HK1121816A1 - Solder resist composition and cured product thereof - Google Patents

Solder resist composition and cured product thereof

Info

Publication number
HK1121816A1
HK1121816A1 HK09101843.8A HK09101843A HK1121816A1 HK 1121816 A1 HK1121816 A1 HK 1121816A1 HK 09101843 A HK09101843 A HK 09101843A HK 1121816 A1 HK1121816 A1 HK 1121816A1
Authority
HK
Hong Kong
Prior art keywords
cured product
resist composition
solder resist
solder
composition
Prior art date
Application number
HK09101843.8A
Inventor
Chiho Ueta
Shuichi Yamamoto
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of HK1121816A1 publication Critical patent/HK1121816A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK09101843.8A 2007-04-06 2009-02-26 Solder resist composition and cured product thereof HK1121816A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007100684A JP4994922B2 (en) 2007-04-06 2007-04-06 Solder resist composition and cured product thereof

Publications (1)

Publication Number Publication Date
HK1121816A1 true HK1121816A1 (en) 2009-04-30

Family

ID=39980669

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09101843.8A HK1121816A1 (en) 2007-04-06 2009-02-26 Solder resist composition and cured product thereof

Country Status (5)

Country Link
JP (1) JP4994922B2 (en)
KR (1) KR100973643B1 (en)
CN (1) CN101281367B (en)
HK (1) HK1121816A1 (en)
TW (1) TWI399614B (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061938B2 (en) * 2008-02-14 2012-10-31 日立化成工業株式会社 Photosensitive resin composition, and photosensitive element and permanent mask resist using the same
JP2010235799A (en) * 2009-03-31 2010-10-21 Taiyo Ink Mfg Ltd Curable resin composition and printed wiring board and reflector using the same
JP6054012B2 (en) * 2009-03-31 2016-12-27 太陽ホールディングス株式会社 Curable resin composition and printed wiring board and reflector using the same
JP5352340B2 (en) * 2009-05-13 2013-11-27 株式会社タムラ製作所 Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board
WO2011030580A1 (en) * 2009-09-10 2011-03-17 積水化学工業株式会社 Photosensitive composition and printed wiring board
JP5325805B2 (en) * 2010-01-29 2013-10-23 株式会社タムラ製作所 Photosensitive resin composition and printed wiring board using cured film thereof
JP2011170050A (en) * 2010-02-17 2011-09-01 Taiyo Holdings Co Ltd Solder resist composition and printed circuit board
JP4975834B2 (en) * 2010-02-17 2012-07-11 太陽ホールディングス株式会社 Solder resist composition and printed wiring board
JP6061440B2 (en) * 2010-02-25 2017-01-18 太陽ホールディングス株式会社 Resin composition for polyester substrate, dry film and printed wiring board using the same
JP2011227308A (en) * 2010-04-20 2011-11-10 Taiyo Holdings Co Ltd Solder resist composition and print circuit board
KR20120137391A (en) * 2010-03-31 2012-12-20 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed circuit board
JP5820568B2 (en) * 2010-03-31 2015-11-24 太陽ホールディングス株式会社 Curable resin composition, dry film and printed wiring board using the same
JP2011215384A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Solder resist composition and printed-circuit board
JP5566200B2 (en) 2010-06-18 2014-08-06 新光電気工業株式会社 Wiring board and manufacturing method thereof
JP6130693B2 (en) 2012-03-30 2017-05-17 太陽インキ製造株式会社 Laminated structure, dry film, and manufacturing method of laminated structure
WO2013171888A1 (en) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 Alkali-development-type thermoset resin composition and printed circuit board
JP6240399B2 (en) * 2012-05-29 2017-11-29 太陽インキ製造株式会社 Photosensitive composition and printed wiring board having cured layer thereof
JP5766671B2 (en) * 2012-09-05 2015-08-19 株式会社タムラ製作所 Black curable resin composition and printed wiring board using the same
JP5695622B2 (en) * 2012-09-24 2015-04-08 株式会社タムラ製作所 Black curable resin composition
JP5450763B2 (en) * 2012-10-26 2014-03-26 太陽ホールディングス株式会社 Curable resin composition, dry film and printed wiring board using the same
JP2013033282A (en) * 2012-10-26 2013-02-14 Taiyo Holdings Co Ltd Curable resin composition, and dry film and printed wiring board using the same
JP5876862B2 (en) * 2013-12-03 2016-03-02 太陽ホールディングス株式会社 Resin composition for polyester substrate, dry film and printed wiring board using the same
CN103676285A (en) * 2013-12-31 2014-03-26 京东方科技集团股份有限公司 COF (Chip On Film) and liquid crystal display device
JP6019065B2 (en) * 2014-07-08 2016-11-02 太陽ホールディングス株式会社 Solder resist composition and printed wiring board
JP6448447B2 (en) 2015-04-07 2019-01-09 日本化薬株式会社 White active energy ray-curable resin composition
JP6078595B2 (en) * 2015-07-27 2017-02-08 太陽ホールディングス株式会社 Curable resin composition and printed wiring board and reflector using the same
JP6421092B2 (en) * 2015-07-31 2018-11-07 日立オートモティブシステムズ株式会社 Physical quantity detection device
JP6607811B2 (en) * 2016-03-11 2019-11-20 マクセルホールディングス株式会社 Plating parts manufacturing method, plating parts, catalytic activity interference agent and electroless plating composite material
JP6783600B2 (en) * 2016-09-20 2020-11-11 太陽インキ製造株式会社 Curable resin composition, dry film, printed wiring board, and method for manufacturing printed wiring board
CN107329368B (en) * 2017-07-05 2020-08-14 江苏广信感光新材料股份有限公司 Alkali-soluble photosensitive composition, and preparation method and application thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191352A (en) * 1989-12-15 1991-08-21 W R Grace & Co Photosensitive resin composite
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
JP4768924B2 (en) * 2001-03-30 2011-09-07 互応化学工業株式会社 Photo solder resist ink
JP4328645B2 (en) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and printed wiring board using the same
JP4339805B2 (en) * 2004-03-16 2009-10-07 株式会社日本触媒 Photosensitive resin composition for image formation
JP4709747B2 (en) * 2004-03-31 2011-06-22 太陽ホールディングス株式会社 Active energy ray-curable resin, photocurable / thermosetting resin composition containing the same, and cured product thereof
JP4587865B2 (en) * 2004-04-22 2010-11-24 昭和電工株式会社 Photosensitive resin composition, cured product thereof, and method for producing printed wiring board using them
TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
JP2006040935A (en) 2004-07-22 2006-02-09 Taiyo Ink Mfg Ltd Photosetting/thermosetting matt solder resist ink composition and printed circuit board using it
JP4501662B2 (en) * 2004-12-06 2010-07-14 東亞合成株式会社 Photosensitive composition and solder resist

Also Published As

Publication number Publication date
CN101281367A (en) 2008-10-08
KR20080091035A (en) 2008-10-09
CN101281367B (en) 2011-07-06
KR100973643B1 (en) 2010-08-02
TWI399614B (en) 2013-06-21
TW200905384A (en) 2009-02-01
JP2008257044A (en) 2008-10-23
JP4994922B2 (en) 2012-08-08

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