M396483 • 五、新型說明： 【新型所屬之技術領域】 本創作係有關於半導體晶片檢測裝置，特別是指一種檢測速度快、品 質檢測準確，並可做檢測等級分類之檢測機。 【先前技術】 ' 按，積體電路晶片O^egrate circuit chip ; IC chip)被視為電子元件心臟 •樞紐，因此電子廠對積體電路晶片採購標準也最為嚴苛。但現下電子產品 鲁用量大增，造成積體電路晶片需求量大幅度增加，使得每一供應商要掌握 商場大筆賴’首祕件除了最制試(fmaltesting)準確無誤’帛必須能夠 大量出貨’且快速、準時。 多晶片檢測系統，係將一載滿積體電路晶片之料盤(tray)送入至一入料 機器手臂下方，入料機器手臂前端設有吸嘴，下降機器手臂，即可利用吸 嘴吸取料盤中一晶片後，為相鄰排列的多個檢測機構一一填入積體電路晶 . 片。 藝檢測程序基本包含檢測晶片是否定位，以及檢測晶片在預定工作溫度 時作動是否正常。其中’傳統檢測晶片是否定位之方式，係、針對晶片PM 點位置進行位置確認，若晶片Pinl點位置正確，即判定可以接著執行品質 檢測，但只檢測晶片Pini點的方式並不夠嚴謹，部份檢測系統因此會設置 CCD影像她裝置’以在同排檢測裝置都安裝上晶片時，—次性掃描該排 檢測裝置上所有晶片，以確認所有晶片位置是否正確，藉此，具有重復確 認位置之效，可避免測試頭壓傷或損毀位置不正確的晶片。 接著於晶片位置雜完成後’工作人員根據客戶端要求的工作溫度， 3 M396483 利用檢概置巾的加熱板_ plam麵測試酬駐作溫度，通常設定在 5〇 130賴，藉·_片在常溫以及高溫下是否可以正常工作。根據檢 測絲，«其中檢測品fjEf者，以另—出料機时臂放崎盤中原位 置的穴孔中’再將其中檢測出_正常者，_出料機器手臂挑揀至 另一廢料盤存放。 准’上述檢測系統成本高昂，必做用二機器手臂完成晶片的進料與 2料，且單是檢查Hnl點確職位置之方式，難免有疏失，但加裝CCD ^像操取裝置，X目為必鮮制_刺檢職置全部安裝好晶片後，才 可以進仃f;像拍攝，是以，反而造成檢卿業時職長。又，由於CCd影 像操取裝置掃描軸大，系齡_游個晶>i位置，故，影像處理 的資訊量大增，祕作業速度與位置靖鮮度相對下降。 再者，檢測過程中，由於加熱板提昇測試頭工作溫度方式誤差範圍較 大，因此系統僅是約略判斷讀取晶片的數據是否正常，位於驗收要求度高 的曰曰片而5，其未來被整批退貨的風險也將拉高。此外，習知檢測方法係 疋將品質正常者挪回原料盤的原孔穴中，異常者挑撿到另一廢料盤中，故， 扣前還必須依賴工作人員重新檢視出貨料盤中是否有空孔穴並逐一填 入品質正常的晶片，故’難免會有疏漏情形，並也顯費時費力，拖慢晶片 出貨速度。 有鑑於習知結構上有許多可更為精進之處，本創作提出一種多晶片檢 測系統，以改善習知檢測系統缺失。 【新型内容】 本創作之主要目的係在提供一種多晶片檢測系統，其晶片進料及取料 M396483 ’可縮短晶片供料 ’並讓系統製作成 係以同一隻機器手臂完成，且機器手臂上設有二吸頭組 及取料行程，減少行程位移後，也將大幅減少作業時間 本更低。 本創作之次要目的係在提供—種多“檢爾統，其鮮確控制測試 頭的測S式溫度，確保晶片檢測數據準確度，提高出貨良率。 .本創作之再—目的係在提供―種多晶諸測系統，其係以影像操取裝 -置逐-比對每U位置，可_每—晶片放置位置正確無誤且縮減檢 Φ 測時間。 本創作之X目的係在提供—種多晶片檢測系統，其增設暫存區放置 品質檢測未通過之晶片以供進行複檢，以重複確認晶片檢驗結果正確^， 並還可對晶片進行分級。 為達到上述之目的，本創作揭露一種多晶片檢測系統，包括一檢測機 構、-存放機構’二吸頭組以及—電性連接檢測機構與二吸頭組的控制模 •组。其中，檢測機構中具有複數檢測裝置，每一檢測裝置中包括一晶片基 鲁座，以供放置-待測試晶片，以及一設於晶片基座上方的測試頭，測試頭 係由控麵組控制下移，以對待測試晶片進行品質檢驗，控繼組並在檢 測後’將原待職晶片判定成為__已職晶片。存放機構具有-進料區、 -劣品區以及-良品區，其中進料區中係供存放待測試晶片，而良品區及 劣品區中則供存放已測試晶片，不同之處在於良品區係供存放品質檢測 通過之已測試晶片，劣品區則是供存放品質檢測異常之已測試晶片。再者， 該二吸頭組係設在檢測機構與存放機構之間，且受控於控制模組命令，可 於檢測機構和存放機構間移動，每一吸頭組並可由控制模組控制作動以 5 分別吸取-待測試晶片或—已測試晶片，並將此待測試晶片或已測試晶片 由進料區移制晶>{基鋼試，或由晶片基座中移制良品區或劣 品區内 存放》 底下藉由具體實施繼合簡_式詳加制，#更容㈣解本創作 之目的、技術内容、特點及其所達成之功效。 【實施方式】 為快速、準雜測大批量晶片，本創作提出__種脑的多晶片檢測系 統’其檢測晶片之存取都是藉_—機器手臂前_二吸頭組所絲，除 省成本外’還兼具縮短晶片進出料行程之效果，再者，更設置晶片暫存區， 讓未通過測試之已職晶片可被重複檢測，進而達到分級晶片之目的。 請參閱第-圖，如圖所示，本創作揭示一多晶片檢測系統卜其包括一 檢測機構10、-設於檢測機構1〇旁的存放機構3〇、複數設於存放機構3〇 底端的料盤棘裝置50、-設於械麟3〇巾的齡手臂70，以及一電 性連接檢測機構10、存放機構3〇 '料盤存取裝置5〇與機器手臂7〇的控制 模組90。 接著參閱第二圖以及第三圖，檢測機構1〇包括了一第一機架u及複 數檢測裝置13，於本實施例中，係將第一機架u以一上層板U1以及一下 層板113隔出上層空間112及下層空間114，再於上層空間112及下層空間 114中等距設置複數檢測裝置13 ;其中，每一檢測裝置13又都包括一可供 。又置一待測試測试晶片2之晶片基座131，以及一設於晶片基座131上方的 測試頭132’且測試頭132具有一致冷晶片133及一與致冷晶片133表面接 觸之冷水管134，該致冷晶片133主材料為超導體，當電流通過致冷晶片 M396483 •爪57將位於-環形承架58中’藉以搬移料盤6_於環形承架％與抽 展52 ^心環形承架58上具有二推進器％，此二推進器59係可推頂料盤 6〇向環形承架％側邊靠攏定位。 •另請參閱第十圖，並會同第六圖、第七圖、第十—圖與第十二圖一起 檢視，機器手#7G橫跨架設在二第三導軌42上，JL機器手臂7〇包含二基 …座71、7Γ，此二基座7卜71，分設於二齒輪組72、72,上，二齒輪組72、 • 72’各別受控於一第五飼服馬達73、乃，驅動，能夠微調所屬基座刀^，上、 籲下位置，使得：基座71、71，可分開動作。另外，每-基座71、71，前端各 設有-吸頭組74、74’，為平起平放待測試晶片2或已測試晶片2,，本實施 例中各吸頭組74、74’基本是由四個吸頭組成；另在此澄清，單顆吸頭即可 達到取放晶片2或2’之目的’所以吸頭數量的變更，並不足影響本創作之 實施。另外’―基座7卜71’間距魏合料盤6〇相鄰：孔穴61距離而設計， 藉此以利用各吸頭組74、74,可各別吸取料盤60中的—待測試晶片2或已 -測試晶片2,，或是同時吸取料盤财心的實心、處62，以將料盤⑼由進料 春區32搬移到空盤區33，或是將料盤6〇由空盤區％搬移到劣品區充或良 品區36上。且二基座7卜71’側邊還設有一影像擷取農置76，例如CCD 鏡頭等’ λ ’如第-圖的第一機架u與第二機架31位置顯示以便在機 器手臂70吸取待測試晶片2置入晶片基座131時，由影像操取裝置拍攝待 測試晶片2放入晶片基座131中的實際影像。 -併參閱第-®到第十圖’㈣模組90可紅業電腦或—般可供作程 式修改之桌上型主機或筆記型電腦，透過網路連接檢測裝置13、第一伺服 馬達39、第二伺服馬逹43、時規齒輪組46、第四伺服馬達允、機器手臂 9 M396483 7〇以及軸取裝置㈣線路係可選自有線網路無線網路等通訊媒介， 其内部儲存_ ω尺柏从、編丨_、待_片2的端子數、 測试頭132卫作溫度以及施力大小、機器手臂％行走路徑、吸頭組74, 動作時序_，配合麵_擇，可由轉人__種操作模 式。故，一旦 硬體架構整敎成，工作人貞便麟透触纖組9()建立本 創作之多晶片檢測系統丨之自動檢測控制。並請接著看第十三圖所示，控 纖組9〇中預設有四作業程序，分為補盤作業、填料作業檢測作業及複 檢作業》 首先參閱第、第六圖、第十_及第十m補盤作業於 開始時，係先自動補盤’由工作人員將複數空料盤6〇放置在空盤區刃上， 緊接著’控制模組90將以光纖檢測劣品區35或是良品區％中是否有料盤 6〇存在’若無，控制模組90將再命令第一祠服馬達扣驅動第一導桿％， 以帶動滑架40位_空盤區33上方，緊接著，命令第二舰馬達43驅動 第二導桿42帶動内架44下移到靠近空盤區33之處，祕，命令時規齒輪 組微調機H手臂70前進’二吸驗74、74’因此正對料盤⑼中心的實心處 62 ’跟著命令第五词服馬達73、73,控制齒輪組72、72’順轉二吸頭組μ、 74’下降貼合料盤60的實心處62，如此一來，即可以二吸頭组74、％吸取 料盤60，之後，再操作第五伺服馬達73、73,逆轉齒輪組72、72，，二組吸 頭組74、74,也將抬高空料盤6〇。又，如同前述移動方式，利用第一伺服馬 達39帶動第-導桿38驅使滑架4(H立移，等到滑架4〇位移到劣品區乃或 良品區36上方時，可選擇直接釋放二吸頭組74、74’的吸力使得料盤6〇落 下’或是順轉齒輪、组72、72’慢慢放下料盤60冑可。當然順轉或逆轉齒輪 M396483 組 72、72，^· 之方向，進位下移或上升基座71、71， 可符总田β 丌為熟知該領域技術者 "^及，故，不應以此限制本創作範圍。 ^著，取第—圖配合第二圖、第三圖、第五圖、第六圖與第十二圖一 。結束補盤程序後，控制模組進人填料作業，也就是以機器手 〇之吸碩組74、74’吸取晶片2填人所有檢測裝置13的晶絲座⑶中。 