HK1121815A1 - Black solder resist composition and cured product thereof - Google Patents

Black solder resist composition and cured product thereof

Info

Publication number
HK1121815A1
HK1121815A1 HK09101842.9A HK09101842A HK1121815A1 HK 1121815 A1 HK1121815 A1 HK 1121815A1 HK 09101842 A HK09101842 A HK 09101842A HK 1121815 A1 HK1121815 A1 HK 1121815A1
Authority
HK
Hong Kong
Prior art keywords
cured product
resist composition
solder resist
black solder
black
Prior art date
Application number
HK09101842.9A
Inventor
Shuichi Yamamoto
Chiho Ueta
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39980670&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1121815(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of HK1121815A1 publication Critical patent/HK1121815A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK09101842.9A 2007-04-06 2009-02-26 Black solder resist composition and cured product thereof HK1121815A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007100685A JP4994923B2 (en) 2007-04-06 2007-04-06 Black solder resist composition and cured product thereof

Publications (1)

Publication Number Publication Date
HK1121815A1 true HK1121815A1 (en) 2009-04-30

Family

ID=39980670

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09101842.9A HK1121815A1 (en) 2007-04-06 2009-02-26 Black solder resist composition and cured product thereof

Country Status (5)

Country Link
JP (1) JP4994923B2 (en)
KR (1) KR20080091034A (en)
CN (1) CN101281368B (en)
HK (1) HK1121815A1 (en)
TW (2) TW201337454A (en)

