JP5675239B2 - ウエハ検査用インターフェース及びウエハ検査装置 - Google Patents

ウエハ検査用インターフェース及びウエハ検査装置 Download PDF

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Publication number
JP5675239B2
JP5675239B2 JP2010207224A JP2010207224A JP5675239B2 JP 5675239 B2 JP5675239 B2 JP 5675239B2 JP 2010207224 A JP2010207224 A JP 2010207224A JP 2010207224 A JP2010207224 A JP 2010207224A JP 5675239 B2 JP5675239 B2 JP 5675239B2
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Japan
Prior art keywords
wafer
inspection
probe card
alignment
holder
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JP2010207224A
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English (en)
Japanese (ja)
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JP2012063227A (ja
JP2012063227A5 (https=
Inventor
浩史 山田
浩史 山田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010207224A priority Critical patent/JP5675239B2/ja
Priority to TW100132651A priority patent/TWI525727B/zh
Priority to US13/230,161 priority patent/US8975904B2/en
Priority to KR1020110092498A priority patent/KR101324348B1/ko
Priority to CN201110273307.5A priority patent/CN102401874B/zh
Publication of JP2012063227A publication Critical patent/JP2012063227A/ja
Publication of JP2012063227A5 publication Critical patent/JP2012063227A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2010207224A 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置 Active JP5675239B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010207224A JP5675239B2 (ja) 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置
TW100132651A TWI525727B (zh) 2010-09-15 2011-09-09 Wafer inspection interface and wafer inspection device
US13/230,161 US8975904B2 (en) 2010-09-15 2011-09-12 Wafer inspection interface and wafer inspection apparatus
KR1020110092498A KR101324348B1 (ko) 2010-09-15 2011-09-14 웨이퍼 검사용 인터페이스 장치 및 웨이퍼 검사 장치
CN201110273307.5A CN102401874B (zh) 2010-09-15 2011-09-15 晶片检查用接口和晶片检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010207224A JP5675239B2 (ja) 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置

Publications (3)

Publication Number Publication Date
JP2012063227A JP2012063227A (ja) 2012-03-29
JP2012063227A5 JP2012063227A5 (https=) 2013-10-10
JP5675239B2 true JP5675239B2 (ja) 2015-02-25

Family

ID=45806058

Family Applications (1)

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JP2010207224A Active JP5675239B2 (ja) 2010-09-15 2010-09-15 ウエハ検査用インターフェース及びウエハ検査装置

Country Status (5)