祕機器手㈣柯、伽及__軸，下觀控制機器手 臂70位移動作相同者，即不再逐一詳述。 參本創作多晶片檢測系統i在第一次的填料過程中為加快填料速度， 控制模組90係命令機器手臂70以二吸頭组74、74，於料盤的中同時吸取 二待測試晶片2，藉此’機器手臂7〇前進到第一機架u中時，係可以在極 短的位移行程中’-次填補二台檢測裝置13的晶片基座ΐ3ι。換言之即 不用往復來回吸取待測試晶片2 ’將可節省約達1/2的往返時間。又機器 手臂7〇每放置一制試晶片2於一晶片基座⑶時，影像揭取裝置76即 '會拍攝一張待測試晶片2回傳到控制模組90中，控制模組9〇將取該實際 •影像與内部預存的正確影像做影像比對，藉以判斷待測試晶片2是否有放 置在正破位置上。由於拍攝過程是以單顆晶片2為單位進行的影像分析處 理，故，資訊量小、比對速度快，控制模組9〇也將立即判斷出結果，並在 待測試晶片2位置不正確時，立刻發出警告給工作人員，此時工作人員即 可以暫停檢測裝置13動作，利用人工或機器手臂70重新安放好待測試晶 片2。其中，對實際影像做影像處理過程中，更可以影像處理技術判斷一料 盤60的每一待測試晶片2批號是否相同，避免混料情形發生，以對未來出 貨的晶片2品質作嚴格控管與追縱。 11 M396483 測式晶片2之檢測裝置 值得一提的是，控制模組90會立即對有填入待 13要求執行檢測作業。 舉例而言’如第三圖示意’檢測作業中，控鑛組9(>發出命令，以電 流導通致冷晶請，快速到達奴的測試工作溫度並以冷水管_用 冷熱交換原理輯制試謂溫度高健在正貞3肋，測朗132根據 必要的工作溫度檢測待測試晶片2是否有異常，測試過程中，並將已測試 過L果正㈣晶>} 2定義為已測試晶片2，，測試過但結果異常的晶片2定 ^為複檢晶片2”，請配合第六圖與第十圖之結構示意，控制模組卯一旦取 得已測試W 2’完成或複檢晶4 2,，完朗指令時，立即命令齡手臂兀 先用一吸頭組74吸取-待測試晶片2,再以另一吸頭組％取出已測試晶片 2’或複檢晶片2”。 可似而知，如第五圖及第六圖所示，此時只要略為挪移機器手臂7〇的 位置’就可以將綠得的待測試晶片2放入同—基座ΐ3ι巾接著再將取 出的已測式晶片2’放入良品區36,或將取出的複檢晶片2”放人暫存區34， 如此來’可節省機器手臂％ 一次往返取料的行程及耗費時間。另外，若 料盤〇内的待測試晶片2已全部取用完畢時，控制模組90係將此空料 盤6〇移到空盤區33，以供下次補盤使用；若是劣品區35或是良品區36的 他6〇已經載滿已測試晶片2’時’如第八圖與第九圖，控制模組90將會 自動控制一者下方的料盤存取裝置50下移升降台55，載滿晶片2,的料盤 6〇將會脫離環形承架％，且由抓爪57帶到祕52上此紅作人員可將 抽歷52抽出底架5丨，即可以立即取出該料盤60。當抽屜52闔上時，升降 〇 55又將上升’以供承接機器手臂70移送來的下一個空料盤60。同理， 12 M396483 當進料區32中的料盤60以無待測試晶片2時，機器手臂70搬移該料盤60 到空盤區33，進料區32下方的料盤存取裝置5〇下移升降台55，工作人員 可以順勢拉出抽屜52，並放入一具有新批號待測試晶片2的料盤60’闔上 抽屜52的同時，升降台55又會以抓爪57抬高料盤6〇到進料區32中，並 由推進器50將新料盤60靠攏環形承架58。 . 又，儲存在暫存區34的複檢晶片2”，係可以設定為一段時間後，由機 -器手臂70重新施放到空的晶片基座131中重新檢驗，藉以避免前一次檢驗 鲁錯誤外，也可做為晶片分級使用，最簡單的設定方式，例如，第—次檢驗 未通過者’設為複檢晶片2”並放置於暫存區34中，且該複檢晶片2”若在第 二次檢驗時被判定正常，則放回良品區36的料盤6〇中，反之，若是再次 未通過，即表示品質異常，設為品質不良的已測試晶片2’並且放置於劣品 區35的料盤60中。 依此類推’利用重複檢測機制，本創作的多晶片檢測系統還可以大到 多階分級的目的，對異常⑼作多次複_定，進而分級成A級晶片B 鲁級晶片....品質不良的晶片等等，以為晶片作多等級分類。 當然，上述實施結構及操作模式，僅為本創作之一實施例及實施方式， 當*制罐定摘作之專職g。本辦乃綱齡手臂上的二吸頭組 達到加快存放待測試晶片以及已測試晶片之目的。故，其實施結構還能如 第十二圖所示，於第二機架31中上下設置二機器手臂7〇、，藉以用上 方機器手臂70對上層空間m中的檢測裝置13存取待測試晶片或已測試 晶片’用下方機器手臂70,對下層空严4114中的檢測裝置13存取待測試晶 片或已測試晶片，由於機器手臂7〇、7〇，不在上下大幅度移動，故，逮度也 13 M396483 ix-- 將更優於前一實施方式。 再者’每批檢測晶片的端子數目並不一定相同，所以本創作多曰片測 試系統同樣也必須更換具有相同數量探針的測試頭，才能進行晶片檢測 但晶片係屬精密電子元件，施壓大小也將影響檢測結果。為求測試蚌果更 加精準，因此還可以在測試頭中加裝壓力感測器，以控制測試頭對不同端 子數的晶片施予不同測試壓力，避免損壞晶片本身。 綜上所述，可知悉本創作多晶片檢測系統係可形成緊密且環環相扣的 檢測程序’大量自動化每一檢測j裒節，更有效縮短最終檢測需要的時間。 再者’本創作直接機n手臂上的二吸頭組存取晶片，縮短晶片檢測所 需時間以外，且操作方法以及存取晶片動作聰、檢測模式都具有多種控 繼式，使操作更顯彈性。此外，本作多晶片檢測系統逐—拍攝晶片位置 進行位置賴，不僅辨識快速、鮮，且不用雜關“全部定位後再 進订’所以大幅縮短等待時間。此外’利用致冷晶片維持工作溫度恆定， 有助於檢測準確度，換言之，出貨品質也將大幅提升，還可以作為晶片分 級使用。_使用趣存轉置自動補紐盤，齡區撿拾制試晶片以 及已測武晶片’ JL作人員不再需要逐—檢視出貨料_晶片數量。由此可 知’本創作多晶片檢測系統具有快速 '方便、省成本、輸出精確以及省人 力等優點。 以上所述’係藉由實施例說明本創作之特點，其目的在使熟習該技術 者能瞭解本創作之崎並據以實施，而非限定糊作之專利範圍 ，故凡其 他未脫離本_所揭示之精神而完成之等絲飾或修改 ，仍應包含在以下 所述之申請專利範圍中。 M396483 【圖式簡單說明】 第一圖為本創作之一實施例的立體圖。 第二圖為本創作之檢測機構的立體圖。 第三圖為本創作之檢測裝置的立體圖。 第四圖為本創作之第二機架的立體圖。 . 第五圖為本創作之第二機架、滑架及内架的結構示意圖。 第六圖為本創作存放機構之内部結構示意圖。 Φ 第七圖為本創作之内架的内部結構示意圖。 第八圖為本創作料盤存取裝置的立體圖。 第九圖為本創作料盤存取裝置的作動示意圖。 第十圖為本創作機器手臂的立體圖。 第十一圖為本創作機器手臂搬移料盤之示意圖。 第十二圖為本創作機器手臂搬移晶片之示意圖。 第十三圖為本創作控制模組之控制方塊圖。 φ 【主要元件符號說明】 2、2’、2” 晶片 111 上層板 113下層板 131晶片基座 133 致冷晶片 I 多晶片檢測系統 10 檢測機構 II 第一機架 112 上層空間 114 下層空間 13 檢測裝置 132 測試頭 15 M396483 134 冷水管 30 存放機構 311 橫隔板 33 空盤區 35 劣品區 37 第一導執 39 第一伺服馬達 41 第二導軌 43 第二伺服馬達 45 第三導轨 50 料盤存取裝置 52 抽屜 54 第四導軌 56 第四伺服馬達 57 抓爪 59 推進器 60 料盤 62 實心處 70、 70’機器手臂 72、 72’齒輪組 74、 74’ 吸頭組 90 控制模組 135驅動器 31 第二機架 32 進料區 34 暫存區 36 良品區 38 第一導桿 40 滑架 42 第二導桿 44 内架 46 時規齒輪組 51 底架 53 第四導桿 55 升降台 58 環形承架 61 穴孔 71、71’ 基座 73、73， 第五伺服馬達 76 影像擷取裝置 16M396483 • V. New description: [New technical field] This creation is about semiconductor wafer inspection equipment, especially a detection machine with fast detection speed, accurate quality inspection and classification of inspection grades. [Prior Art] 'Integrated circuit chip (IC chip) is regarded as the core of the electronic component. Therefore, the electronics factory has the most stringent procurement standards for integrated circuit chips. However, the current increase in the use of electronic products has led to a significant increase in the demand for integrated circuit chips, which has made it necessary for each supplier to master the big name of the mall. In addition to the accuracy of the first test (fmaltesting), it must be able to The goods are 