CN101447526B - 光电转换装置的制造方法 - Google Patents

光电转换装置的制造方法 Download PDF

Info

Publication number
CN101447526B
CN101447526B CN2008101796342A CN200810179634A CN101447526B CN 101447526 B CN101447526 B CN 101447526B CN 2008101796342 A CN2008101796342 A CN 2008101796342A CN 200810179634 A CN200810179634 A CN 200810179634A CN 101447526 B CN101447526 B CN 101447526B
Authority
CN
China
Prior art keywords
semiconductor layer
crystal semiconductor
single crystal
layer
photoelectric conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101796342A
Other languages
English (en)
Chinese (zh)
Other versions
CN101447526A (zh
Inventor
井坂史人
加藤翔
大力浩二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN101447526A publication Critical patent/CN101447526A/zh
Application granted granted Critical
Publication of CN101447526B publication Critical patent/CN101447526B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/16Photovoltaic cells having only PN heterojunction potential barriers
    • H10F10/161Photovoltaic cells having only PN heterojunction potential barriers comprising multiple PN heterojunctions, e.g. tandem cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/128Annealing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/16Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/162Non-monocrystalline materials, e.g. semiconductor particles embedded in insulating materials
    • H10F77/166Amorphous semiconductors
    • H10F77/1662Amorphous semiconductors including only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • H10F77/215Geometries of grid contacts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • H10F77/311Coatings for devices having potential barriers for photovoltaic cells
    • H10F77/315Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN2008101796342A 2007-11-30 2008-11-28 光电转换装置的制造方法 Expired - Fee Related CN101447526B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007310341 2007-11-30
JP2007310341 2007-11-30
JP2007-310341 2007-11-30

Publications (2)

Publication Number Publication Date
CN101447526A CN101447526A (zh) 2009-06-03
CN101447526B true CN101447526B (zh) 2013-09-11

Family

ID=40460006

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101796342A Expired - Fee Related CN101447526B (zh) 2007-11-30 2008-11-28 光电转换装置的制造方法

Country Status (4)

