HK1121815A1 - Black solder resist composition and cured product thereof - Google Patents

Black solder resist composition and cured product thereof

Info

Publication number
HK1121815A1
HK1121815A1 HK09101842.9A HK09101842A HK1121815A1 HK 1121815 A1 HK1121815 A1 HK 1121815A1 HK 09101842 A HK09101842 A HK 09101842A HK 1121815 A1 HK1121815 A1 HK 1121815A1
Authority
HK
Hong Kong
Prior art keywords
cured product
resist composition
solder resist
black solder
black
Prior art date
Application number
HK09101842.9A
Other languages
English (en)
Inventor
Shuichi Yamamoto
Chiho Ueta
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39980670&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1121815(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of HK1121815A1 publication Critical patent/HK1121815A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK09101842.9A 2007-04-06 2009-02-26 Black solder resist composition and cured product thereof HK1121815A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007100685A JP4994923B2 (ja) 2007-04-06 2007-04-06 黒色ソルダーレジスト組成物およびその硬化物

Publications (1)

Publication Number Publication Date
HK1121815A1 true HK1121815A1 (en) 2009-04-30

Family

ID=39980670

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09101842.9A HK1121815A1 (en) 2007-04-06 2009-02-26 Black solder resist composition and cured product thereof

Country Status (5)