'fast and punctual. The multi-wafer inspection system feeds a tray full of integrated circuit chips under a feeding robot arm. The front end of the feeding machine arm is provided with a suction nozzle, and the robot arm is lowered, and the nozzle can be sucked. After a wafer in the tray, a plurality of detection mechanisms arranged adjacent to each other are filled with the integrated circuit crystal pieces. The art detection procedure basically involves detecting whether the wafer is positioned and detecting whether the wafer is operating normally at a predetermined operating temperature. Among them, 'the traditional method of detecting whether the wafer is positioned is to confirm the position of the PM point of the wafer. If the position of the Pinl point of the wafer is correct, it is determined that the quality inspection can be performed next, but the method of detecting only the Pini point of the wafer is not strict enough. The detection system will therefore set the CCD image of her device's to scan all the wafers on the row of inspection devices when the wafers are mounted on the same row of inspection devices to verify that all wafer locations are correct, thereby having a repeating confirmation position. This prevents the test head from being crushed or damaging the wafer with incorrect position. Then after the completion of the wafer position, 'the staff according to the working temperature required by the client, 3 M396483 using the heating plate of the inspection towel _ plam surface test compensation station temperature, usually set at 5 〇 130 赖, l · _ film in Can it work normally at normal temperature and high temperature? According to the test wire, «where the test product fjEf, in the other - the discharge machine when the arm is placed in the hole in the original position of the plate in the original position, and then detect the _ normal, _ discharge machine arm pick to another waste plate to store . Quasi'The above detection system is costly. It is necessary to use the two robotic arms to complete the feeding and 2 materials of the wafer, and the way to check the position of the Hnl point is inevitable, but it is inevitable to have a CCD ^ image handling device, X It is necessary to make a fresh _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Moreover, since the CCd image capturing device has a large scanning axis and a position of _ _ _ _ _ _ _ _ _ i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i Furthermore, during the detection process, since the heating plate raises the working temperature of the test head in a large error range, the system only judges whether the data of the read wafer is normal or not, and is located in the slab with high acceptance requirement, and the future is The risk of the entire batch of returns will also rise. In addition, the conventional detection method is to move the normal quality to the original hole of the raw material tray, and the abnormal person is provoked to another waste tray. Therefore, before the buckle, the worker must re-examine whether there is any in the delivery tray. Empty holes are filled into the normal quality wafers one by one, so it is inevitable that there will be omissions, and it will also take time and effort to slow down the wafer shipment speed. In view of the fact that there are many more sophisticated structures in the prior art, this work proposes a multi-chip inspection system to improve the lack of conventional detection systems. [New content] The main purpose of this creation is to provide a multi-wafer inspection system in which the wafer feeding and retrieving M396483 'can shorten the wafer feeding' and let the system be made into the same robot arm, and the robot arm With a two-head set and a take-up stroke, the stroke time will be reduced, and the working time will be significantly reduced. The secondary purpose of this creation is to provide a variety of "checks, which control the S-type temperature of the test head, ensure the accuracy of the wafer inspection data, and improve the yield of the shipment. In the provision of "species