Country Link
US (3) US7858431B2 (https=)
EP (1) EP2065943A3 (https=)
JP (1) JP5248995B2 (https=)
CN (1) CN101447526B (https=)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
JP5248994B2 (ja) * 2007-11-30 2013-07-31 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JP5572307B2 (ja) * 2007-12-28 2014-08-13 株式会社半導体エネルギー研究所 光電変換装置の製造方法
EP2075850A3 (en) * 2007-12-28 2011-08-24 Semiconductor Energy Laboratory Co, Ltd. Photoelectric conversion device and manufacturing method thereof
JP5438986B2 (ja) * 2008-02-19 2014-03-12 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JP5654206B2 (ja) * 2008-03-26 2015-01-14 株式会社半導体エネルギー研究所 Soi基板の作製方法及び該soi基板を用いた半導体装置
US20090293954A1 (en) * 2008-05-30 2009-12-03 Semiconductor Energy Laboratory Co., Ltd. Photoelectric Conversion Device And Method For Manufacturing The Same
US8338218B2 (en) * 2008-06-26 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device module and manufacturing method of the photoelectric conversion device module
US7943414B2 (en) * 2008-08-01 2011-05-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
WO2010028177A1 (en) * 2008-09-03 2010-03-11 Sionyx, Inc. High sensitivity photodetectors, imaging arrays, and high efficiency photovoltaic devices produced using ion implantation and femtosecond laser irradiation
SG162675A1 (en) * 2008-12-15 2010-07-29 Semiconductor Energy Lab Manufacturing method of soi substrate and manufacturing method of semiconductor device
US8207051B2 (en) 2009-04-28 2012-06-26 Sionyx, Inc. Semiconductor surface modification
JP5415853B2 (ja) * 2009-07-10 2014-02-12 東京エレクトロン株式会社 表面処理方法
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
JP5961332B2 (ja) * 2009-09-17 2016-08-02 サイオニクス、エルエルシー 感光撮像素子および関連方法
JP5695312B2 (ja) * 2009-10-27 2015-04-01 ローム株式会社 有機el装置
JP5706670B2 (ja) * 2009-11-24 2015-04-22 株式会社半導体エネルギー研究所 Soi基板の作製方法
US8704083B2 (en) 2010-02-11 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and fabrication method thereof
US8741394B2 (en) * 2010-03-25 2014-06-03 Novellus Systems, Inc. In-situ deposition of film stacks
US9028924B2 (en) 2010-03-25 2015-05-12 Novellus Systems, Inc. In-situ deposition of film stacks
US8709551B2 (en) * 2010-03-25 2014-04-29 Novellus Systems, Inc. Smooth silicon-containing films
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
US8614495B2 (en) 2010-04-23 2013-12-24 Taiwan Semiconductor Manufacturing Company, Ltd. Back side defect reduction for back side illuminated image sensor
JP4967066B2 (ja) * 2010-04-27 2012-07-04 東京エレクトロン株式会社 アモルファスシリコン膜の成膜方法および成膜装置
JP5755931B2 (ja) 2010-04-28 2015-07-29 株式会社半導体エネルギー研究所 半導体膜の作製方法、電極の作製方法、2次電池の作製方法、および太陽電池の作製方法
CN103081128B (zh) 2010-06-18 2016-11-02 西奥尼克斯公司 高速光敏设备及相关方法
US9076909B2 (en) * 2010-06-18 2015-07-07 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
CN105679862A (zh) 2010-12-21 2016-06-15 西奥尼克斯公司 具有减少的衬底损伤的半导体器件和相关方法
JP5866768B2 (ja) * 2011-02-16 2016-02-17 セイコーエプソン株式会社 光電変換装置、電子機器
US9437758B2 (en) 2011-02-21 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device
CN106158895B9 (zh) 2011-03-10 2019-12-20 西奥尼克斯公司 三维传感器、系统和相关的方法
JP5692801B2 (ja) * 2011-03-30 2015-04-01 独立行政法人産業技術総合研究所 半導体の製造方法及び半導体装置
JP5584645B2 (ja) * 2011-03-31 2014-09-03 株式会社沖データ 半導体発光装置およびヘッドマウントディスプレイ装置
US20120291859A1 (en) * 2011-05-17 2012-11-22 Christopher Vineis Multi-Junction Semiconductor Photovoltaic Apparatus and Methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
JP2014525091A (ja) 2011-07-13 2014-09-25 サイオニクス、インク. 生体撮像装置および関連方法
JP2013058562A (ja) 2011-09-07 2013-03-28 Semiconductor Energy Lab Co Ltd 光電変換装置
US8865507B2 (en) 2011-09-16 2014-10-21 Sionyx, Inc. Integrated visible and infrared imager devices and associated methods
KR101654548B1 (ko) * 2011-12-26 2016-09-06 솔렉셀, 인크. 태양 전지에서 향상된 광 포획을 위한 시스템 및 방법
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
KR102025441B1 (ko) 2012-04-06 2019-09-25 노벨러스 시스템즈, 인코포레이티드 증착 후 소프트 어닐링
US9117668B2 (en) 2012-05-23 2015-08-25 Novellus Systems, Inc. PECVD deposition of smooth silicon films
US9388491B2 (en) 2012-07-23 2016-07-12 Novellus Systems, Inc. Method for deposition of conformal films with catalysis assisted low temperature CVD
US10094988B2 (en) * 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
CN102899633B (zh) * 2012-09-27 2014-05-21 东方电气集团(宜兴)迈吉太阳能科技有限公司 一种选择性发射极电池掩膜的制备方法
US8946062B2 (en) * 2012-11-21 2015-02-03 Guardian Industries Corp. Polycrystalline silicon thick films for photovoltaic devices or the like, and methods of making same
KR20140082012A (ko) * 2012-12-21 2014-07-02 엘지전자 주식회사 태양 전지 및 이의 제조 방법
US20140224434A1 (en) * 2013-02-14 2014-08-14 Crestron Electronics, Inc. Motorized roller shade with photovoltaic shade material
WO2014127376A2 (en) 2013-02-15 2014-08-21 Sionyx, Inc. High dynamic range cmos image sensor having anti-blooming properties and associated methods
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
US8895415B1 (en) 2013-05-31 2014-11-25 Novellus Systems, Inc. Tensile stressed doped amorphous silicon
WO2014209421A1 (en) 2013-06-29 2014-12-31 Sionyx, Inc. Shallow trench textured regions and associated methods
JP6459948B2 (ja) * 2015-12-15 2019-01-30 株式会社Sumco 半導体エピタキシャルウェーハの製造方法および固体撮像素子の製造方法
US10199526B2 (en) * 2017-04-28 2019-02-05 Infineon Technologies Ag Radiation detector and a method for forming a semiconductor device
CN113432229B (zh) * 2021-07-08 2023-01-10 深圳讴法科技有限公司 一种智能家居防护用分段式空气甲醛净化器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5840616A (en) * 1991-05-22 1998-11-24 Canon Kabushiki Kaisha Method for preparing semiconductor member

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180618A (en) * 1977-07-27 1979-12-25 Corning Glass Works Thin silicon film electronic device
US4727047A (en) * 1980-04-10 1988-02-23 Massachusetts Institute Of Technology Method of producing sheets of crystalline material
JPS57160179A (en) * 1981-03-28 1982-10-02 Tdk Corp Photodiode device and manufacture thereof
US4496788A (en) * 1982-12-29 1985-01-29 Osaka Transformer Co., Ltd. Photovoltaic device
US4633034A (en) * 1985-02-08 1986-12-30 Energy Conversion Devices, Inc. Photovoltaic device and method
JPS63196082A (ja) * 1987-02-10 1988-08-15 Toa Nenryo Kogyo Kk 太陽電池の製造方法
JPH01289173A (ja) * 1988-05-16 1989-11-21 Sharp Corp 太陽電池
SG59963A1 (en) * 1990-08-03 1999-02-22 Canon Kk Semiconductor member and process for preparing semiconductor member
US5750000A (en) * 1990-08-03 1998-05-12 Canon Kabushiki Kaisha Semiconductor member, and process for preparing same and semiconductor device formed by use of same
JP3242452B2 (ja) * 1992-06-19 2001-12-25 三菱電機株式会社 薄膜太陽電池の製造方法
JPH0644638A (ja) 1992-07-24 1994-02-18 Sony Corp 録音装置
JP3360919B2 (ja) * 1993-06-11 2003-01-07 三菱電機株式会社 薄膜太陽電池の製造方法,及び薄膜太陽電池
JP3381443B2 (ja) * 1995-02-02 2003-02-24 ソニー株式会社 基体から半導体層を分離する方法、半導体素子の製造方法およびsoi基板の製造方法
US5736431A (en) * 1995-02-28 1998-04-07 Semiconductor Energy Laboratory Co., Ltd. Method for producing thin film solar battery
JPH08255762A (ja) * 1995-03-17 1996-10-01 Nec Corp 半導体デバイスの製造方法
CN1132223C (zh) * 1995-10-06 2003-12-24 佳能株式会社 半导体衬底及其制造方法
JP3204986B2 (ja) * 1996-05-28 2001-09-04 ザ トラスティース オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上の半導体膜領域の結晶化処理及びこの方法により製造されたデバイス
JPH1093122A (ja) * 1996-09-10 1998-04-10 Nippon Telegr & Teleph Corp <Ntt> 薄膜太陽電池の製造方法
EP0849788B1 (en) * 1996-12-18 2004-03-10 Canon Kabushiki Kaisha Process for producing semiconductor article by making use of a substrate having a porous semiconductor layer
EP0851513B1 (en) * 1996-12-27 2007-11-21 Canon Kabushiki Kaisha Method of producing semiconductor member and method of producing solar cell
JPH10335683A (ja) * 1997-05-28 1998-12-18 Ion Kogaku Kenkyusho:Kk タンデム型太陽電池およびその製造方法
JPH1197379A (ja) 1997-07-25 1999-04-09 Denso Corp 半導体基板及び半導体基板の製造方法
US6534380B1 (en) * 1997-07-18 2003-03-18 Denso Corporation Semiconductor substrate and method of manufacturing the same
JPH11163363A (ja) 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US6331208B1 (en) * 1998-05-15 2001-12-18 Canon Kabushiki Kaisha Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
JP2000012864A (ja) * 1998-06-22 2000-01-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2000124092A (ja) * 1998-10-16 2000-04-28 Shin Etsu Handotai Co Ltd 水素イオン注入剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ
JP3327851B2 (ja) * 1998-10-27 2002-09-24 三菱重工業株式会社 太陽電池の製造方法
JP2000150940A (ja) * 1998-11-18 2000-05-30 Denso Corp 半導体微粒子集合体及びその製造方法
JP2000349264A (ja) * 1998-12-04 2000-12-15 Canon Inc 半導体ウエハの製造方法、使用方法および利用方法
US6468923B1 (en) 1999-03-26 2002-10-22 Canon Kabushiki Kaisha Method of producing semiconductor member
JP2001015721A (ja) * 1999-04-30 2001-01-19 Canon Inc 複合部材の分離方法及び薄膜の製造方法
US6387829B1 (en) * 1999-06-18 2002-05-14 Silicon Wafer Technologies, Inc. Separation process for silicon-on-insulator wafer fabrication
JP4452789B2 (ja) * 1999-09-01 2010-04-21 独立行政法人 日本原子力研究開発機構 シリコン系結晶薄板の製造方法および光電変換素子用基板の製造方法
JP2001160540A (ja) * 1999-09-22 2001-06-12 Canon Inc 半導体装置の製造方法、液相成長法及び液相成長装置、太陽電池
JP2001127313A (ja) * 1999-10-25 2001-05-11 Sony Corp 薄膜半導体素子およびその製造方法
JP3513592B2 (ja) * 2000-09-25 2004-03-31 独立行政法人産業技術総合研究所 太陽電池の製造方法
JP2002348198A (ja) 2001-05-28 2002-12-04 Nissin Electric Co Ltd 半導体素子エピタキシャル成長用基板及びその製造方法
US6818529B2 (en) * 2002-09-12 2004-11-16 Applied Materials, Inc. Apparatus and method for forming a silicon film across the surface of a glass substrate
JP2005268682A (ja) 2004-03-22 2005-09-29 Canon Inc 半導体基材及び太陽電池の製造方法
KR100615096B1 (ko) * 2004-11-15 2006-08-22 삼성전자주식회사 다중 채널을 갖는 모스 트랜지스터 제조방법
KR101100426B1 (ko) * 2005-05-10 2011-12-30 삼성전자주식회사 단결정 실리콘층을 포함하는 반도체 소자, 이를 포함하는반도체 장치 및 평면표시장치와 반도체 소자의 제조 방법
JP4644577B2 (ja) * 2005-09-30 2011-03-02 セイコーエプソン株式会社 半導体装置および半導体装置の製造方法
EP2002484A4 (en) * 2006-04-05 2016-06-08 Silicon Genesis Corp METHOD AND STRUCTURE FOR MANUFACTURING PHOTOVOLTAIC CELLS USING A LAYER TRANSFER PROCESS
KR100769065B1 (ko) 2006-05-18 2007-10-22 엘지전자 주식회사 플라즈마 디스플레이 장치의 히트싱크
JP2008112847A (ja) * 2006-10-30 2008-05-15 Shin Etsu Chem Co Ltd 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池
CN101652867B (zh) * 2007-04-06 2012-08-08 株式会社半导体能源研究所 光伏器件及其制造方法
JP5286046B2 (ja) 2007-11-30 2013-09-11 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JP5248994B2 (ja) * 2007-11-30 2013-07-31 株式会社半導体エネルギー研究所 光電変換装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5840616A (en) * 1991-05-22 1998-11-24 Canon Kabushiki Kaisha Method for preparing semiconductor member

