CN101752334A - 半导体集成电路器件 - Google Patents
半导体集成电路器件 Download PDFInfo
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- CN101752334A CN101752334A CN200910224397A CN200910224397A CN101752334A CN 101752334 A CN101752334 A CN 101752334A CN 200910224397 A CN200910224397 A CN 200910224397A CN 200910224397 A CN200910224397 A CN 200910224397A CN 101752334 A CN101752334 A CN 101752334A
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- semiconductor device
- bonding
- film
- metal film
- gold
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Abstract
Description
Claims (20)
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JP2008-308585 | 2008-12-03 | ||
JP2008308585 | 2008-12-03 | ||
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JP2009188913A JP5331610B2 (ja) | 2008-12-03 | 2009-08-18 | 半導体集積回路装置 |
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CN201310725962.9A Division CN103681595B (zh) | 2008-12-03 | 2009-12-02 | 半导体集成电路器件 |
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2011
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CN105514077A (zh) * | 2014-10-13 | 2016-04-20 | 通用电气公司 | 具有引线接合件的功率覆层结构和制造其的方法 |
CN105514077B (zh) * | 2014-10-13 | 2020-03-31 | 通用电气公司 | 具有引线接合件的功率覆层结构和制造其的方法 |
CN106052666A (zh) * | 2015-04-03 | 2016-10-26 | 精工爱普生株式会社 | 电子器件、电子器件的制造方法、电子设备以及移动体 |
CN106052666B (zh) * | 2015-04-03 | 2021-07-02 | 精工爱普生株式会社 | 电子器件、电子器件的制造方法、电子设备以及移动体 |
CN108666225A (zh) * | 2017-03-27 | 2018-10-16 | 瑞萨电子株式会社 | 制造半导体装置的方法 |
CN108666225B (zh) * | 2017-03-27 | 2023-09-15 | 瑞萨电子株式会社 | 制造半导体装置的方法 |
CN111354700A (zh) * | 2018-12-24 | 2020-06-30 | Nepes 株式会社 | 半导体封装件 |
CN117316909A (zh) * | 2023-11-28 | 2023-12-29 | 北京七星华创微电子有限责任公司 | 一种电子芯片及其制备方法 |
CN117316909B (zh) * | 2023-11-28 | 2024-02-27 | 北京七星华创微电子有限责任公司 | 一种电子芯片及其制备方法 |
Also Published As
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US8063489B2 (en) | 2011-11-22 |
US10818620B2 (en) | 2020-10-27 |
US9466559B2 (en) | 2016-10-11 |
CN103681595A (zh) | 2014-03-26 |
JP5331610B2 (ja) | 2013-10-30 |
US20100133688A1 (en) | 2010-06-03 |
US20130313708A1 (en) | 2013-11-28 |
US20120032329A1 (en) | 2012-02-09 |
JP2010157683A (ja) | 2010-07-15 |
US20170005048A1 (en) | 2017-01-05 |
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