Country Link
JP (1) JP4994923B2 (xx)
KR (1) KR20080091034A (xx)
CN (1) CN101281368B (xx)
HK (1) HK1121815A1 (xx)
TW (2) TWI428692B (xx)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP5380034B2 (ja) * 2008-10-09 2014-01-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物及びその硬化物
JP5306952B2 (ja) * 2009-09-29 2013-10-02 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにプリント配線板
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
KR20130018229A (ko) * 2010-03-26 2013-02-20 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물 및 수광 장치
TWI546150B (zh) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
KR20130040780A (ko) * 2010-03-31 2013-04-24 다이요 홀딩스 가부시키가이샤 광경화성 수지 조성물
JP5757749B2 (ja) 2010-05-19 2015-07-29 富士フイルム株式会社 重合性組成物
JP5007453B2 (ja) * 2010-06-11 2012-08-22 株式会社タムラ製作所 黒色硬化性樹脂組成物
JP5544239B2 (ja) 2010-07-29 2014-07-09 富士フイルム株式会社 重合性組成物
JP5731229B2 (ja) * 2010-08-20 2015-06-10 株式会社タムラ製作所 アルカリ可溶性透明樹脂組成物
JP5674399B2 (ja) 2010-09-22 2015-02-25 富士フイルム株式会社 重合性組成物、感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
JP5417364B2 (ja) 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
JP2012237864A (ja) * 2011-05-11 2012-12-06 Kaneka Corp 新規な黒色感光性樹脂組成物及びその利用
KR101596897B1 (ko) 2011-12-06 2016-02-24 가부시키가이샤 가네카 흑색 감광성 수지 조성물 및 그 이용
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5991040B2 (ja) * 2012-06-22 2016-09-14 凸版印刷株式会社 黒色感光性樹脂組成物、ブラックマトリックス及びカラーフィルタ
TWI627875B (zh) 2012-07-18 2018-06-21 鐘化股份有限公司 導電層一體型軟性印刷基板
TWI586230B (zh) 2012-07-18 2017-06-01 鐘化股份有限公司 補強板一體型軟性印刷基板
JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
JP5695622B2 (ja) 2012-09-24 2015-04-08 株式会社タムラ製作所 黒色硬化性樹脂組成物
TWI484295B (zh) * 2013-03-19 2015-05-11 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及液晶顯示元件
WO2014156424A1 (ja) * 2013-03-28 2014-10-02 協立化学産業株式会社 紫外線硬化性遮光用組成物
JP6134187B2 (ja) * 2013-04-03 2017-05-24 株式会社カネカ 黒色感光性樹脂組成物及びその利用
JP6561832B2 (ja) * 2013-08-23 2019-08-21 味の素株式会社 感光性樹脂組成物
JP5670533B1 (ja) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
CN104749883B (zh) * 2013-12-30 2022-04-01 上海飞凯光电材料股份有限公司 一种光刻胶
JP6383621B2 (ja) 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
WO2016092598A1 (ja) 2014-12-10 2016-06-16 互応化学工業株式会社 ソルダーレジスト組成物及び被覆プリント配線板
CN105785716A (zh) * 2014-12-26 2016-07-20 上海飞凯光电材料股份有限公司 一种光刻胶
JP6185943B2 (ja) * 2015-02-10 2017-08-23 互応化学工業株式会社 ソルダーレジスト組成物、被覆プリント配線板
KR102092910B1 (ko) * 2015-06-30 2020-03-24 동우 화인켐 주식회사 착색 경화성 수지 조성물, 컬러 필터 및 표시 장치
JP6799949B2 (ja) * 2015-07-21 2020-12-16 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． 着色硬化性樹脂組成物、カラーフィルタ及び表示装置
JP6610069B2 (ja) * 2015-08-06 2019-11-27 住友ベークライト株式会社 ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法
JP6346228B2 (ja) * 2015-09-29 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
KR102590211B1 (ko) 2015-11-06 2023-10-18 가부시키가이샤 가네카 흑색 수지 조성물, 흑색 수지 경화막을 갖는 폴리이미드와 그의 제조 방법 및 흑색 수지 경화막을 사용한 플렉시블 프린트 배선 기판
TW201842064A (zh) 2017-03-02 2018-12-01 日商捷恩智股份有限公司 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物
CN109254498B (zh) * 2017-07-14 2023-07-14 株式会社田村制作所 感光性树脂组合物
JP6542435B2 (ja) * 2017-07-14 2019-07-10 株式会社タムラ製作所 感光性樹脂組成物
JP7052482B2 (ja) * 2018-03-29 2022-04-12 住友ベークライト株式会社 プリプレグ用樹脂組成物、プリプレグ、金属張積層板、プリント配線板、および半導体装置
JP7324595B2 (ja) * 2018-03-30 2023-08-10 太陽ホールディングス株式会社 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板
WO2020021717A1 (ja) * 2018-07-27 2020-01-30 東洋インキＳｃホールディングス株式会社 ドライレジストフィルム、ソルダーレジスト、電磁波シールドシート付きプリント配線板およびその製造方法、並びに電子機器
JP6455623B1 (ja) * 2018-07-30 2019-01-23 東洋インキＳｃホールディングス株式会社 電磁波シールドシート付きプリント配線板
JP6465243B1 (ja) * 2018-07-30 2019-02-06 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム、プリント配線板および電子機器。
CN111381441A (zh) * 2018-12-27 2020-07-07 株式会社田村制作所 黑色感光性树脂组合物
JP6843949B2 (ja) 2018-12-27 2021-03-17 株式会社タムラ製作所 黒色感光性樹脂組成物
CN111077730A (zh) * 2019-12-13 2020-04-28 Tcl华星光电技术有限公司 一种黑色光刻胶及其制备方法、显示面板、显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552391B2 (ja) * 1990-11-26 1996-11-13 出光興産株式会社 遮光膜およびその製造方法
JP4768924B2 (ja) * 2001-03-30 2011-09-07 互応化学工業株式会社 フォトソルダーレジストインク
JP4809006B2 (ja) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 着色感光性樹脂組成物及びその硬化物
JP2007071994A (ja) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd 黒色感光性樹脂組成物

Also Published As

Publication number Publication date
CN101281368A (zh) 2008-10-08
TW200907566A (en) 2009-02-16
JP2008257045A (ja) 2008-10-23
TWI428692B (zh) 2014-03-01
TWI561917B (xx) 2016-12-11
KR20080091034A (ko) 2008-10-09
JP4994923B2 (ja) 2012-08-08
TW201337454A (zh) 2013-09-16
CN101281368B (zh) 2011-07-13

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