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JP5291893B2 (en) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 Photocurable resin composition and cured product thereof
JP5380034B2 (en) * 2008-10-09 2014-01-08 太陽ホールディングス株式会社 Black solder resist composition and cured product thereof
JP5306952B2 (en) 2009-09-29 2013-10-02 太陽ホールディングス株式会社 Photosensitive resin composition and cured product thereof, and printed wiring board
JP2012003225A (en) * 2010-01-27 2012-01-05 Fujifilm Corp Polymerizable composition for solder resist and method for forming solder resist pattern
KR20130018229A (en) * 2010-03-26 2013-02-20 스미또모 베이크라이트 가부시키가이샤 Photosensitive resin composition and light receiving device
TWI546150B (en) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
CN102792225B (en) * 2010-03-31 2016-01-20 太阳控股株式会社 Photocurable resin composition
JP5757749B2 (en) 2010-05-19 2015-07-29 富士フイルム株式会社 Polymerizable composition
JP5007453B2 (en) * 2010-06-11 2012-08-22 株式会社タムラ製作所 Black curable resin composition
JP5544239B2 (en) 2010-07-29 2014-07-09 富士フイルム株式会社 Polymerizable composition
JP5731229B2 (en) * 2010-08-20 2015-06-10 株式会社タムラ製作所 Alkali-soluble transparent resin composition
JP5674399B2 (en) 2010-09-22 2015-02-25 富士フイルム株式会社 Polymerizable composition, photosensitive layer, permanent pattern, wafer level lens, solid-state imaging device, and pattern forming method
JP5417364B2 (en) 2011-03-08 2014-02-12 富士フイルム株式会社 Curable composition for solid-state imaging device, photosensitive layer, permanent pattern, wafer level lens, solid-state imaging device, and pattern forming method using the same
JP2012237864A (en) * 2011-05-11 2012-12-06 Kaneka Corp Novel black photosensitive resin composition and use of the same
KR101596897B1 (en) 2011-12-06 2016-02-24 가부시키가이샤 가네카 Black photosensitive resin composition and use of same
WO2013171888A1 (en) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 Alkali-development-type thermoset resin composition and printed circuit board
JP5991040B2 (en) * 2012-06-22 2016-09-14 凸版印刷株式会社 Black photosensitive resin composition, black matrix and color filter
TWI586230B (en) 2012-07-18 2017-06-01 鐘化股份有限公司 Reinforcing plate-integrated flexible printed circuit
TWI627875B (en) 2012-07-18 2018-06-21 鐘化股份有限公司 Conductive layer-integrated flexible printed circuit
JP5766671B2 (en) * 2012-09-05 2015-08-19 株式会社タムラ製作所 Black curable resin composition and printed wiring board using the same
JP5695622B2 (en) 2012-09-24 2015-04-08 株式会社タムラ製作所 Black curable resin composition
KR101658374B1 (en) * 2013-01-25 2016-09-22 롬엔드하스전자재료코리아유한회사 Colored photosensitive resin composition with dual property for column spacer and black matrix
TWI484295B (en) * 2013-03-19 2015-05-11 Chi Mei Corp Photosensitive resin composition, black matrix, color filter and liquid crystal display element
CN104995225B (en) * 2013-03-28 2018-06-08 协立化学产业株式会社 Ultra-violet solidified shading composition
JP6134187B2 (en) * 2013-04-03 2017-05-24 株式会社カネカ Black photosensitive resin composition and use thereof
WO2015025925A1 (en) * 2013-08-23 2015-02-26 味の素株式会社 Photosensitive resin composition
JP5670533B1 (en) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 Thermosetting resin composition, cured product thereof, and display member using the same
CN104749883B (en) * 2013-12-30 2022-04-01 上海飞凯光电材料股份有限公司 Photoresist
JP6383621B2 (en) 2014-09-24 2018-08-29 太陽インキ製造株式会社 Curable composition, dry film, cured product, printed wiring board and method for producing printed wiring board
JP6368380B2 (en) 2014-12-10 2018-08-01 互応化学工業株式会社 Solder resist composition and coated printed wiring board
CN105785716A (en) * 2014-12-26 2016-07-20 上海飞凯光电材料股份有限公司 Photoresist
JP6185943B2 (en) * 2015-02-10 2017-08-23 互応化学工業株式会社 Solder resist composition, coated printed wiring board
KR102092910B1 (en) * 2015-06-30 2020-03-24 동우 화인켐 주식회사 Colored photosensitive resin composition, color filter and display device
JP6799949B2 (en) * 2015-07-21 2020-12-16 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． Color curable resin composition, color filter and display device
JP6610069B2 (en) * 2015-08-06 2019-11-27 住友ベークライト株式会社 Resin composition for solder resist, resin film with carrier, wiring board, electronic device, and method of manufacturing electronic device
JP6346228B2 (en) * 2015-09-29 2018-06-20 株式会社タムラ製作所 Photosensitive resin composition
TWI664495B (en) 2015-11-06 2019-07-01 日商鐘化股份有限公司 Black resin composition, polyimide with cured black resin film, method for producing the polyimide, and flexible printed wiring substrate using the cured black resin film
TW201842064A (en) 2017-03-02 2018-12-01 日商捷恩智股份有限公司 Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet
JP6542435B2 (en) * 2017-07-14 2019-07-10 株式会社タムラ製作所 Photosensitive resin composition
CN109254498B (en) * 2017-07-14 2023-07-14 株式会社田村制作所 Photosensitive resin composition
JP7052482B2 (en) * 2018-03-29 2022-04-12 住友ベークライト株式会社 Resin compositions for prepregs, prepregs, metal-clad laminates, printed wiring boards, and semiconductor devices
JP7324595B2 (en) * 2018-03-30 2023-08-10 太陽ホールディングス株式会社 Black photosensitive resin composition, cured product thereof, and rigid flexible printed wiring board
WO2020021717A1 (en) * 2018-07-27 2020-01-30 東洋インキＳｃホールディングス株式会社 Dry resist film, solder resist, printed wiring board with electromagnetic wave shield sheet and method for manufacturing same, and electronic device
JP6465243B1 (en) * 2018-07-30 2019-02-06 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding film, printed wiring board and electronic equipment.
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JP6843949B2 (en) 2018-12-27 2021-03-17 株式会社タムラ製作所 Black photosensitive resin composition
CN111381441A (en) * 2018-12-27 2020-07-07 株式会社田村制作所 Black photosensitive resin composition
CN111077730A (en) * 2019-12-13 2020-04-28 Tcl华星光电技术有限公司 Black photoresist, preparation method thereof, display panel and display device

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JP4768924B2 (en) * 2001-03-30 2011-09-07 互応化学工業株式会社 Photo solder resist ink
JP4809006B2 (en) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 Colored photosensitive resin composition and cured product thereof
JP2007071994A (en) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd Black photosensitive resin composition

Also Published As

Publication number Publication date
KR20080091034A (en) 2008-10-09
CN101281368B (en) 2011-07-13
TW200907566A (en) 2009-02-16
TWI561917B (en) 2016-12-11
JP2008257045A (en) 2008-10-23
JP4994923B2 (en) 2012-08-08
TW201337454A (en) 2013-09-16
TWI428692B (en) 2014-03-01
CN101281368A (en) 2008-10-08

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