polycrystalline test systems, which are equipped with image manipulation - placement - comparison per U position, the position of each wafer can be correctly corrected and the time of inspection is reduced. The purpose of this creation is Providing a multi-wafer inspection system, which adds a wafer in which the quality inspection fails to pass the temporary storage area for re-inspection, to repeatedly confirm the correctness of the wafer inspection result, and can also classify the wafer. To achieve the above purpose, The invention discloses a multi-wafer inspection system, comprising a detection mechanism, a storage mechanism 'two-tip group, and a control module group of an electrical connection detecting mechanism and a two-head group. The detecting mechanism has a plurality of detecting devices, each of which has a plurality of detecting devices. A detecting device includes a wafer base for the placement of the wafer to be tested, and a test head disposed above the wafer base. The test head is controlled to be moved down by the control panel to test the wafer. Line quality inspection, control group and after the test, 'the original standby wafer is judged to be __ already used wafer. The storage mechanism has - feeding area, - inferior area and - good area, wherein the feeding area is for storage The wafer to be tested is stored in the good product area and the inferior product area. The difference is that the good product area is the tested wafer for storing the quality inspection, and the inferior product area is the tested wafer for storing the quality detection abnormality. Furthermore, the two-tip group is disposed between the detecting mechanism and the storage mechanism, and is controlled by the control module command, and can be moved between the detecting mechanism and the storage mechanism, and each nozzle group can be controlled by the control module. Actuating 5 to draw the wafer to be tested or the tested wafer, and to transfer the wafer to be tested or the tested wafer from the feed zone to the substrate, or to transfer the good area from the wafer base or In the inferior goods area, under the simplification of the specific implementation of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Measuring large quantities of wafers, this It is proposed that the __ multi-chip detection system of the brain can detect the access of the wafer by using the _-the front arm of the robot arm, and in addition to the cost saving, it also has the effect of shortening the feeding and discharging stroke of the wafer. Moreover, the wafer temporary storage area is set, so that the failed wafers that have not passed the test can be repeatedly tested to achieve the purpose of grading the wafer. Please refer to the figure-picture, as shown in the figure, the present disclosure reveals a multi-wafer inspection system. The utility model comprises a detecting mechanism 10, a storage mechanism 3 disposed beside the detecting mechanism 1〇, a plurality of tray ratchet devices 50 disposed at the bottom end of the storage mechanism 3, an ageing arm 70 disposed on the armor 3, and a The electrical connection detecting mechanism 10, the storage mechanism 3, the tray access device 5, and the control module 90 of the robot arm 7. Referring to the second and third figures, the detecting mechanism 1 includes a first machine. In the present embodiment, the first frame u is separated from the upper space 112 and the lower space 114 by an upper layer U1 and a lower layer 113, and then is disposed in the upper space 112 and the lower space 114. a medium distance setting complex detecting device 13; wherein each Detection means 13 further comprises a available. A wafer base 131 for testing the test wafer 2 is further disposed, and a test head 132' disposed above the wafer base 131. The test head 132 has a uniform cold wafer 133 and a cold water pipe in contact with the surface of the refrigerant wafer 133. 