CN101281368A - 黑色阻焊剂组合物及其固化物 - Google Patents
黑色阻焊剂组合物及其固化物 Download PDFInfo
- Publication number
- CN101281368A CN101281368A CNA2008100906241A CN200810090624A CN101281368A CN 101281368 A CN101281368 A CN 101281368A CN A2008100906241 A CNA2008100906241 A CN A2008100906241A CN 200810090624 A CN200810090624 A CN 200810090624A CN 101281368 A CN101281368 A CN 101281368A
- Authority
- CN
- China
- Prior art keywords
- black
- colorant
- pigment
- solder resist
- resist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-100685 | 2007-04-06 | ||
JP2007100685A JP4994923B2 (ja) | 2007-04-06 | 2007-04-06 | 黒色ソルダーレジスト組成物およびその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101281368A true CN101281368A (zh) | 2008-10-08 |
CN101281368B CN101281368B (zh) | 2011-07-13 |
Family
ID=39980670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100906241A Active CN101281368B (zh) | 2007-04-06 | 2008-04-02 | 黑色阻焊剂组合物及其固化物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4994923B2 (zh) |
KR (1) | KR20080091034A (zh) |
CN (1) | CN101281368B (zh) |
HK (1) | HK1121815A1 (zh) |
TW (2) | TW201337454A (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010091876A (ja) * | 2008-10-09 | 2010-04-22 | Taiyo Ink Mfg Ltd | 黒色ソルダーレジスト組成物及びその硬化物 |
CN102205472A (zh) * | 2010-03-30 | 2011-10-05 | 荒川化学工业株式会社 | 焊料用助焊剂和焊料组合物 |
CN102385244A (zh) * | 2010-06-11 | 2012-03-21 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN102725690A (zh) * | 2009-09-29 | 2012-10-10 | 太阳控股株式会社 | 感光性树脂组合物及其固化物、以及印刷电路板 |
CN102792225A (zh) * | 2010-03-31 | 2012-11-21 | 太阳控股株式会社 | 光固化性树脂组合物 |
CN103676476A (zh) * | 2012-09-05 | 2014-03-26 | 株式会社田村制作所 | 黑色固化性树脂组合物及使用该黑色固化性树脂组合物而得到的印刷布线基板 |
CN104062848A (zh) * | 2013-03-19 | 2014-09-24 | 奇美实业股份有限公司 | 感光性树脂组成物、黑色矩阵、彩色滤光片及液晶显示元件 |
CN104749883A (zh) * | 2013-12-30 | 2015-07-01 | 上海飞凯光电材料股份有限公司 | 一种光刻胶 |
CN104995225A (zh) * | 2013-03-28 | 2015-10-21 | 协立化学产业株式会社 | 紫外线固化性遮光用组合物 |
CN105785716A (zh) * | 2014-12-26 | 2016-07-20 | 上海飞凯光电材料股份有限公司 | 一种光刻胶 |
CN111381441A (zh) * | 2018-12-27 | 2020-07-07 | 株式会社田村制作所 | 黑色感光性树脂组合物 |
WO2021114409A1 (zh) * | 2019-12-13 | 2021-06-17 | Tcl华星光电技术有限公司 | 一种黑色光刻胶及其制备方法、显示面板 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5291893B2 (ja) * | 2007-05-08 | 2013-09-18 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物およびその硬化物 |
JP2012003225A (ja) | 2010-01-27 | 2012-01-05 | Fujifilm Corp | ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法 |
KR20130018229A (ko) * | 2010-03-26 | 2013-02-20 | 스미또모 베이크라이트 가부시키가이샤 | 감광성 수지 조성물 및 수광 장치 |
JP5757749B2 (ja) | 2010-05-19 | 2015-07-29 | 富士フイルム株式会社 | 重合性組成物 |
JP5544239B2 (ja) | 2010-07-29 | 2014-07-09 | 富士フイルム株式会社 | 重合性組成物 |
JP5731229B2 (ja) * | 2010-08-20 | 2015-06-10 | 株式会社タムラ製作所 | アルカリ可溶性透明樹脂組成物 |
JP5674399B2 (ja) | 2010-09-22 | 2015-02-25 | 富士フイルム株式会社 | 重合性組成物、感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法 |