Country Link
US (1) US8975904B2 (https=)
JP (1) JP5675239B2 (https=)
KR (1) KR101324348B1 (https=)
CN (1) CN102401874B (https=)
TW (1) TWI525727B (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012023180A1 (ja) * 2010-08-17 2013-10-28 株式会社アドバンテスト 接続装置、それを備えた半導体ウェハ試験装置、及び接続方法
JP5889581B2 (ja) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP6001326B2 (ja) * 2012-05-23 2016-10-05 東京エレクトロン株式会社 プローブ装置及びプローブ装置用ウエハ載置台
JP5952645B2 (ja) 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
JP6099347B2 (ja) 2012-10-03 2017-03-22 東京エレクトロン株式会社 ウエハ取り付け方法及びウエハ検査装置
KR102138794B1 (ko) * 2013-03-18 2020-07-28 삼성전자주식회사 반도체 패키지 위치정렬트레이, 그를 이용하는 테스트 핸들러, 반도체 패키지 위치 정렬 방법, 그리고 그를 이용하는 반도체 패키지 테스트 방법
JP6267928B2 (ja) 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
CN105181157B (zh) * 2014-06-20 2017-07-28 沈阳芯源微电子设备有限公司 一种测温晶圆微调装置
JP5858312B1 (ja) * 2014-07-25 2016-02-10 株式会社東京精密 プロービング装置及びプローブコンタクト方法
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
JP6625423B2 (ja) * 2015-12-17 2019-12-25 東京エレクトロン株式会社 ウエハ検査装置及びそのメンテナンス方法
JP6283760B2 (ja) * 2017-03-14 2018-02-21 東京エレクトロン株式会社 ウエハ検査装置
JP6785375B2 (ja) * 2017-06-21 2020-11-18 東京エレクトロン株式会社 検査システム
JP3214100U (ja) * 2017-10-06 2017-12-21 ワイエイシイガーター株式会社 測定装置、及び分類装置
US10566256B2 (en) 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
JP7018368B2 (ja) * 2018-07-12 2022-02-10 東京エレクトロン株式会社 検査装置及び検査装置の清浄化方法
JP7170494B2 (ja) * 2018-10-15 2022-11-14 東京エレクトロン株式会社 中間接続部材及び検査装置
JP6700366B2 (ja) * 2018-11-05 2020-05-27 東京エレクトロン株式会社 ウエハ検査装置
JP6655703B2 (ja) * 2018-12-26 2020-02-26 東京エレクトロン株式会社 被整備テストヘッド及びウエハ検査装置
JP6903725B2 (ja) * 2018-12-26 2021-07-14 東京エレクトロン株式会社 ウエハ検査システム
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法
JPWO2021064788A1 (https=) * 2019-09-30 2021-04-08
JP7308776B2 (ja) * 2020-02-17 2023-07-14 東京エレクトロン株式会社 プローブカード保持装置及び検査装置
JP7382888B2 (ja) * 2020-04-06 2023-11-17 東京エレクトロン株式会社 検査装置、及び、検査装置の制御方法
JP2020145446A (ja) * 2020-04-30 2020-09-10 東京エレクトロン株式会社 ウエハ検査装置
TWM641397U (zh) * 2022-12-30 2023-05-21 致茂電子股份有限公司 晶圓檢測系統

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JP3648699B2 (ja) * 1997-02-03 2005-05-18 東京エレクトロン株式会社 ウエハの一括検査装置及びウエハの一括検査方法
JP3388271B2 (ja) * 1997-05-19 2003-03-17 東京エレクトロン株式会社 プローブ装置
JPH11163066A (ja) 1997-11-29 1999-06-18 Tokyo Electron Ltd ウエハ試験装置
JPH11186349A (ja) 1997-12-24 1999-07-09 Matsushita Electric Ind Co Ltd ウェハバーンイン装置
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6483336B1 (en) * 2000-05-03 2002-11-19 Cascade Microtech, Inc. Indexing rotatable chuck for a probe station
JP4544707B2 (ja) * 2000-07-17 2010-09-15 アピックヤマダ株式会社 ワークの搬送治具
JP3891798B2 (ja) * 2001-06-19 2007-03-14 松下電器産業株式会社 プローブ装置
US6885206B2 (en) * 2003-02-11 2005-04-26 Strasbaugh Device for supporting thin semiconductor wafers
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
TW200846668A (en) * 2007-01-23 2008-12-01 Nictech Co Ltd Probe and probe card having the same
JP5134864B2 (ja) * 2007-05-30 2013-01-30 株式会社日本マイクロニクス 半導体検査装置
JP4999615B2 (ja) * 2007-08-31 2012-08-15 東京エレクトロン株式会社 検査装置及び検査方法
KR100959372B1 (ko) * 2008-03-24 2010-05-24 미래산업 주식회사 반도체 소자 이송장치, 핸들러, 및 반도체 소자 제조방법
JP5258395B2 (ja) * 2008-06-03 2013-08-07 株式会社日本マイクロニクス プロービング装置
CN102301462A (zh) 2009-02-12 2011-12-28 株式会社爱德万测试 半导体晶片测试装置

Also Published As

Publication number Publication date
KR101324348B1 (ko) 2013-10-31
US20120062258A1 (en) 2012-03-15
KR20120028835A (ko) 2012-03-23
JP2012063227A (ja) 2012-03-29
CN102401874A (zh) 2012-04-04
TWI525727B (zh) 2016-03-11
CN102401874B (zh) 2014-10-08
US8975904B2 (en) 2015-03-10
TW201232688A (en) 2012-08-01

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