JP6421092B2 - Physical quantity detection device - Google Patents

Description

  The present invention relates to a physical quantity detection device for intake air of an internal combustion engine.

  Patent Document 1 is a publication relating to a printed circuit board inspection method and a printed circuit board. In particular, it is described that a printed circuit board is covered with a coating material.

JP 2003-78233 A

  However, the structure for coating a printed circuit board shown in Patent Document 1 is a structure for coating the side surface of the entire printed circuit board. There is a concern that a structure that covers all sides with a coating is difficult to build a process. The resist forms a coating film on the front and back planes of the printed circuit board. However, if the coating is applied to the entire side of the board, the manufacturing process will take a lot of man-hours, which may increase costs and increase the quality of the side coating. is there. Moreover, since the coating material formed on the side surface of the printed circuit board is not specific, it is difficult to realize it.

  The present invention has been made in view of the above points, and is a measure for preventing corrosion and deterioration due to moisture absorption, corrosive gas absorption, etc. from the side surface portion where the processed surface of the printed circuit board is exposed, and reliability. It is to provide a physical quantity detection device that employs a printed circuit board with improved performance.

  In order to solve the above-described problem, the physical quantity detection device of the present invention includes at least one detection unit that detects a physical quantity of a gas to be measured that passes through a main passage, and a circuit unit that performs arithmetic processing on the physical quantity detected by the detection unit. A physical quantity measuring device having a circuit board provided with a circuit board and a housing for accommodating the circuit board, wherein a part of the printed board including a physical quantity detector mounted on a part of the printed board is exposed to the main passage. In this state, the housing is integrally molded with the mold resin.

  According to the present invention, it is a measure for preventing corrosion and deterioration due to moisture absorption, corrosive gas absorption, etc. from the side surface where the processed surface of the printed circuit board is exposed, and a physical quantity employing a printed circuit board with improved reliability. A detection device can be provided. Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

The system figure which shows one Example which used the physical quantity detection apparatus which concerns on this invention for the internal combustion engine control system. The front view of a physical quantity detection apparatus. The rear view of a physical quantity detection apparatus. The left view of a physical quantity detection apparatus. The right view of a physical quantity detection apparatus. The top view of a physical quantity detection apparatus. The bottom view of a physical quantity detection apparatus. The front view which shows the state which removed the front cover from the physical quantity detection apparatus. The rear view which shows the state which removed the back cover from the physical quantity detection apparatus. The left view which shows the state which removed the front cover and the back cover from the physical quantity detection apparatus. The right view which shows the state which removed the front cover and the back cover from the physical quantity detection apparatus. FIG. 3 is a cross-sectional view taken along line AA in FIG. The rear view explaining other examples of a housing. The right view of the housing shown to FIGS. 4-1. The figure explaining the structure of a front cover. The figure explaining the structure of a back cover. The front view of a circuit board. The right view of a circuit board. The rear view of a circuit board. The left view of a circuit board. BB sectional drawing of FIG. The figure which shows the other Example corresponding to the BB sectional view of FIG. CC sectional view taken on the line of FIG. It is a figure explaining the structure of a sensor chamber, (a) is an enlarged view of a sensor chamber, (b) is E1-E1 sectional view taken on the line of (a). It is a figure explaining the structure of the other Example of a sensor chamber, (a) is an enlarged view of a sensor chamber, (b) is the E2-E2 sectional view taken on the line of (a). It is a figure explaining the structure of the other Example of a sensor chamber, (a) is an enlarged view of a sensor chamber, (b) is the E3-E3 sectional view taken on the line of (a). The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The front view which shows the other Example of a circuit board. The figure explaining the structure of a terminal connection part. The figure explaining the structure of a terminal connection part. FF sectional view taken on the line of FIG. GG sectional drawing of FIG. 10-2. The figure explaining an example of the circuit structure of a physical quantity detection apparatus. The figure explaining the other Example of the circuit structure of a physical quantity detection apparatus. Front view of circuit board DD cross-sectional view of FIG. Front view showing another embodiment of the circuit board EE sectional view taken on the line in FIG. Front view showing another embodiment of the circuit board FF sectional view taken on the line in FIG. SEM photo of the side of the circuit board G section enlargement of Fig. 13-1

  The modes for carrying out the invention (hereinafter referred to as examples) described below solve various problems demanded as actual products, and particularly as a detection device for detecting the physical quantity of intake air of a vehicle. Various problems desirable for use are solved, and various effects are achieved. One of the various problems solved by the following embodiment is the contents described in the section of the problem to be solved by the invention described above, and one of the various effects exhibited by the following embodiment is as follows. It is the effect described in the column of the effect of the invention. Various problems solved by the following embodiments will be described in the description of the following embodiments with respect to various effects exhibited by the following embodiments. Therefore, the problems and effects solved by the embodiments described in the following embodiments are also described in the contents other than the contents of the problem column to be solved by the invention and the effects of the invention column.

  In the following embodiments, the same reference numerals indicate the same configuration even when the figure numbers are different, and the same effects are achieved. For configurations that have already been described, only the reference numerals are attached to the drawings, and the description may be omitted.

1. An Example Using a Physical Quantity Detection Device According to the Present Invention for an Internal Combustion Engine Control System FIG. 1 shows an embodiment using a physical quantity detection device according to the present invention for an electronic fuel injection type internal combustion engine control system. It is a system diagram. Based on the operation of the internal combustion engine 110 including the engine cylinder 112 and the engine piston 114, the intake air is sucked from the air cleaner 122 as the measurement target gas 30 and passes through the main passage 124 such as the intake body, the throttle body 126, and the intake manifold 128. Guided to the combustion chamber of the engine cylinder 112. The physical quantity of the gas 30 to be measured, which is the intake air led to the combustion chamber, is detected by the physical quantity detection device 300 according to the present invention, fuel is supplied from the fuel injection valve 152 based on the detected physical quantity, and the intake air 20 At the same time, it is guided to the combustion chamber in the state of air-fuel mixture. In this embodiment, the fuel injection valve 152 is provided at the intake port of the internal combustion engine, and the fuel injected into the intake port forms an air-fuel mixture together with the measured gas 30 that is the intake air, and passes through the intake valve 116. It is guided to the combustion chamber and burns to generate mechanical energy.

