 2007-12-25 | Nextest Systems Corporation | Portable manipulator for stackable semiconductor test system |
WO2007017953A1 (ja) * | 2005-08-11 | 2007-02-15 | Advantest Corporation | 電子部品試験装置 |
JP4875332B2 (ja) * | 2005-09-21 | 2012-02-15 | 東京エレクトロン株式会社 | プローブカード移載補助装置及び検査設備 |
TW200745572A (en) | 2006-06-09 | 2007-12-16 | Visera Technologies Co Ltd | Manufacturing method of wafer-level testing circuit board, and the structure thereof |
DE102006060829B4 (de) * | 2006-12-22 | 2010-03-25 | Keiper Gmbh & Co. Kg | Lageranordnung, insbesondere eines Fahrzeugsitzes |
WO2009004968A1 (ja) | 2007-06-29 | 2009-01-08 | Advantest Corporation | 試験装置 |
JP4664334B2 (ja) * | 2007-07-20 | 2011-04-06 | 東京エレクトロン株式会社 | 検査方法 |
JP5049419B2 (ja) * | 2007-07-25 | 2012-10-17 | 東京エレクトロン株式会社 | プローブカード用台車及びこの台車を用いるプローブカードの取り扱い方法 |
CN102066962B (zh) * | 2008-07-14 | 2013-09-11 | 株式会社爱德万测试 | 测试头移动装置及电子元件测试装置 |
JP5277827B2 (ja) | 2008-09-22 | 2013-08-28 | 東京エレクトロン株式会社 | プローブ装置 |
JP2010157550A (ja) | 2008-12-26 | 2010-07-15 | Toshiba Corp | ウエハテストシステム |
KR101278131B1 (ko) * | 2009-04-28 | 2013-07-05 | 가부시키가이샤 어드밴티스트 | 배선 기판 유닛 및 시험 장치 |
JP4482616B1 (ja) | 2009-08-07 | 2010-06-16 | 株式会社アドバンテスト | 試験装置および試験方法 |
JP5561849B2 (ja) | 2009-08-11 | 2014-07-30 | 東京エレクトロン株式会社 | 検査装置の操作方法及び検査装置の操作プログラム |
JP2011089891A (ja) | 2009-10-22 | 2011-05-06 | Micronics Japan Co Ltd | 電気的接続装置及びこれを用いる試験装置 |
CN201673239U (zh) * | 2010-02-11 | 2010-12-15 | 中芯国际集成电路制造(上海)有限公司 | 半导体测试设备 |
TWM396483U (en) * | 2010-04-16 | 2011-01-11 | Abletec Automation Ltd | Multi-chip detecting system |
JP5675239B2 (ja) * | 2010-09-15 | 2015-02-25 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
JP5499303B2 (ja) | 2011-02-04 | 2014-05-21 | 株式会社日本マイクロニクス | プローブカードの配線基板調整治具及び配線基板修正方法並びに配線基板調整治具を用いて調整されたプローブカードを用いた検査方法及び検査システム |
JP2013064678A (ja) * | 2011-09-20 | 2013-04-11 | Renesas Electronics Corp | 半導体集積回路装置の製造方法 |
JP5615852B2 (ja) | 2012-01-27 | 2014-10-29 | 東京エレクトロン株式会社 | 電子デバイス試験システム |
JP2014115115A (ja) * | 2012-12-06 | 2014-06-26 | Advantest Corp | 補正装置、プローブ装置、および試験装置 |
JP5664938B2 (ja) | 2013-02-01 | 2015-02-04 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
WO2016024346A1 (ja) * | 2014-08-13 | 2016-02-18 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
-
2013
- 2013-10-29 JP JP2013224460A patent/JP6267928B2/ja active Active
-
2014
- 2014-10-22 TW TW103136442A patent/TWI640779B/zh active
- 2014-10-28 KR KR1020140147195A patent/KR101777737B1/ko active IP Right Grant
- 2014-10-28 CN CN201811608811.4A patent/CN110058138A/zh active Pending
- 2014-10-28 CN CN201410589928.8A patent/CN104569775B/zh active Active
- 2014-10-28 US US14/525,431 patent/US9671459B2/en active Active
-
2017
- 2017-05-01 US US15/582,848 patent/US10753972B2/en active Active