JP5417364B2 (ja) | 2011-03-08 | 2014-02-12 | 富士フイルム株式会社 | 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法 |
JP2012237864A (ja) * | 2011-05-11 | 2012-12-06 | Kaneka Corp | 新規な黒色感光性樹脂組成物及びその利用 |
US10030133B2 (en) | 2011-12-06 | 2018-07-24 | Kaneka Corporation | Black photosensitive resin composition and use of same |
WO2013171888A1 (ja) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
JP5991040B2 (ja) * | 2012-06-22 | 2016-09-14 | 凸版印刷株式会社 | 黒色感光性樹脂組成物、ブラックマトリックス及びカラーフィルタ |
TWI586230B (zh) | 2012-07-18 | 2017-06-01 | 鐘化股份有限公司 | 補強板一體型軟性印刷基板 |
TWI627875B (zh) | 2012-07-18 | 2018-06-21 | 鐘化股份有限公司 | 導電層一體型軟性印刷基板 |
JP5695622B2 (ja) | 2012-09-24 | 2015-04-08 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物 |
JP6134187B2 (ja) * | 2013-04-03 | 2017-05-24 | 株式会社カネカ | 黒色感光性樹脂組成物及びその利用 |
WO2015025925A1 (ja) * | 2013-08-23 | 2015-02-26 | 味の素株式会社 | 感光性樹脂組成物 |
JP5670533B1 (ja) * | 2013-10-16 | 2015-02-18 | 台湾太陽油▲墨▼股▲分▼有限公司 | 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 |
JP6383621B2 (ja) | 2014-09-24 | 2018-08-29 | 太陽インキ製造株式会社 | 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法 |
WO2016092598A1 (ja) * | 2014-12-10 | 2016-06-16 | 互応化学工業株式会社 | ソルダーレジスト組成物及び被覆プリント配線板 |
JP6185943B2 (ja) * | 2015-02-10 | 2017-08-23 | 互応化学工業株式会社 | ソルダーレジスト組成物、被覆プリント配線板 |
KR102092910B1 (ko) * | 2015-06-30 | 2020-03-24 | 동우 화인켐 주식회사 | 착색 경화성 수지 조성물, 컬러 필터 및 표시 장치 |
JP6799949B2 (ja) * | 2015-07-21 | 2020-12-16 | 東友ファインケム株式会社Dongwoo Fine−Chem Co., Ltd. | 着色硬化性樹脂組成物、カラーフィルタ及び表示装置 |
JP6610069B2 (ja) * | 2015-08-06 | 2019-11-27 | 住友ベークライト株式会社 | ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法 |
JP6346228B2 (ja) * | 2015-09-29 | 2018-06-20 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP6764874B2 (ja) | 2015-11-06 | 2020-10-07 | 株式会社カネカ | 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板 |
TW201842064A (zh) | 2017-03-02 | 2018-12-01 | 日商捷恩智股份有限公司 | 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物 |
CN109254498B (zh) * | 2017-07-14 | 2023-07-14 | 株式会社田村制作所 | 感光性树脂组合物 |
JP6542435B2 (ja) * | 2017-07-14 | 2019-07-10 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP7052482B2 (ja) * | 2018-03-29 | 2022-04-12 | 住友ベークライト株式会社 | プリプレグ用樹脂組成物、プリプレグ、金属張積層板、プリント配線板、および半導体装置 |
JP7324595B2 (ja) * | 2018-03-30 | 2023-08-10 | 太陽ホールディングス株式会社 | 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板 |
WO2020021717A1 (ja) * | 2018-07-27 | 2020-01-30 | 東洋インキScホールディングス株式会社 | ドライレジストフィルム、ソルダーレジスト、電磁波シールドシート付きプリント配線板およびその製造方法、並びに電子機器 |
JP6465243B1 (ja) * | 2018-07-30 | 2019-02-06 | 東洋インキScホールディングス株式会社 | 電磁波シールドフィルム、プリント配線板および電子機器。 |
JP6455623B1 (ja) * | 2018-07-30 | 2019-01-23 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート付きプリント配線板 |
JP6843949B2 (ja) | 2018-12-27 | 2021-03-17 | 株式会社タムラ製作所 | 黒色感光性樹脂組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2552391B2 (ja) * | 1990-11-26 | 1996-11-13 | 出光興産株式会社 | 遮光膜およびその製造方法 |