  The fuel and air guided to the combustion chamber are in a mixed state of fuel and air, and are burned explosively by spark ignition of the spark plug 154 to generate mechanical energy. The combusted gas is guided from the exhaust valve 118 to the exhaust pipe, and is discharged from the exhaust pipe to the outside as the exhaust gas 24. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is controlled by the throttle valve 132 whose opening degree changes based on the operation of the accelerator pedal. The fuel supply amount is controlled based on the flow rate of the intake air guided to the combustion chamber, and the driver controls the flow rate of the intake air guided to the combustion chamber by controlling the opening degree of the throttle valve 132, thereby The mechanical energy generated by the engine can be controlled.

1.1 Outline of Control of Internal Combustion Engine Control System Physical quantities such as a flow rate, temperature, humidity, pressure, and the like of the measurement target gas 30 that is the intake air that is taken in from the air cleaner 122 and flows through the main passage 124 are detected by the physical quantity detection device 300. An electric signal representing the physical quantity of the intake air is input from the detection device 300 to the control device 200. Further, the output of the throttle angle sensor 144 that measures the opening degree of the throttle valve 132 is input to the control device 200, and the positions and states of the engine piston 114, the intake valve 116, and the exhaust valve 118 of the internal combustion engine, and the rotation of the internal combustion engine. In order to measure the speed, the output of the rotation angle sensor 146 is input to the control device 200. In order to measure the state of the mixture ratio of the fuel amount and the air amount from the state of the exhaust gas 24, the output of the oxygen sensor 148 is input to the control device 200.

  The control device 200 calculates the fuel injection amount and the ignition timing based on the physical quantity of intake air that is the output of the physical quantity detection device 300 and the rotational speed of the internal combustion engine that is measured based on the output of the rotation angle sensor 146. Based on these calculation results, the amount of fuel supplied from the fuel injection valve 152 and the ignition timing ignited by the spark plug 154 are controlled. The fuel supply amount and ignition timing are actually based on the temperature and throttle angle change state detected by the physical quantity detection device 300, the engine speed change state, and the air-fuel ratio state measured by the oxygen sensor 148. It is finely controlled. The control device 200 further controls the amount of air that bypasses the throttle valve 132 by the idle air control valve 156 in the idle operation state of the internal combustion engine, and controls the rotational speed of the internal combustion engine in the idle operation state.

1.2 Importance of Improving Detection Accuracy of Physical Quantity Detection Device and Mounting Environment of Physical Quantity Detection Device Both the fuel supply amount and ignition timing, which are main control amounts of the internal combustion engine, are calculated using the output of the physical quantity detection device 300 as a main parameter. The Therefore, improvement in detection accuracy of the physical quantity detection device 300, suppression of changes over time, and improvement in reliability are important in terms of improvement in vehicle control accuracy and ensuring reliability.

  In particular, in recent years, there has been a very high demand for fuel efficiency of vehicles and a very high demand for exhaust gas purification. In order to meet these demands, it is extremely important to improve the detection accuracy of the physical quantity of the intake air 20 detected by the physical quantity detection device 300. It is also important that the physical quantity detection device 300 maintains high reliability.

  A vehicle on which the physical quantity detection device 300 is mounted is used in an environment in which changes in temperature and humidity are large. It is desirable for the physical quantity detection device 300 to take into account the response to changes in temperature and humidity in the environment of use and the response to dust and contaminants.

  The physical quantity detection device 300 is attached to an intake pipe that is affected by heat generated from the internal combustion engine. Therefore, the heat generated by the internal combustion engine is transmitted to the physical quantity detection device 300 via the intake pipe which is the main passage 124. Since the physical quantity detection device 300 detects the flow rate of the measurement target gas by performing heat transfer with the measurement target gas, it is important to suppress the influence of heat from the outside as much as possible.

  As described below, the physical quantity detection device 300 mounted on the vehicle simply solves the problem described in the column of the problem to be solved by the invention, and only exhibits the effect described in the column of the effect of the invention. Instead, as will be described below, the various problems described above are fully considered, and various problems required as products are solved and various effects are produced. Specific problems to be solved by the physical quantity detection device 300 and specific effects to be achieved will be described in the description of the following embodiments.

2. Configuration of Physical Quantity Detection Device 300 2.1 External Structure of Physical Quantity Detection Device 300 FIGS. 2-1 to 2-6 are diagrams showing the appearance of the physical quantity detection device 300, and FIG. Fig. 2-2 is a rear view, Fig. 2-3 is a left side view, Fig. 2-4 is a right side view, Fig. 2-5 is a plan view, and Fig. 2-6 is a bottom view.

  The physical quantity detection device 300 includes a housing 302, a front cover 303, and a back cover 304. The housing 302 is formed by molding a synthetic resin material, and includes a flange 311 for fixing the physical quantity detection device 300 to the intake body, which is the main passage 124, and an electrical connection with an external device that protrudes from the flange 311. An external connection part 321 having a connector for performing a general connection, and a measurement part 331 extending from the flange 311 so as to protrude toward the center of the main passage 124.

  The measurement unit 331 is integrally provided with the circuit board 400 by insert molding when the housing 302 is molded (see FIGS. 3A and 3B). The circuit board 400 is provided with at least one detection unit for detecting a physical quantity of the measurement target gas 30 flowing through the main passage 124 and a circuit unit for processing a signal detected by the detection unit. The detection unit is arranged at a position exposed to the measurement target gas 30, and the circuit unit is arranged in a circuit chamber sealed by a front cover 303.

  A sub-passage groove is provided on the front surface and the back surface of the measuring unit 331, and the first sub-passage 305 is formed in cooperation with the front cover 303 and the back cover 304. At the tip of the measuring unit 331, a first sub-passage inlet 305 a for taking a part of the measurement target gas 30 such as intake air into the first sub-passage 305 and the measurement target gas 30 from the first sub-passage 305 are mainly used. A first sub-passage outlet 305b for returning to the passage 124 is provided. A part of the circuit board 400 protrudes in the middle of the first sub-passage 305, and a flow rate detection unit 602 (see FIG. 3-1), which is a detection unit, is arranged on the protruding portion, and the measurement target is The flow rate of the gas 30 is detected.