134, the main material of the refrigerating wafer 133 is a superconductor, when current flows through the refrigerating wafer M396483, the claw 57 will be located in the - annular frame 58 'by moving the tray 6_ to the annular carrier and the drawing 52 The frame 58 has two propellers, and the two propellers 59 are configured to push the tray 6 to the left side of the annular frame. • Please also refer to the tenth figure, and it will be viewed together with the sixth, seventh, tenth and twelfth figures. The robot #7G is erected on the second third rail 42 and the JL robot arm 7〇 The two bases 71, 7Γ, the two bases 7 and 71 are disposed on the two gear sets 72, 72, and the two gear sets 72, 72' are respectively controlled by a fifth feeding motor 73. However, the driver can finely adjust the position of the base knife, the upper and the lower position, so that the bases 71 and 71 can be operated separately. In addition, each of the pedestals 71, 71 is provided with a head group 74, 74' for flattening the wafer 2 to be tested or the wafer 2 to be tested. In this embodiment, each of the nozzle groups 74, 74 'Basic is composed of four tips; another clarification here, a single tip can achieve the purpose of picking and dropping the wafer 2 or 2'' so the number of tips is not enough to affect the implementation of this creation. In addition, the 'base 7 b 71' pitch Wei compound tray 6 is adjacent: the hole 61 is designed to be distanced, so that each of the suction head groups 74, 74 can be used to separately suck the wafer to be tested in the tray 60. 2 or already-tested the wafer 2, or simultaneously sucking the solid, 62 of the tray to move the tray (9) from the feed spring zone 32 to the empty tray 33, or to empty the tray 6 The panel % is moved to the inferior area charge or good area 36. And an image capturing farm 76 is provided on the side of the two bases 7 and 71', for example, a CCD lens or the like, and the first rack u and the second rack 31 are displayed in the position of the second rack 31 so as to be in the robot arm 70. When the wafer 2 to be tested is taken into the wafer base 131, the actual image of the wafer 2 to be tested placed in the wafer base 131 is taken by the image manipulation device. - and refer to the '- to the tenth figure' (4) module 90 can be a red computer or a desktop or notebook computer that can be modified by the program, through the network connection detection device 13, the first servo motor 39 , the second servo stirrup 43, the timing gear set 46, the fourth servo motor, the robot arm 9 M396483 7〇, and the shaft take-up device (4) line system can be selected from a communication medium such as a wired network wireless network, and its internal storage _ ω 尺 柏 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Transfer people __ kind of operation mode. Therefore, once the hardware structure is completed, the worker will use the fiber group 9 () to establish the automatic detection control of the multi-wafer detection system of the creation. Please continue to see the picture shown in the thirteenth figure. There are four operating procedures pre-set in the control unit 9〇, which are divided into the replenishment operation, the filling operation detection operation and the re-inspection operation. First, refer to the sixth, sixth, and tenth _ And the tenth m replenishment operation is started at the beginning, and the automatic replenishment is performed by the staff member to place a plurality of empty trays 6 on the empty panel edge, and then the control module 90 will detect the inferior product area by the optical fiber. Or is there a tray 6 in the good product area? If there is no, the control module 90 will command the first servo motor to drive the first guide rod % to drive the carriage 40 position _ empty disk area 33, tightly Next, the second ship motor 43 is commanded to drive the second guide rod 42 to move the inner frame 44 down to the vicinity of the empty disk area 33, secretly, commanding the timing gear set fine adjustment machine H arm 70 to advance 'two absorbing tests 74, 74' Therefore, the solid portion 62' of the center of the tray (9) is followed by the fifth word service motor 73, 73, and the control gear set 72, 72' is rotated by the second nozzle