JP4768924B2 (ja) * | 2001-03-30 | 2011-09-07 | 互応化学工業株式会社 | フォトソルダーレジストインク |
JP4809006B2 (ja) * | 2005-07-05 | 2011-11-02 | 太陽ホールディングス株式会社 | 着色感光性樹脂組成物及びその硬化物 |
JP2007071994A (ja) * | 2005-09-05 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | 黒色感光性樹脂組成物 |
-
2007
- 2007-04-06 JP JP2007100685A patent/JP4994923B2/ja active Active
-
2008
- 2008-04-02 CN CN2008100906241A patent/CN101281368B/zh active Active
- 2008-04-03 TW TW102119589A patent/TW201337454A/zh unknown
- 2008-04-03 TW TW097112333A patent/TWI428692B/zh active
- 2008-04-04 KR KR1020080031818A patent/KR20080091034A/ko not_active Application Discontinuation
-
2009
- 2009-02-26 HK HK09101842.9A patent/HK1121815A1/xx unknown
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010091876A (ja) * | 2008-10-09 | 2010-04-22 | Taiyo Ink Mfg Ltd | 黒色ソルダーレジスト組成物及びその硬化物 |
US9282644B2 (en) | 2009-09-29 | 2016-03-08 | Taiyo Holdings Co., Ltd. | Photosensitive resin composition, cured product thereof, and printed wiring board |
CN102725690A (zh) * | 2009-09-29 | 2012-10-10 | 太阳控股株式会社 | 感光性树脂组合物及其固化物、以及印刷电路板 |
CN102205472B (zh) * | 2010-03-30 | 2014-10-15 | 荒川化学工业株式会社 | 焊料用助焊剂和焊料组合物 |
CN102205472A (zh) * | 2010-03-30 | 2011-10-05 | 荒川化学工业株式会社 | 焊料用助焊剂和焊料组合物 |
CN102792225A (zh) * | 2010-03-31 | 2012-11-21 | 太阳控股株式会社 | 光固化性树脂组合物 |
CN102792225B (zh) * | 2010-03-31 | 2016-01-20 | 太阳控股株式会社 | 光固化性树脂组合物 |
CN102385244A (zh) * | 2010-06-11 | 2012-03-21 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN102385244B (zh) * | 2010-06-11 | 2015-06-10 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN103676476B (zh) * | 2012-09-05 | 2019-08-09 | 株式会社田村制作所 | 黑色固化性树脂组合物及使用其得到的印刷布线基板 |
CN103676476A (zh) * | 2012-09-05 | 2014-03-26 | 株式会社田村制作所 | 黑色固化性树脂组合物及使用该黑色固化性树脂组合物而得到的印刷布线基板 |
CN104062848A (zh) * | 2013-03-19 | 2014-09-24 | 奇美实业股份有限公司 | 感光性树脂组成物、黑色矩阵、彩色滤光片及液晶显示元件 |
CN104995225A (zh) * | 2013-03-28 | 2015-10-21 | 协立化学产业株式会社 | 紫外线固化性遮光用组合物 |
CN104995225B (zh) * | 2013-03-28 | 2018-06-08 | 协立化学产业株式会社 | 紫外线固化性遮光用组合物 |
CN104749883A (zh) * | 2013-12-30 | 2015-07-01 | 上海飞凯光电材料股份有限公司 | 一种光刻胶 |
CN104749883B (zh) * | 2013-12-30 | 2022-04-01 | 上海飞凯光电材料股份有限公司 | 一种光刻胶 |
CN105785716A (zh) * | 2014-12-26 | 2016-07-20 | 上海飞凯光电材料股份有限公司 | 一种光刻胶 |
CN111381441A (zh) * | 2018-12-27 | 2020-07-07 | 株式会社田村制作所 | 黑色感光性树脂组合物 |
WO2021114409A1 (zh) * | 2019-12-13 | 2021-06-17 | Tcl华星光电技术有限公司 | 一种黑色光刻胶及其制备方法、显示面板 |
Also Published As
Publication number | Publication date |
---|---|
TWI428692B (zh) | 2014-03-01 |
TW200907566A (en) | 2009-02-16 |
HK1121815A1 (en) | 2009-04-30 |
KR20080091034A (ko) | 2008-10-09 |
JP4994923B2 (ja) | 2012-08-08 |
TWI561917B (zh) | 2016-12-11 |
CN101281368B (zh) | 2011-07-13 |
JP2008257045A (ja) | 2008-10-23 |
TW201337454A (zh) | 2013-09-16 |
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