  A second sub-passage 306 is provided in the middle of the measurement unit 331 closer to the flange 311 than the first sub-passage 305 for taking a part of the measurement target gas 30 such as intake air into the sensor chamber Rs. The second sub passage 306 is formed by the cooperation of the measurement unit 331 and the back cover 304. The second sub-passage 306 includes a second sub-passage inlet 306 a that opens to the upstream outer wall 336 to take in the gas to be measured 30, and a downstream side to return the gas to be measured 30 from the second sub-passage 306 to the main passage 124. A second sub-passage outlet 306b that opens to the outer wall 338 is provided. The second sub-passage 306 communicates with the sensor chamber Rs formed on the back side of the measurement unit 331. In the sensor chamber Rs, a pressure sensor and a humidity sensor that are detection units provided on the back surface of the circuit board 400 are arranged.

2.2 Effects Based on Appearance Structure of Physical Quantity Detection Device 300 The physical quantity detection device 300 is provided with a second sub-passage inlet 306a provided in the middle portion of the measurement unit 331 extending from the flange 311 toward the center of the main passage 124, and measuring. A first sub-passage inlet 305 a is provided at the tip of the part 331. Therefore, not the vicinity of the inner wall surface of the main passage 124 but the portion of the gas near the center away from the inner wall surface can be taken into the first sub-passage 305 and the second sub-passage 306, respectively. Therefore, the physical quantity detection device 300 can measure the physical quantity of the gas in the part away from the inner wall surface of the main passage 124, and can reduce the measurement error of the physical quantity related to the heat and the flow velocity decrease near the inner wall surface.

  The measuring part 331 has a shape that extends long along the axis from the outer wall of the main passage 124 toward the center, but the thickness width is narrow as shown in FIGS. 2-3 and 2-4. It is made. That is, the measurement unit 331 of the physical quantity detection device 300 has a side surface with a small width and a substantially rectangular front surface. Thereby, the physical quantity detection device 300 can include the first sub-passage 305 having a sufficient length, and the fluid resistance of the measurement target gas 30 can be suppressed to a small value. For this reason, the physical quantity detection device 300 can measure the flow rate of the measurement target gas 30 with high accuracy while suppressing the fluid resistance to a small value.

2.5 Structure and Effect of Flange 311 The flange 311 is provided with a plurality of depressions 313 on the lower surface 312 facing the main passage 124, thereby reducing the heat transfer surface between the main passage 124 and detecting the physical quantity. The device 300 is less susceptible to heat. In the physical quantity detection device 300, the measurement unit 331 is inserted into the inside from an attachment hole provided in the main passage 124, and the lower surface 312 of the flange 311 faces the main passage 124. The main passage 124 is, for example, an intake body, and the main passage 124 is often maintained at a high temperature. Conversely, when starting in a cold region, the main passage 124 may be at a very low temperature. If such a high or low temperature state of the main passage 124 affects the measurement of various physical quantities, the measurement accuracy decreases. The flange 311 has a recess 313 on the lower surface 312, and a space is formed between the lower surface 312 facing the main passage 124 and the main passage 124. Therefore, heat transfer from the main passage 124 to the physical quantity detection device 300 can be reduced, and deterioration in measurement accuracy due to heat can be prevented.

  The screw holes 314 of the flange 311 are for fixing the physical quantity detection device 300 to the main passage 124, and the respective surfaces of the screw holes 314 facing the main passage 124 around the screw holes 314 are separated from the main passage 124. A space is formed between the main passage 124 and the surface of the screw hole 314 that faces the main passage 124. By doing in this way, it has the structure which can reduce the heat transfer from the main channel | path 124 with respect to the physical quantity detection apparatus 300, and can prevent the measurement accuracy fall by a heat | fever.

2.6 Structure of External Connection Portion 321 The external connection portion 321 includes a connector 322 that is provided on the upper surface of the flange 311 and protrudes from the flange 311 toward the downstream side in the flow direction of the measurement target gas 30. The connector 322 is provided with an insertion hole 322a for inserting a communication cable for connecting to the control device 200. As shown in FIG. 2-4, four external terminals 323 are provided inside the insertion hole 322a. The external terminal 323 serves as a terminal for outputting physical quantity information that is a measurement result of the physical quantity detection device 300 and a power supply terminal for supplying DC power for operating the physical quantity detection device 300.

  The connector 322 has a shape protruding from the flange 311 toward the downstream side in the flow direction of the gas 30 to be measured and inserted from the downstream side in the flow direction toward the upstream side, but is not limited to this shape. For example, it may have a shape that protrudes vertically from the upper surface of the flange 311 and is inserted along the extending direction of the measuring unit 331, and various modifications are possible.

3. Overall Structure of Housing 302 and its Effect Next, the overall structure of the housing 302 will be described with reference to FIGS. FIGS. 3A to 3E are views showing the state of the housing 302 with the front cover 303 and the back cover 304 removed from the physical quantity detection device 300. FIG. 3A is a front view of the housing 302, and FIG. 2 is a rear view of the housing 302, FIG. 3-3 is a right side view of the housing 302, FIG. 3-4 is a left side view of the housing 302, and FIG. 3-5 is a sectional view taken along line AA in FIG. .

  The housing 302 has a structure in which the measuring unit 331 extends from the flange 311 toward the center of the main passage 124. A circuit board 400 is insert-molded on the base end side of the measurement unit 331. The circuit board 400 is arranged in parallel along the surface of the measurement unit 331 at an intermediate position between the front surface and the back surface of the measurement unit 331, and is molded integrally with the housing 302. The base end side of the measurement unit 331 is thick. It is partitioned into one side and the other side in the vertical direction.

A circuit chamber Rc that houses the circuit portion of the circuit board 400 is formed on the front surface side of the measurement unit 331, and a sensor chamber Rs that houses the pressure sensor 421 and the humidity sensor 422 is formed on the back surface side. The circuit chamber Rc is sealed by attaching the front cover 303 to the housing 302 and is completely isolated from the outside. On the other hand, attaching the back cover 304 to the housing 302 forms the second sub-passage 306 and the sensor chamber Rs, which is an indoor space communicating with the outside of the measurement unit 331 via the second sub-passage 306. A part of the circuit board 400 protrudes into the first sub-passage 305 from the partition wall 335 that partitions the circuit chamber Rc of the measurement unit 331 and the first sub-passage 305, and the measurement flow path surface of the protruding portion A flow rate detection unit 602 is provided at 430.
3.2 Structure of the sub-passage groove A sub-passage groove for forming the first sub-passage 305 is provided on the front end side of the measuring unit 331 in the length direction. The sub passage groove for forming the first sub passage 305 includes a front side sub passage groove 332 shown in FIG. 3A and a back side sub passage groove 334 shown in FIG. 3-2. As shown in FIG. 3A, the front side sub-passage groove 332 gradually moves toward the base of the measurement unit 331 as it moves from the first sub-passage outlet 305 b that opens to the downstream side outer wall 338 of the measurement unit 331 toward the upstream side outer wall 336. It curves to the flange 311 side, which is the end side, and communicates with an opening 333 that penetrates the measurement unit 331 in the thickness direction at a position near the upstream outer wall 336. The opening 333 is formed along the flow direction of the measurement target gas 30 in the main passage 124 so as to extend between the upstream outer wall 336 and the downstream outer wall 338.

  As shown in FIG. 3-2, the back side auxiliary passage groove 334 moves from the upstream side outer wall 336 toward the downstream side outer wall 338, and is divided into two branches at an intermediate position between the upstream side outer wall 336 and the downstream side outer wall 338. One side extends straight as a discharge passage and opens to the discharge port 305c of the downstream outer wall 338, and the other side is the flange 311 side, which is gradually the base end side of the measuring unit 331 as it moves to the downstream outer wall 338. And communicates with the opening 333 in the vicinity of the downstream outer wall 338.

  The back side auxiliary passage groove 334 forms an inlet groove into which the measured gas 30 flows from the main passage 124, and the front side auxiliary passage groove 332 is an outlet for returning the measured gas 30 taken in from the back side auxiliary passage groove 334 to the main passage 124. Grooves are formed. Since the front side sub-passage groove 332 and the back side sub-passage groove 334 are provided at the front end of the housing 302, the portion of the gas away from the inner wall surface of the main passage 124, in other words, the portion close to the central portion of the main passage 124 is provided. The flowing gas can be taken in as the measurement target gas 30. The gas flowing in the vicinity of the inner wall surface of the main passage 124 is affected by the wall surface temperature of the main passage 124 and often has a temperature different from the average temperature of the gas flowing through the main passage 124 such as the intake air 20. Further, the gas flowing in the vicinity of the inner wall surface of the main passage 124 often exhibits a flow rate that is slower than the average flow velocity of the gas flowing through the main passage 124. Since the physical quantity detection device 300 according to the embodiment is not easily affected by such influence, it is possible to suppress a decrease in measurement accuracy.

  As shown in FIG. 3B, a part of the measurement target gas 30 flowing through the main passage 124 is taken into the back side sub passage groove 334 from the first sub passage inlet 305 a and flows through the back side sub passage groove 334. The large foreign matter contained in the gas to be measured 30 flows into the discharge passage extending straight from the branch together with a part of the gas to be measured, and enters the main passage 124 from the discharge port 305c of the downstream outer wall 338. Discharged.

  The back side sub-passage groove 334 has a shape that becomes deeper as it advances, and the measurement target gas 30 gradually moves to the front side of the measurement unit 331 as it flows along the back side sub-passage groove 334. In particular, the back side sub-passage groove 334 is provided with a steeply inclined portion 334a that becomes deeper in front of the opening 333, and a part of the air having a small mass moves along the steeply inclined portion 334a. It flows on the measurement channel surface 430 side of the circuit board 400. On the other hand, a foreign substance having a large mass is difficult to change rapidly, and therefore flows on the measurement channel surface rear surface 431 side.

  As shown in FIG. 3A, the measurement target gas 30 that has moved to the front side through the opening 333 flows along the measurement flow path surface 430 of the circuit board, and the flow rate detection unit 602 provided on the measurement flow path surface 430. Heat is transferred between the two, and the flow rate is measured. Both air flowing from the opening 333 to the front side sub-passage groove 332 flows along the front side sub-passage groove 332, and is discharged to the main passage 124 from the first sub-passage outlet 305 b that opens to the downstream side outer wall 338.

  A substance having a large mass, such as dust, mixed in the measurement target gas 30 has a large inertial force, so that it rapidly advances in the deep direction of the groove along the surface of the steeply inclined portion 334a where the depth of the groove suddenly increases. It is difficult to change. For this reason, the foreign matter having a large mass moves toward the measurement channel surface rear surface 431, and the foreign matter can be prevented from passing near the flow rate detection unit 602. In this embodiment, since many foreign substances having a large mass other than gas pass through the measurement channel surface rear surface 431 which is the back surface of the measurement channel surface 430, they are caused by foreign matters such as oil, carbon, and dust. The influence of dirt can be reduced, and the decrease in measurement accuracy can be suppressed. That is, since it has a shape in which the path of the gas to be measured 30 is suddenly changed along an axis that crosses the flow axis of the main passage 124, the influence of foreign matter mixed in the gas to be measured 30 can be reduced.

3.3 Structure and Effect of Second Sub-passage and Sensor Chamber The second sub-passage 306 is arranged in parallel with the flange 311 so as to follow the flow direction of the gas 30 to be measured, and the second sub-passage inlet 306a and the second sub-passage outlet. 306b is formed in a straight line. The second auxiliary passage inlet 306a is formed by cutting out a part of the upstream outer wall 336, and the second auxiliary passage outlet 306b is formed by cutting out a part of the downstream outer wall 338. Specifically, as shown in FIG. 3C, at a position continuously along the upper surface of the partition wall 335, a part of the upstream outer wall 336 and a part of the downstream outer wall 338 are arranged from the back surface side of the measuring unit 331. Notched and formed. The second sub-passage inlet 306a and the second sub-passage outlet 306b are notched to a depth position that is flush with the back surface of the circuit board 400. The second sub-passage 306 functions as a cooling channel for cooling the substrate main body 401 because the measurement target gas 30 passes along the back surface of the substrate main body 401 of the circuit board 400. The circuit board 400 often has heat such as an LSI or a microcomputer, and the heat can be transferred to the back surface of the board body 401 and dissipated by the measured gas 30 passing through the second sub-passage 306.