group μ, 74' to lower the solid portion of the adapter tray 60. In this way, the second nozzle group 74, the % suction tray 60 can be sucked, and then the fifth servo motor 73, 73 is operated, and the reverse is performed. Two wheel sets 72, 72 ,, 74, 74 set the nozzle groups, we will also raise the empty trays 6〇. Further, as in the foregoing moving mode, the first servo motor 39 is used to drive the first guide bar 38 to drive the carriage 4 (H is moved upright, and when the carriage 4 is displaced to the inferior area or the good area 36, the direct release can be selected. The suction force of the two suction head groups 74, 74' causes the tray 6 to fall down or 'slow the gears, the groups 72, 72' to slowly lower the tray 60. Of course, the gear M396483 group 72, 72, ^ · The direction, the carry-down or rise base 71, 71, can be the total field β 丌 is well known in the field of technology " ^ and, therefore, should not limit the scope of this creation. ^, take the first map With the second picture, the third picture, the fifth picture, the sixth picture and the twelfth picture one. After the end of the replenishment procedure, the control module enters the filling operation, that is, the machine handcuffs sucking the group 74, 74 'Absorbing the wafer 2 is filled in the crystal wire holder (3) of all the detecting devices 13. The secret robot hand (4) Ke, the gamma and the __ axis, and the lowering of the displacement of the control robot 70 are not detailed one by one. The multi-wafer inspection system i speeds up the packing speed during the first filling process, and the control module 90 commands the machine. The arm 70 sucks two wafers 2 to be tested simultaneously in the tray by the two nozzle groups 74, 74, whereby the robot arm 7 can be moved into the first frame u in a very short displacement stroke. '--filling the wafer base ΐ3ι of the two detecting devices 13 in other words. In other words, it is possible to save about 1/2 round-trip time without reciprocating the wafer to be tested 2', and the robot arm 7 is placed on each test wafer 2 In a wafer pedestal (3), the image removing device 76 will take a test wafer 2 back to the control module 90, and the control module 9 will take the actual image and the internal pre-stored correct image. Image comparison, to determine whether the wafer to be tested 2 is placed in the broken position. Since the shooting process is performed by a single wafer 2, the information is small, the comparison speed is fast, and the control module 9〇 will also immediately judge the result, and when the position of the wafer to be tested 2 is incorrect, a warning will be issued to the staff immediately. At this time, the worker can suspend the action of the detecting device 13 and re-place the test with the manual or robotic arm 70. Wafer 2 In the image processing process of the actual image, the image processing technology can determine whether the batch number of each wafer to be tested of the tray 60 is the same, avoiding the occurrence of the mixing situation, and strictly controlling the quality of the wafer 2 shipped in the future. 11 M396483 Test device for test chip 2 It is worth mentioning that the control module 90 will immediately perform the test operation for the fill-in request. For example, 'as shown in the third figure' test operation In the middle, the ore-control group 9 (> issued an order to conduct current cooling to the crystal, quickly reach the test temperature of the slave and use the cold water pipe _ using the principle of cold and heat exchange to test the temperature is high in the positive 贞 3 ribs, measuring Lang 132 Detecting whether the wafer to be tested 2 is abnormal according to the necessary working temperature, during the test, and testing the tested positive fruit (tetra) crystal>} 2 as the tested wafer 2, and the tested wafer 2 with abnormal results ^ For the re-inspection of the wafer 2", please cooperate with the structure of the sixth and tenth diagrams, the control module 卯 once the test W 2 'complete or re-examine the crystal 4 2, when the command is completed, immediately command the age arm吸 first suck with a suction head set 74 The wafer 2 to be tested is taken, and the tested wafer 2' or the retest wafer 2" is taken out by another tip group %. It can be seen that, as shown in the fifth and sixth figures, at this time, the green test wafer 2 to be tested can be placed in the same-base ΐ3 m towel and then removed as long as the position of the robot arm 7 略 is slightly moved. The tested wafer 2' is placed in the good product area 36, or the taken-out re-inspection wafer 2" is placed in the temporary storage area 34, so that the robot arm% can be saved in one round trip and the time taken and the time is spent. When the wafer 2 to be tested in the tray is completely taken out, the control module 90 moves the empty tray 6 to the empty tray 33 for the next replenishment; if it is the inferior area 35 or When the 6-inch area of the good product area 36 has been filled with the tested wafer 2', as in the eighth and ninth views, the control module 90 will automatically control the tray access device 50 under one of the lower lifting platform 55, The tray 6 that is full of the wafer 2 will be detached from the annular carrier %, and will be carried by the gripper 57 to the secret 52. The red worker can pull the dip 52 out of the chassis 5, that is, the tray can be taken out immediately. 60. When the drawer 52 is slammed, the lifting sill 55 will rise again 'to accept the next empty tray 60 transferred by the robot arm 70. Similarly, 12 M396483 When the tray 60 in the feed zone 32 is free of the wafer 2 to be tested, the robot arm 70 moves the tray 60 to the empty tray 33, and the tray access device 5 below the feed zone 32 is moved down and down. At the table 55, the worker can pull out the drawer 52 and put in a tray 60' having a new batch of the wafer 2 to be tested, while the drawer 52 is raised, and the lifting table 55 raises the tray 6 with the gripper 57. Into the feeding zone 32, the new tray 60 is brought closer to the annular carrier 58 by the pusher 50. Also, the rechecking wafer 2" stored in the temporary storage area 34 can be set to a period of time, by the machine - The arm 70 is re-applied to the empty wafer base 131 for re-inspection, in order to avoid the previous inspection of the Lu error, and can also be used as the wafer classification, the simplest setting method, for example, the first-time inspection fails. In order to re-examine the wafer 2" and place it in the temporary storage area 34, and the re-inspection wafer 2" is judged to be normal at the second inspection, it is put back into the tray 6 of the good product area 36, and vice versa. If it fails, it means that the quality is abnormal, and it is set to the poor quality tested wafer 2' and placed inferior. 35 of the tray 60 in the region. By analogy, the multi-wafer detection system of this creation can also be used for the purpose of multi-level grading, and the anomaly (9) is repeated multiple times, and then classified into A-level wafer B-level wafer.... Poor quality wafers, etc., in order to classify the wafers in multiple levels. Of course, the above-mentioned implementation structure and operation mode are only one embodiment and embodiment of the present creation, and the full-scale g is selected as the can. The two-head set on the arm of the office is designed to speed up the storage of the wafer to be tested and the tested wafer. Therefore, the implementation structure can also be configured as shown in FIG. 12, in which the second robot arm 7 is disposed up and down in the second frame 31, so that the upper robot arm 70 accesses the detecting device 13 in the upper space m to be tested. The wafer or the tested wafer 'with the lower robot arm 70, accesses the wafer to be tested or the tested wafer to the detecting device 13 in the lower layer 4114. Since the robot arm 7〇, 7〇, does not move up and down greatly, it is arrested. Degree 13 M396483 ix-- will be better than the previous embodiment. Furthermore, the number of terminals for each batch of test wafers is not necessarily the same, so the multi-slice test system of this batch must also replace the test heads with the same number of probes for wafer inspection but the wafers are precision electronic components. Size will also affect the test results. In order to make the test results more precise, it is also possible to add a pressure sensor to the test head to control the test head to apply different test pressures to the wafers of different terminal numbers to avoid damage to the wafer itself. In summary, it can be seen that the multi-wafer inspection system of the present invention can form a tight and interlocking detection program, a large number of automated inspections, and more effectively shorten the time required for final inspection. Furthermore, the two-head set on the n-arm of the original machine accesses the wafer, shortening the time required for wafer inspection, and the operation method and accessing the wafer action and detection mode have various control modes, which makes the operation more obvious. elasticity. In addition, the multi-wafer detection system is used to capture the position of the wafer, not only to identify the fast and fresh, but also to eliminate the waiting time after the “all positioning and then ordering”, so that the waiting time is greatly shortened. Constant, it helps to detect accuracy, in other words, the quality of the shipment will be greatly improved, and it can also be used as a wafer grading. _ Use the fun-to-replace automatic replenishment tray, the age-area pick-up test wafer and the tested wafer ' JL The staff no longer needs to examine the quantity of the shipments_chips one by one. It can be seen that the 'multi-wafer inspection system of the creation has the advantages of fast 'convenient, cost-saving, accurate output, and labor saving. The above is based on the embodiment. Explain the characteristics of this creation, the purpose of which is to enable those skilled in the art to understand the creation of this creation and to implement it, rather than to limit the scope of patents, so that other filaments are not completed without the spirit of this disclosure. Decorations or modifications shall still be included in the scope of the patent application described below. M396483 [Simple description of the drawings] The first figure is the embodiment of one of the creations The second figure is a perspective view of the detection mechanism of the creation. The third picture is a perspective view of the detection device of the creation. The fourth picture is a perspective view of the second frame of the creation. Schematic diagram of the structure of the two frames, the carriage and the inner frame. The sixth figure is the internal structure diagram of the creation storage mechanism. Φ The seventh figure is the internal structure diagram of the inner frame of the creation. The ninth figure is a schematic diagram of the operation of the creation tray access device. The tenth figure is a perspective view of the creation robot arm. The eleventh figure is a schematic diagram of the creation of the robot arm moving tray. Schematic diagram of the transfer of the wafer for the authoring robot. The thirteenth figure is the control block diagram of the authoring control module. φ [Key element symbol description] 2, 2', 2" wafer 111 upper layer 113 lower layer 131 wafer base 133 Refrigerated wafer I Multi-wafer inspection system 10 Detection mechanism II First frame 112 Upper space 114 Lower space 13 Detection device 132 Test head 15 M396483 134 Cold water pipe 30 Storage mechanism 311 Diaphragm 33 Empty panel 35 Inferior zone 37 First guide 39 First servo motor 41 Second rail 43 Second servo motor 45 Third rail 50 Pallet access device 52 Drawer 54 Fourth rail 56 Fourth Servo motor 57 Gripper 59 Propeller 60 Tray 62 Solid 70, 70' Robotic arm 72, 72' Gear set 74, 74' Tip set 90 Control module 135 Driver 31 Second frame 32 Feed zone 34 Storage area 36 good area 38 first guide 40 carriage 42 second guide 44 inner frame 46 timing gear set 51 underframe 53 fourth guide 55 lifting platform 58 annular frame 61 hole 71, 71' base 73, 73, fifth servo motor 76 image capturing device 16