CN101752334A - 半导体集成电路器件 - Google Patents

半导体集成电路器件 Download PDF

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Publication number
CN101752334A
CN101752334A CN200910224397A CN200910224397A CN101752334A CN 101752334 A CN101752334 A CN 101752334A CN 200910224397 A CN200910224397 A CN 200910224397A CN 200910224397 A CN200910224397 A CN 200910224397A CN 101752334 A CN101752334 A CN 101752334A
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China
Prior art keywords
semiconductor device
bonding
film
metal film
gold
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CN200910224397A
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English (en)
Chinese (zh)
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鴫原宏美
塚本博
矢岛明
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Renesas Electronics Corp
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Renesas Technology Corp
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Publication of CN101752334A publication Critical patent/CN101752334A/zh
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
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US8063489B2 (en) 2011-11-22
US20100133688A1 (en) 2010-06-03
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