  A sensor chamber Rs is provided on the proximal end side of the measurement unit 331 with respect to the second sub-passage 306. Part of the gas 30 to be measured that has flowed into the second sub-passage 306 from the second sub-passage inlet 306a flows into the sensor chamber Rs, and the pressure and relative humidity are respectively measured by the pressure sensor 421 and the humidity sensor 422 in the sensor chamber Rs. Detected. Since the sensor chamber Rs is disposed closer to the base end side of the measurement unit 331 than the second sub-passage 306, the influence of the dynamic pressure of the measurement target gas 30 passing through the second sub-passage 306 can be reduced. Therefore, the detection accuracy of the pressure sensor 421 in the sensor chamber Rs can be improved.

  Since the sensor chamber Rs is disposed on the proximal end side of the measurement unit 331 with respect to the second sub-passage 306, for example, when the distal end side of the measurement unit 331 is attached to the intake passage in a posture state toward the lower side, It is possible to suppress fouling substances and water droplets flowing into the second sub-passage 306 together with the gas to be measured 30 from adhering to the pressure sensor 421 and the humidity sensor 422 disposed downstream thereof.

  In particular, in the present embodiment, in the sensor chamber Rs, the pressure sensor 421 having a relatively large outer shape is disposed on the upstream side, and the humidity sensor 422 having a relatively small outer shape is disposed on the downstream side of the pressure sensor 421. The contaminants and water droplets that flow along with the measurement target gas 30 adhere to the pressure sensor 421 and the adhesion to the humidity sensor 422 is suppressed. Therefore, it is possible to protect the humidity sensor 422 that has low resistance to dirt and water droplets.

  The pressure sensor 421 and the humidity sensor 422 are less affected by the flow of the gas to be measured 30 than the flow rate detection unit 602. In particular, the humidity sensor 422 only needs to ensure the diffusion level of moisture in the gas to be measured 30. It can be provided in the sensor chamber Rs adjacent to the straight second sub-passage 306. On the other hand, the flow rate detection unit 602 requires a flow rate of a certain level or more, needs to keep away dust and dirt, and needs to consider the influence on pulsation. Therefore, the flow rate detection unit 602 is provided in the first sub-passage 305 having a shape that circulates in a loop shape.

  FIGS. 4-1 and FIGS. 4-2 are figures which show the other form of a 2nd subchannel | path.

  In this embodiment, instead of notching the upstream outer wall 336 and the downstream outer wall 338, through holes 337 are provided in the upstream outer wall 336 and the downstream outer wall 338, so that the second sub passage inlet 306a and the second sub passage outlet 306b are provided. Is forming. As in the second sub-passage shown in FIGS. 3-2 to 3-5 described above, the upstream outer wall 336 and the downstream outer wall 338 are cut away to form the second sub-passage inlet 306a and the second sub-passage outlet 306b. Then, since the width of the upstream outer wall 336 and the width of the downstream outer wall 338 are locally narrow at this position, the measurement unit 331 is substantially omitted from the notch due to heat sinks at the time of molding. There is a risk of distortion. According to this embodiment, since the through-hole is provided instead of the notch, the measuring unit 331 can be prevented from being bent into a generally U shape. Therefore, it is possible to prevent the detection accuracy from being affected by the change in the position and orientation of the detection unit with respect to the measurement target gas 30 due to distortion in the housing 302, and it is possible to always ensure a constant detection accuracy without individual differences.

  8-1, FIG. 8-2, and FIG. 8-3 are views showing other forms of the second sub-passage.

  A partition wall that partitions the second sub-passage 306 and the sensor chamber Rs may be provided in the back cover 304. According to such a configuration, the gas to be measured 30 can be caused to flow indirectly from the second sub-passage 306 into the sensor chamber Rs, thereby reducing the influence of dynamic pressure on the pressure sensor, and the amount of dirt and water droplets on the humidity sensor. Adhesion can be suppressed.

  In the example shown in FIG. 8A, two pressure sensors 421A and 421B are provided in a line along the second sub-passage 306 in the sensor chamber Rs, and one humidity sensor 422 is provided downstream thereof. Yes. The partition walls 352 </ b> A and 352 </ b> B are provided on the back cover 304, and are disposed so as to extend between the second sub-passage 306 and the sensor chamber Rs by attaching the back cover 304 to the housing 302. Specifically, a partition wall 352A is disposed between the upstream pressure sensor and the upstream wall of the sensor chamber Rs, and extends along the humidity sensor between the downstream pressure sensor and the downstream wall of the sensor chamber Rs. The partition wall 352B is arranged.

  In the example shown in FIG. 8B, only the downstream pressure sensor 421B is provided, and the upstream pressure sensor 421A is omitted. Therefore, the partition wall 352C is longer by that amount. The downstream partition wall 352D is arranged along the humidity sensor between the downstream pressure sensor and the downstream wall of the sensor chamber Rs, similarly to the partition wall 352B of FIG. Therefore, the partition walls 352A and 352C can prevent the measurement target gas 30 from directly hitting the pressure sensor, and can reduce the influence of dynamic pressure. Further, the partition walls 352B and 352D can suppress the attachment of dirt and water droplets to the humidity sensor.

  In the example illustrated in FIG. 8C, the specification is such that both of the two pressure sensors 421A and 421B are omitted, and only one humidity sensor 422 is provided in the sensor chamber Rs. The upstream partition wall 352E extends from the upstream wall of the sensor chamber Rs to the upstream position of the humidity sensor along the space between the second sub-passage 306 and the sensor chamber Rs, and is bent at the downstream end. It has a substantially L-shape facing the upstream side. Similarly to the partition walls 352B and 352D, the partition wall 352F is disposed along the humidity sensor between the downstream pressure sensor and the downstream wall of the sensor chamber Rs. Therefore, the partition wall 352E can prevent the contaminants and water droplets contained in the measurement target gas 30 passing through the second sub-passage 306 from moving toward the humidity sensor. The humidity sensor can be protected.

