JP6436531B2 - 半導体装置の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 238000000034 method Methods 0.000 claims description 37
- 238000007747 plating Methods 0.000 claims description 20
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Description
最初に本願発明の実施形態の内容を列記して説明する。
本願発明は、半導体層上に第1電極を形成する工程と、前記第1電極の上に、前記第1電極の一部が露出する開口部を有する第1絶縁膜を形成する工程と、前記開口部上および前記第1絶縁膜上に第2電極を形成する工程と、前記第2電極の側面を被覆し、前記第2電極の表面を露出する開口部を有するマスク層を形成する工程と、前記マスク層から露出した前記第2電極上に、第3電極を形成する工程と、前記マスク層を除去して、前記第2電極の側面を露出する工程と、前記第2電極および前記第3電極を被覆する第2絶縁膜を形成する工程と、を含む半導体装置の製造方法である。マスク層が第2電極の側面を被覆しているので、後に、このマスク層を除去すると、その下側の空間のアスペクト比の抑制された、第3電極を得ることができる。これにより、第2絶縁膜を形成したときに、第2電極と第3電極との間の空間における第2絶縁膜の薄膜化、膜質の劣化、および/または亀裂等の形成が抑制される。よって、水分の浸入が抑制され、半導体装置の信頼性が向上する。
本発明の実施形態にかかる半導体装置およびその製造方法の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
12、14、20、22、32 絶縁膜
16 オーミック電極
17 第1電極
18 バリア層
21 第1絶縁膜
24、52、56 開口部
26 電極
28 シード層
29 第3電極
30 めっき電極
34 ソース電極
36 ゲート電極
38 ドレイン電極
39 電極
50、54 マスク層
60 側面
62 縁領域
64 亀裂
66 凸部
68 アンダーカット
70 空間
Claims (5)
- 半導体層上に第1電極を形成する工程と、
前記第1電極の上に、前記第1電極の一部が露出する開口部を有する第1絶縁膜を形成する工程と、
前記開口部内の前記第1電極上から前記開口部の外縁の前記第1絶縁膜上にかけて、前記開口部の外縁における前記第1絶縁膜の上面よりも高い上面を有し、順テーパ状の側面を有する第2電極を形成する工程と、
前記第2電極の順テーパ状の側面を被覆し、前記第2電極の表面を露出する開口部を有するマスク層を形成する工程と、
前記マスク層から露出した前記第2電極上に、第3電極を形成する工程と、
前記マスク層を除去して、前記第2電極の順テーパ状の側面を露出する工程と、
前記第2電極および前記第3電極を被覆する第2絶縁膜を形成する工程と、
を含む半導体装置の製造方法。 - さらに、前記マスク層および前記マスク層の開口部に露出した前記第2電極の上面に、シード層を形成する工程と、
前記シード層に通電しためっき法により、前記第3電極を形成する工程と、
前記第3電極をマスクとして、前記第3電極に被覆されない前記シード層を除去する工程と、
前記シード層を除去する工程の後、前記マスク層を除去する工程と、
を含む請求項1に記載の半導体装置の製造方法。 - 前記マスク層の開口部は、前記第2電極の幅よりも狭い請求項1または2に記載の半導体装置の製造方法。
- 前記第2電極は、蒸着法によって形成される請求項1乃至3記載のいずれか一項に記載の半導体装置の製造方法。
- 前記第2電極は、前記第1絶縁膜の開口部よりも広い幅で形成される請求項1乃至4のいずれか一項に記載の半導体装置の製造方法。
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JP2015017416A JP6436531B2 (ja) | 2015-01-30 | 2015-01-30 | 半導体装置の製造方法 |
US15/010,559 US10199467B2 (en) | 2015-01-30 | 2016-01-29 | Semiconductor device having plated metal in electrode and process to form the same |
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JP6436531B2 true JP6436531B2 (ja) | 2018-12-12 |
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