CN101499340B - 陶瓷元件 - Google Patents

陶瓷元件 Download PDF

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Publication number
CN101499340B
CN101499340B CN2009100085136A CN200910008513A CN101499340B CN 101499340 B CN101499340 B CN 101499340B CN 2009100085136 A CN2009100085136 A CN 2009100085136A CN 200910008513 A CN200910008513 A CN 200910008513A CN 101499340 B CN101499340 B CN 101499340B
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CN
China
Prior art keywords
layer
ceramic
plating
protective layer
electrode
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CN2009100085136A
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English (en)
Chinese (zh)
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CN101499340A (zh
Inventor
中野睦子
小关恭二
相庭尚
村上幸弘
竹屋和人
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TDK Corp
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TDK Corp
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Publication of CN101499340A publication Critical patent/CN101499340A/zh
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Publication of CN101499340B publication Critical patent/CN101499340B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
CN2009100085136A 2008-01-28 2009-01-23 陶瓷元件 Active CN101499340B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-016637 2008-01-28
JP2008016637A JP4683052B2 (ja) 2008-01-28 2008-01-28 セラミック素子
JP2008016637 2008-01-28

Publications (2)

Publication Number Publication Date
CN101499340A CN101499340A (zh) 2009-08-05
CN101499340B true CN101499340B (zh) 2011-09-21

Family

ID=40899551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009100085136A Active CN101499340B (zh) 2008-01-28 2009-01-23 陶瓷元件

Country Status (5)

Country Link
US (1) US7813104B2 (https=)
JP (1) JP4683052B2 (https=)
KR (1) KR101055161B1 (https=)
CN (1) CN101499340B (https=)
TW (1) TW200949867A (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
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JP5324390B2 (ja) * 2009-10-22 2013-10-23 Ｔｄｋ株式会社 積層電子部品
JP5387484B2 (ja) * 2010-04-02 2014-01-15 Ｔｄｋ株式会社 チップ部品の製造方法
JP5770539B2 (ja) 2011-06-09 2015-08-26 Tdk株式会社 電子部品及び電子部品の製造方法
CN102982931A (zh) * 2011-09-06 2013-03-20 弗兰克·魏 电子陶瓷元件的局部涂层及其制作方法
KR101952845B1 (ko) * 2011-12-22 2019-02-28 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조 방법
JP5924543B2 (ja) * 2013-03-19 2016-05-25 株式会社村田製作所 積層セラミックコンデンサ
JP6398349B2 (ja) * 2013-08-23 2018-10-03 Tdk株式会社 積層型セラミック電子部品
TWI629696B (zh) * 2015-06-04 2018-07-11 日商村田製作所股份有限公司 Laminated ceramic electronic parts
TWI628678B (zh) * 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
KR101981466B1 (ko) * 2016-09-08 2019-05-24 주식회사 모다이노칩 파워 인덕터
KR102789017B1 (ko) * 2016-12-22 2025-04-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102319596B1 (ko) * 2017-04-11 2021-11-02 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102527062B1 (ko) 2017-09-21 2023-05-02 다이요 유덴 가부시키가이샤 세라믹 전자 부품 및 그 제조 방법
JP2019067793A (ja) * 2017-09-28 2019-04-25 Tdk株式会社 電子部品
US11037710B2 (en) 2018-07-18 2021-06-15 Avx Corporation Varistor passivation layer and method of making the same
JP7070840B2 (ja) * 2019-03-29 2022-05-18 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP7279574B2 (ja) * 2019-08-09 2023-05-23 株式会社村田製作所 電子部品及び電子部品の製造方法
CN111491404B (zh) * 2019-10-29 2022-04-12 珠海泓星科技有限公司 一种导电片作为电极的石墨烯玻璃烧水壶
JP2021182585A (ja) * 2020-05-19 2021-11-25 太陽誘電株式会社 積層セラミック電子部品の製造方法、積層セラミック電子部品及び回路基板
KR102946077B1 (ko) 2020-11-27 2026-04-01 삼성전기주식회사 적층형 커패시터
US12308172B2 (en) * 2020-12-08 2025-05-20 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor and board component having the same
JP7802462B2 (ja) * 2021-04-28 2026-01-20 Tdk株式会社 電子部品
CN113265636A (zh) * 2021-05-27 2021-08-17 江苏新林芝电子科技股份有限公司 一种提高陶瓷ptc热敏元件的抗还原性的方法
KR102895351B1 (ko) * 2021-08-27 2025-12-04 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법
JP7765255B2 (ja) * 2021-11-15 2025-11-06 Tdk株式会社 電子部品
KR20230103058A (ko) * 2021-12-31 2023-07-07 삼성전기주식회사 적층형 전자 부품
JP2023142120A (ja) * 2022-03-24 2023-10-05 パナソニックＩｐマネジメント株式会社 積層セラミック部品の製造方法及び積層セラミック部品

Citations (1)

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CN1503278A (zh) * 2002-10-29 2004-06-09 Tdk��ʽ���� 芯片状电子部件及其制造方法

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JPS62282410A (ja) * 1986-05-30 1987-12-08 松下電器産業株式会社 電圧非直線抵抗体素子の製造方法
JP2695639B2 (ja) * 1988-01-21 1998-01-14 日本碍子株式会社 電圧非直線抵抗体の製造方法
JP2695660B2 (ja) * 1989-06-05 1998-01-14 三菱電機株式会社 電圧非直線抵抗体
JP2976250B2 (ja) * 1991-08-08 1999-11-10 株式会社村田製作所 積層型バリスタの製造方法
JP3036567B2 (ja) 1991-12-20 2000-04-24 三菱マテリアル株式会社 導電性チップ型セラミック素子及びその製造方法
JP3255799B2 (ja) * 1994-07-05 2002-02-12 松下電器産業株式会社 電子部品の製造方法
JPH09148108A (ja) * 1995-11-24 1997-06-06 Matsushita Electric Ind Co Ltd 非直線抵抗体の製造方法
JPH11219804A (ja) * 1998-01-30 1999-08-10 Mitsubishi Materials Corp 薄膜サーミスタ
JPH11251120A (ja) * 1998-03-04 1999-09-17 Murata Mfg Co Ltd 積層チップバリスタの製造方法
JP2000164406A (ja) * 1998-11-25 2000-06-16 Murata Mfg Co Ltd チップ型電子部品とその製造方法
JP4637440B2 (ja) 2002-03-18 2011-02-23 太陽誘電株式会社 セラミック素子の製造方法
JP2004088040A (ja) * 2002-08-26 2004-03-18 Maruwa Co Ltd チップ状バリスタの製造方法
JP2007242995A (ja) * 2006-03-10 2007-09-20 Matsushita Electric Ind Co Ltd 積層セラミック電子部品とその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1503278A (zh) * 2002-10-29 2004-06-09 Tdk��ʽ���� 芯片状电子部件及其制造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2007-242995A 2007.09.20
JP特开平11-219804A 1999.08.10

Also Published As

Publication number Publication date
JP2009177085A (ja) 2009-08-06
KR101055161B1 (ko) 2011-08-08
KR20090082869A (ko) 2009-07-31
US20090191418A1 (en) 2009-07-30
CN101499340A (zh) 2009-08-05
US7813104B2 (en) 2010-10-12
TWI364043B (https=) 2012-05-11
TW200949867A (en) 2009-12-01
JP4683052B2 (ja) 2011-05-11

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