3.4 Shape and Effect of Table Cover 303 and Back Cover 304 FIG. 5 is a view showing the appearance of the table cover 303, FIG. 5 (a) is a front view, and FIG. 5 (b) is a diagram of FIG. It is a BB sectional view. 6A and 6B are views showing the appearance of the back cover 304. FIG. 6A is a front view, and FIG. 6B is a cross-sectional view taken along the line BB in FIG.

  5 and 6, the front cover 303 and the back cover 304 form a first sub-passage 305 by closing the front-side sub-passage groove 332 and the back-side sub-passage 334 of the housing 302. The front cover 303 forms a sealed circuit chamber Rc, and the back cover 304 closes the recess on the back side of the measuring unit 331 and communicates with the second sub-passage 306 and the second sub-passage 306. make.

  The front cover 303 includes a protrusion 356 at a position facing the flow rate detection unit 602, and is used to make a restriction between the measurement flow path surface 430 and the front cover 303. For this reason, it is desirable that the molding accuracy be high. Since the front cover 303 and the back cover 304 are made by a resin molding process in which a thermoplastic resin is injected into a mold, the front cover 303 and the back cover 304 can be made with high molding accuracy.

  The front cover 303 and the back cover 304 are provided with a plurality of fixing holes 351 into which a plurality of fixing pins 350 protruding from the measuring unit 331 are respectively inserted. The front cover 303 and the back cover 304 are respectively attached to the front surface and the back surface of the measuring unit 331. At that time, the fixing pins 350 are inserted into the fixing holes 351 and positioned. And it joins by the laser welding etc. along the edge of the front side subchannel groove 332 and the back side subchannel groove 334, and similarly, it joins by the laser welding etc. along the edge of the circuit chamber Rc and the sensor chamber Rs.

3.5 Fixing Structure and Effect of Circuit Board 400 by Housing 302 Next, fixing of the circuit board 400 to the housing 302 by a resin molding process will be described. The flow rate detection unit 602 of the circuit board 400 is provided at a predetermined position of the sub-passage groove for forming the sub-passage, for example, in the present embodiment, the opening 333 that is a connecting portion between the front-side sub-passage groove 332 and the back-side sub-passage groove 334. The circuit board 400 is molded integrally with the housing 302 so as to be disposed.

  The measurement part 331 of the housing 302 is provided with fixing parts 372 and 373 that are fixed by embedding the outer peripheral edge of the base part 402 of the circuit board 400 in the housing 302 with a resin mold. The fixing portions 372 and 373 sandwich and fix the outer peripheral edge portion of the base portion 402 of the circuit board 400 from the front side and the back side.

  The housing 302 is manufactured by a resin molding process. In this resin molding process, the circuit board 400 is built in the resin of the housing 302 and fixed in the housing 302 by the resin mold. In this way, the flow rate detection unit 602 performs heat transfer with the measurement target gas 30 to measure the flow rate, for example, the shape of the front side passage groove 332 and the back side passage groove 334. The positional relationship and the directional relationship, which are relationships, can be maintained with extremely high accuracy, and errors and variations occurring in each circuit board 400 can be suppressed to a very small value. As a result, the measurement accuracy of the circuit board 400 can be greatly improved. For example, the measurement accuracy can be dramatically improved as compared with a conventional method of fixing using an adhesive.

  The physical quantity detection device 300 is often produced by mass production, and the method of adhering with an adhesive while strictly measuring here has a limit in improving measurement accuracy. However, by fixing the circuit board 400 at the same time as forming the sub-passage in the resin molding process for forming the sub-passage for flowing the gas 30 to be measured as in this embodiment, variation in measurement accuracy can be greatly reduced. The measurement accuracy of the physical quantity detection device 300 can be greatly improved.

  For example, in the embodiment shown in FIGS. 3-1 to 3-5, the relationship between the front side sub-passage groove 332, the back side sub-passage groove 334, and the flow rate detection unit 602 is high so as to be a prescribed relationship. The circuit board 400 can be fixed to the housing 302 with accuracy. In this way, in the physical quantity detection device 300 that is mass-produced, the positional relationship and shape of the flow rate detection unit 602 of each circuit board 400 and the first sub-passage 305 can be constantly obtained with very high accuracy. Is possible.

  The first sub-passage 305 in which the flow rate detection unit 602 of the circuit board 400 is fixedly arranged can be formed with, for example, a front-side sub-passage groove 332 and a back-side sub-passage groove 334 with very high accuracy. The operation of forming the first sub-passage 305 from 334 is an operation of covering both surfaces of the housing 302 with the front cover 303 and the back cover 304. This work is very simple and is a work process with few factors that reduce the measurement accuracy. Further, the front cover 303 and the back cover 304 are produced by a process using a resin molding with high molding accuracy. Accordingly, it is possible to complete the sub-passage provided in a defined relationship with the flow rate detection unit 602 of the circuit board 400 with high accuracy. By such a method, in addition to improvement of measurement accuracy, high productivity can be obtained.

  On the other hand, in the past, a thermal flow meter was produced by manufacturing a sub-passage and then adhering a measuring unit to the sub-passage with an adhesive. As described above, the method of using the adhesive has a large variation in the thickness of the adhesive, and the bonding position and the bonding angle vary from product to product. For this reason, there was a limit to increasing the measurement accuracy. Furthermore, when performing these operations in a mass production process, it is very difficult to improve measurement accuracy.

  In the embodiment according to the present invention, the circuit board 400 is fixed by a resin mold, and at the same time, a sub passage groove for forming the first sub passage 305 is formed by the resin mold. By doing so, the flow rate detection unit 602 can be fixed to the shape of the auxiliary passage groove and the auxiliary passage groove with extremely high accuracy.

  A part related to the measurement of the flow rate, for example, the flow path surface 430 for measurement to which the flow rate detection unit 602 and the flow rate detection unit 602 are attached is provided on the surface of the circuit board 400. The flow rate detector 602 and the measurement flow path surface 430 are exposed from the resin for molding the housing 302. That is, the flow rate detector 602 and the measurement flow path surface 430 are not covered with the resin for molding the housing 302. The flow rate detection unit 602 and the measurement flow path surface 430 of the circuit board 400 are used as they are after resin molding of the housing 302 as they are, and are used for flow rate measurement of the physical quantity detection device 300. By doing so, the measurement accuracy is improved.

  In the embodiment according to the present invention, since the circuit board 400 is fixed to the housing 302 having the first sub-passage 305 by integrally forming the circuit board 400 in the housing 302, the circuit board 400 is securely attached to the housing 302. Can be fixed. In particular, since the projecting portion 403 of the circuit board 400 penetrates the partition wall 335 and projects into the first sub-passage 305, the sealing performance between the first sub-passage 305 and the circuit chamber Rc is high. Further, it is possible to prevent the measurement target gas 30 from leaking from the first sub-passage 305 into the circuit chamber Rc, and to prevent the circuit components, wirings, and the like of the circuit board 400 from being in contact with the measurement target gas 30 and being corroded.

3.6 Structure and Effect of Terminal Connection Part 320 Next, the structure of the terminal connection part will be described below with reference to FIGS. 10-1 to 10-4. 10-1 is a diagram illustrating the structure of the terminal connection portion, FIG. 10-2 is a diagram illustrating the structure of the terminal connection portion, and FIG. 10-3 is a cross-sectional view taken along line FF in FIG. 10-4 is a cross-sectional view taken along line GG in FIG. 10-2.

  The terminal connection part 320 has a configuration in which the inner end part 361 of the external terminal 323 and the connection terminal 412 of the circuit board 400 are connected by a gold wire 413. As shown in FIG. 10A, the inner end 361 of each external terminal 323 protrudes into the circuit chamber Rc from the flange 311 side, and is spaced from each other by a predetermined distance in accordance with the position of the connection terminal 412 of the circuit board 400. They are arranged side by side.

  As shown in FIG. 10C, the inner end 361 is disposed at a position that is substantially flush with the surface of the circuit board 400. And the front-end | tip is bent in the substantially L shape toward the back surface side from the surface of the measurement part 331, and protrudes in the back surface of the measurement part 331. FIG. As shown in FIG. 10-4 (a), the inner ends 361 are connected at their tips by connecting portions 365, and as shown in FIG. 10-4 (b), the connecting portions 365 are separated after molding. And divided individually.

  In the molding process, the inner end 361 and the circuit board 400 are fixed to the housing 302 by a resin mold so as to be arranged on the same plane. Each inner end portion 361 is fixed to the housing 302 by a resin molding process in a state where the inner end portions 361 are connected and integrated with each other by a connecting portion 365 in order to prevent deformation and displacement of the arrangement. And after fixing to the housing 302, the connection part 365 is cut away.

  The inner end 361 is resin-molded in a state of being sandwiched from the front surface side and the back surface side of the measuring unit 331. At that time, a mold is brought into contact with the surface of the inner end portion 361 over the entire surface. A fixing pin is brought into contact with the back surface of the portion 361. Therefore, the surface of the inner end 361 to which the gold wire is welded can be completely exposed without being covered with the mold resin due to resin leakage, and the gold wire can be easily welded. Note that a pin hole 340 is formed in the measurement unit 331 after the inner end 361 is pressed by a fixing pin.

  The tip of the inner end 361 protrudes into a recess 341 formed on the back surface of the measuring unit 331. The recess 341 is covered with the back cover 304, and the periphery of the recess 341 is continuously joined to the back cover 304 by laser welding or the like to form a sealed indoor space. Therefore, the inner end 361 can be prevented from being in contact with the measurement target gas 30 and being corroded.

4. Appearance of Circuit Board 400 4.1 Molding of Measurement Channel Surface 430 Comprising Flow Rate Detection Unit 602 FIGS. 7-1 to 7-6 show the appearance of the circuit board 400. FIG. The hatched portions described on the external appearance of the circuit board 400 indicate the fixed surface 432 and the fixed surface 434 on which the circuit board 400 is covered and fixed by the resin when the housing 302 is molded in the resin molding process.

  7-1 is a front view of the circuit board, FIG. 7-2 is a right side view of the circuit board, FIG. 7-3 is a rear view of the circuit board, and FIG. 7-4 is a left side view of the circuit board. FIG. 7-5 is a cross-sectional view taken along the line BB showing the cross section of the LSI portion of FIG. 7A, and FIG. 7-6 is a cross-sectional view taken along the line CC of the detection unit shown in FIG.

  The circuit board 400 includes a board body 401, a circuit unit and a flow rate detection unit 602 that is a sensing element are provided on the surface of the board body 401, and a pressure sensor 421 that is a sensing element and a humidity are provided on the back surface of the board body 401. A sensor 422 is provided. The substrate body 401 is made of a material made of glass epoxy resin, and has a value that is the same as or close to the thermal expansion coefficient of the thermoplastic resin forming the housing 302. Therefore, when insert molding is performed on the housing 302, stress due to a difference in thermal expansion coefficient can be reduced, and distortion of the circuit board 400 can be reduced.

  The substrate body 401 has a flat plate shape having a certain thickness, and has a substantially rectangular base portion 402 and a substantially rectangular protruding portion 403 that protrudes from one side of the base portion 402 and is slightly smaller than the base portion 402. And has a substantially T shape in plan view. A circuit portion is provided on the surface of the base portion 402. The circuit portion is configured by mounting electronic components such as an LSI 414, a microcomputer 415, a power supply regulator 416, and a chip component 417 such as a resistor and a capacitor on circuit wiring (not shown). Since the power regulator 416 generates a larger amount of heat than other electronic components such as the microcomputer 415 and the LSI 414, the power regulator 416 is disposed relatively upstream in the circuit room Rc. The LSI 414 is entirely sealed with a synthetic resin material 419 so as to include the gold wire 411, thereby improving the handleability of the circuit board 400 during insert molding.