- 2017-09-05 KR KR1020170113313A patent/KR102211088B1/ko active IP Right Grant
-
2019
- 2019-11-01 US US16/671,410 patent/US20200064400A1/en not_active Abandoned
-
2020
- 2020-07-16 US US16/930,751 patent/US10976364B2/en active Active
- 2020-08-31 US US17/007,203 patent/US11061071B2/en active Active
- 2020-11-04 KR KR1020200145665A patent/KR102305278B1/ko active IP Right Grant
-
2021
- 2021-03-10 US US17/197,252 patent/US11567123B2/en active Active
- 2021-07-29 KR KR1020210100029A patent/KR102641433B1/ko active IP Right Grant
-
2022
- 2022-12-28 US US18/147,091 patent/US11762012B2/en active Active
-
2023
- 2023-08-09 US US18/446,724 patent/US20240019487A1/en active Pending
-
2024
- 2024-02-22 KR KR1020240025684A patent/KR20240031274A/ko active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20200348358A1 (en) | 2020-11-05 |
US20200064400A1 (en) | 2020-02-27 |
KR102211088B1 (ko) | 2021-02-02 |
US9671459B2 (en) | 2017-06-06 |
KR20170104975A (ko) | 2017-09-18 |
KR20150050414A (ko) | 2015-05-08 |
US20200400743A1 (en) | 2020-12-24 |
US10753972B2 (en) | 2020-08-25 |
JP2015088555A (ja) | 2015-05-07 |
US20230134360A1 (en) | 2023-05-04 |
KR20200127960A (ko) | 2020-11-11 |
KR102305278B1 (ko) | 2021-09-27 |
US20240019487A1 (en) | 2024-01-18 |
US10976364B2 (en) | 2021-04-13 |
US20210190861A1 (en) | 2021-06-24 |
US20150115991A1 (en) | 2015-04-30 |
US11061071B2 (en) | 2021-07-13 |
KR101777737B1 (ko) | 2017-09-12 |
CN104569775A (zh) | 2015-04-29 |
CN110058138A (zh) | 2019-07-26 |
US20170234924A1 (en) | 2017-08-17 |
KR20240031274A (ko) | 2024-03-07 |
TWI640779B (zh) | 2018-11-11 |
US11567123B2 (en) | 2023-01-31 |
TW201531710A (zh) | 2015-08-16 |
CN104569775B (zh) | 2019-02-05 |
KR102641433B1 (ko) | 2024-02-28 |
US11762012B2 (en) | 2023-09-19 |
KR20210097088A (ko) | 2021-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6267928B2 (ja) | ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法 | |
JP6383022B2 (ja) | 基板検査システム | |
JP7060744B2 (ja) | ウエハ検査システム | |
JP6283760B2 (ja) | ウエハ検査装置 | |
JP6903725B2 (ja) | ウエハ検査システム | |
JP6572371B2 (ja) | ウエハ検査装置 | |
JP6467722B2 (ja) | プローバ | |
JP6411692B1 (ja) | 基板検査システム | |
JP6700366B2 (ja) | ウエハ検査装置 | |
JP6655703B2 (ja) | 被整備テストヘッド及びウエハ検査装置 | |
JP2019033270A (ja) | ウエハ検査装置 | |
JP7109630B2 (ja) | ウエハ検査システム | |
KR101242633B1 (ko) | 향상된 기구적 강성을 갖는 수평수직 이동기구 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160831 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170515 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170523 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170724 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171128 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6267928 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |