WO2009004968A1 - 試験装置 - Google Patents

試験装置 Download PDF

Info

Publication number
WO2009004968A1
WO2009004968A1 PCT/JP2008/061578 JP2008061578W WO2009004968A1 WO 2009004968 A1 WO2009004968 A1 WO 2009004968A1 JP 2008061578 W JP2008061578 W JP 2008061578W WO 2009004968 A1 WO2009004968 A1 WO 2009004968A1
Authority
WO
WIPO (PCT)
Prior art keywords
testing
units
wafer
section
testing units
Prior art date
Application number
PCT/JP2008/061578
Other languages
English (en)
French (fr)
Inventor
Noboru Okino
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to KR1020097026761A priority Critical patent/KR101138194B1/ko
Priority to JP2009521595A priority patent/JP5379685B2/ja
Priority to CN200880021581XA priority patent/CN101689522B/zh
Priority to EP08777594A priority patent/EP2172968A1/en
Publication of WO2009004968A1 publication Critical patent/WO2009004968A1/ja
Priority to US12/646,736 priority patent/US8207744B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

　本発明に係る試験装置は、被試験ウェハに形成された回路と試験信号を送受信する試験モジュール、試験モジュールおよび被試験ウェハの間で試験信号の伝送経路を結合する結合部、圧力を供給された場合に被試験ウェハを結合部に当接させる保持部、並びに、保持部および結合部を収容する筐体を各々が有して、筐体の内部で被試験ウェハを試験する複数の試験ユニットと、複数の試験ユニットによる試験の対象となる被試験ウェハを格納した、複数の試験ユニットに対して共通な格納部と、格納部および複数の試験ユニットの各々の間で被試験ウェハを搬送する搬送部と、複数の試験ユニットの各々に試験の手順を指示するメインフレームと、複数の試験ユニットの各々に電力を供給する、複数の試験ユニットに対して共通な電源と、複数の試験ユニットの各々に圧力を供給する、複数の試験ユニットに対して共通な圧力源とを備える。
PCT/JP2008/061578 2007-06-29 2008-06-25 試験装置 WO2009004968A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097026761A KR101138194B1 (ko) 2007-06-29 2008-06-25 시험 장치
JP2009521595A JP5379685B2 (ja) 2007-06-29 2008-06-25 試験装置
CN200880021581XA CN101689522B (zh) 2007-06-29 2008-06-25 测试装置
EP08777594A EP2172968A1 (en) 2007-06-29 2008-06-25 Testing apparatus
US12/646,736 US8207744B2 (en) 2007-06-29 2009-12-23 Testing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007171555 2007-06-29
JP2007-171555 2007-06-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/646,736 Continuation US8207744B2 (en) 2007-06-29 2009-12-23 Testing apparatus

Publications (1)

Publication Number Publication Date
WO2009004968A1 true WO2009004968A1 (ja) 2009-01-08

Family

ID=40226015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061578 WO2009004968A1 (ja) 2007-06-29 2008-06-25 試験装置

Country Status (7)

Country Link
US (1) US8207744B2 (ja)
EP (1) EP2172968A1 (ja)
JP (1) JP5379685B2 (ja)
KR (1) KR101138194B1 (ja)
CN (1) CN101689522B (ja)
TW (1) TWI386664B (ja)
WO (1) WO2009004968A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482616B1 (ja) * 2009-08-07 2010-06-16 株式会社アドバンテスト 試験装置および試験方法
WO2010092672A1 (ja) * 2009-02-12 2010-08-19 株式会社アドバンテスト 半導体ウェハ試験装置
JP2015084398A (ja) * 2013-09-17 2015-04-30 東京エレクトロン株式会社 基板検査装置
JP5858312B1 (ja) * 2014-07-25 2016-02-10 株式会社東京精密 プロービング装置及びプローブコンタクト方法
JP2017139479A (ja) * 2017-03-28 2017-08-10 東京エレクトロン株式会社 プローバ
JP6411692B1 (ja) * 2018-08-02 2018-10-24 東京エレクトロン株式会社 基板検査システム
WO2019017050A1 (ja) * 2017-07-19 2019-01-24 東京エレクトロン株式会社 検査システム
US10753972B2 (en) 2013-10-29 2020-08-25 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober

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TWI402932B (zh) * 2009-05-27 2013-07-21 Star Techn Inc 具有多軸載台之半導體元件測試裝置
JP5461379B2 (ja) * 2010-12-15 2014-04-02 株式会社アドバンテスト 試験装置
CN102169846B (zh) * 2011-01-27 2013-12-11 北京确安科技股份有限公司 一种在集成电路晶圆测试过程中实现多维变量密码并行写入的方法
JP2013053991A (ja) * 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
US8676375B2 (en) * 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system
JP6099347B2 (ja) * 2012-10-03 2017-03-22 東京エレクトロン株式会社 ウエハ取り付け方法及びウエハ検査装置
CN103576035B (zh) * 2013-11-15 2016-01-20 安徽金月电子科技有限公司 一种加热瓦测试台
US9775261B2 (en) * 2014-03-06 2017-09-26 The Boeing Company Flexible chassis interface device
KR102581480B1 (ko) * 2016-07-27 2023-09-21 삼성전자주식회사 반도체 패키지를 위한 테스트 보드, 테스트 시스템 및 반도체 패키지의 제조 방법
JP7426073B2 (ja) * 2017-01-08 2024-02-01 テストメトリックス， インコーポレイテッド 半導体デバイスを試験するための機器および方法
CN108107349A (zh) * 2017-12-26 2018-06-01 上海华岭集成电路技术股份有限公司 一种晶圆和成品测试通用承载板
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
CN109490754B (zh) * 2018-11-24 2021-03-09 苏州旗开得电子科技有限公司 一种电路板并行测试系统
JP7285739B2 (ja) * 2019-08-28 2023-06-02 東京エレクトロン株式会社 プローバおよびプローブカードのクリーニング方法
JP2020145446A (ja) * 2020-04-30 2020-09-10 東京エレクトロン株式会社 ウエハ検査装置
KR102224820B1 (ko) * 2020-08-13 2021-03-09 케이에프알엔디 주식회사 반도체 디바이스 테스트 장치
CN112466768B (zh) * 2020-11-12 2022-05-24 东营大海科林光电有限公司 一种光伏电池板的检测装置及检测方法
KR102565704B1 (ko) 2023-01-03 2023-08-14 (주)대한인더스트리 스마트 손세정기 및 세정 자원 관리 시스템

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JPH08306750A (ja) 1995-04-28 1996-11-22 Advantest Corp 半導体試験装置
JP2000346875A (ja) 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
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Cited By (19)

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US9121901B2 (en) 2009-02-12 2015-09-01 Advantest Corporation Semiconductor wafer test apparatus
WO2010092672A1 (ja) * 2009-02-12 2010-08-19 株式会社アドバンテスト 半導体ウェハ試験装置
CN102301462A (zh) * 2009-02-12 2011-12-28 株式会社爱德万测试 半导体晶片测试装置
WO2011016096A1 (ja) * 2009-08-07 2011-02-10 株式会社アドバンテスト 試験装置および試験方法
US8299935B2 (en) 2009-08-07 2012-10-30 Advantest Corporation Test apparatus and test method
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JP2015084398A (ja) * 2013-09-17 2015-04-30 東京エレクトロン株式会社 基板検査装置
US10753972B2 (en) 2013-10-29 2020-08-25 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober
US11762012B2 (en) 2013-10-29 2023-09-19 Tokyo Electron Limited Wafer inspection system
US11567123B2 (en) 2013-10-29 2023-01-31 Tokyo Electron Limited Wafer inspection system
US11061071B2 (en) 2013-10-29 2021-07-13 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober
US10976364B2 (en) 2013-10-29 2021-04-13 Tokyo Electron Limited Test head and wafer inspection apparatus
JP5858312B1 (ja) * 2014-07-25 2016-02-10 株式会社東京精密 プロービング装置及びプローブコンタクト方法
JP2017139479A (ja) * 2017-03-28 2017-08-10 東京エレクトロン株式会社 プローバ
JP2019021804A (ja) * 2017-07-19 2019-02-07 東京エレクトロン株式会社 検査システム
WO2019017050A1 (ja) * 2017-07-19 2019-01-24 東京エレクトロン株式会社 検査システム
US11067624B2 (en) 2017-07-19 2021-07-20 Tokyo Electron Limited Inspection system
JP2019004157A (ja) * 2018-08-02 2019-01-10 東京エレクトロン株式会社 基板検査システム
JP6411692B1 (ja) * 2018-08-02 2018-10-24 東京エレクトロン株式会社 基板検査システム

Also Published As

Publication number Publication date
US20100156434A1 (en) 2010-06-24
TW200912343A (en) 2009-03-16
CN101689522B (zh) 2011-11-02
JP5379685B2 (ja) 2013-12-25
KR101138194B1 (ko) 2012-05-10
CN101689522A (zh) 2010-03-31
JPWO2009004968A1 (ja) 2010-08-26
EP2172968A1 (en) 2010-04-07
US8207744B2 (en) 2012-06-26
TWI386664B (zh) 2013-02-21
KR20100009653A (ko) 2010-01-28

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