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-348198A 2002.12.04
JP特开平11-163363A 1999.06.18
JP特开平11-97379A 1999.04.09

Also Published As

Publication number Publication date
CN101447526A (zh) 2009-06-03
US8143087B2 (en) 2012-03-27
EP2065943A2 (en) 2009-06-03
US20110092013A1 (en) 2011-04-21
JP5248995B2 (ja) 2013-07-31
JP2009152567A (ja) 2009-07-09
US20090142879A1 (en) 2009-06-04
EP2065943A3 (en) 2015-08-26
US7858431B2 (en) 2010-12-28
US8507313B2 (en) 2013-08-13
US20120184064A1 (en) 2012-07-19

Similar Documents

Publication Publication Date Title
CN101447526B (zh) 光电转换装置的制造方法
CN101471398B (zh) 光电转换装置的制造方法
JP5248994B2 (ja) 光電変換装置の製造方法
CN101567408B (zh) 光电转换装置的制造方法
JP5352190B2 (ja) 光電変換装置
JP5286046B2 (ja) 光電変換装置の製造方法
JP5459901B2 (ja) 光電変換装置モジュールの作製方法
CN101436618B (zh) 光电转换装置及其制造方法
JP5723204B2 (ja) 半導体基板の作製方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130911

Termination date: 20181128