  As shown in FIG. 7-5, a concave portion 402a into which the LSI 414 is inserted is provided on the surface of the substrate body 401. The recess 402a can be formed by subjecting the substrate body 401 to laser processing. The substrate body 401 made of glass epoxy resin is easier to process than the substrate body made of ceramic, and the recesses 402 can be easily provided. The recess 402 has a depth such that the surface of the LSI 414 is flush with the surface of the substrate body 401. By matching the height of the surface of the LSI 414 and the surface of the substrate body 401 in this way, wire bonding for connecting the LSI 414 and the substrate body 401 with the gold wire 411 is facilitated, and the circuit board 400 is easily manufactured. become. The LSI 414 can also be provided directly on the surface of the substrate body 401 as shown in FIG. 7-6, for example. In the case of such a structure, the synthetic resin material 419 that covers the LSI 414 protrudes more greatly, but the process of forming the concave portion 402 in the substrate body 401 becomes unnecessary, and the manufacturing can be simplified.

  The protrusion 403 is disposed in the first sub-passage 305 when the circuit board 400 is insert-molded into the housing 302, and the measurement flow path surface 430 that is the surface of the protrusion 403 is along the flow direction of the measurement target gas 30. Extend. A flow rate detector 602 is provided on the measurement channel surface 430 of the protrusion 403. The flow rate detector 602 performs heat transfer with the gas to be measured 30, measures the state of the gas to be measured 30, for example, the flow velocity of the gas to be measured 30, and outputs an electrical signal representing the flow rate through the main passage 124. In order for the flow rate detection unit 602 to measure the state of the measurement target gas 30 with high accuracy, it is desirable that the gas flowing in the vicinity of the measurement channel surface 430 is laminar and has little turbulence. For this reason, it is desirable that the surface of the flow rate detection unit 602 and the surface of the measurement channel surface 430 are flush with each other, or the difference is equal to or less than a predetermined value.

  A concave portion 403a is formed on the surface of the measurement flow path surface 430, and a flow rate detector 602 is fitted therein. This recess 403a can also be formed by laser processing. The recess 403a has a depth such that the surface of the flow rate detector 602 is flush with the surface of the measurement channel surface 430. The flow rate detection unit 602 and its wiring part are covered with a synthetic resin material 418 to prevent electrolytic corrosion due to adhesion of salt water.

  Two pressure sensors 421A and 421B and one humidity sensor 422 are provided on the back surface of the substrate body 401. The two pressure sensors 421A and 421B are divided into an upstream side and a downstream side and arranged in a line. A humidity sensor 422 is disposed downstream of the pressure sensor 421B. These two pressure sensors 421A and 421B and one humidity sensor 422 are arranged in the sensor chamber Rs. In the example illustrated in FIG. 7C, the case where the two pressure sensors 421A and 421B and the one humidity sensor 422 are provided has been described. However, as illustrated in FIG. 8B, the pressure sensor 421B and the humidity sensor 422 are provided. Only the humidity sensor 422 may be provided as shown in FIG.

  In the circuit board 400, the second sub-passage 306 is disposed on the back side of the board body 401. Therefore, the entire substrate body 401 can be cooled by the measurement target gas 30 passing through the second sub-passage 306.

4.2 Structure of Temperature Detection Unit 451 A temperature detection unit 451 is provided at the end on the upstream side of the base unit 402 and at the corner on the protrusion 403 side. The temperature detection unit 451 constitutes one of detection units for detecting a physical quantity of the measurement target gas 30 flowing through the main passage 124, and is provided on the circuit board 400. The circuit board 400 has a protrusion 450 that protrudes from the second sub-passage inlet 306a of the second sub-passage 306 toward the upstream side of the gas to be measured 30, and the temperature detection part 451 is the protrusion 450 and the circuit. A chip-type temperature sensor 453 provided on the back surface of the substrate 400 is provided. The temperature sensor 453 and the wiring portion thereof are covered with a synthetic resin material, which prevents electrolytic corrosion from occurring due to adhesion of salt water.

  For example, as shown in FIG. 3-2, in the central portion of the measurement unit 331 where the second sub-passage entrance 306 a is provided, the upstream outer wall 336 in the measurement unit 331 constituting the housing 302 is recessed toward the downstream side. The projecting portion 450 of the circuit board 400 projects from the recess-shaped upstream outer wall 336 toward the upstream side. The tip of the protrusion 450 is disposed at a position recessed from the most upstream surface of the upstream outer wall 336. The temperature detection part 451 is provided in the protrusion part 450 so that the back surface of the circuit board 400, ie, the 2nd sub channel | path 306 side, may be faced.

  Since the second sub-passage inlet 306a is formed on the downstream side of the temperature detection unit 451, the gas to be measured 30 flowing into the second sub-passage 306 from the second sub-passage entrance 306a contacts the temperature detection unit 451. Then, the temperature is detected when it flows into the second sub-passage inlet 306a and contacts the temperature detector 451. The gas 30 to be measured that has contacted the temperature detector 451 flows from the second sub-passage inlet 306a into the second sub-passage 306, passes through the second sub-passage 306, and is discharged from the second sub-passage outlet 306b to the main passage 123. Is done.

4.4 Fixing of Circuit Board 400 by Resin Molding Process and its Effect The hatched portion in FIG. 9-1 indicates the thermoplastic used in the resin molding process in order to fix the circuit board 400 to the housing 302 in the resin molding process. A fixing surface 432 and a fixing surface 434 for covering the circuit board 400 with resin are shown. It is important that the relationship between the measurement flow path surface 430 and the flow rate detection unit 602 provided on the measurement flow path surface 430 and the shape of the sub-passage is maintained with high accuracy so as to be related to the regulation.

  In the resin molding process, the circuit board 400 is fixed to the housing 302 that simultaneously molds the sub-passage, and at the same time, the relationship between the sub-passage, the measurement flow path surface 430, and the flow rate detection unit 602 is extremely accurate. Can be maintained. That is, since the circuit board 400 is fixed to the housing 302 in the resin molding process, the circuit board 400 can be positioned and fixed with high accuracy in a mold for forming the housing 302 having the sub-passage. Become. By injecting a high-temperature thermoplastic resin into the mold, the sub-passage is molded with high accuracy, and the circuit board 400 is fixed with high accuracy. Therefore, it is possible to suppress errors and variations occurring in each circuit board 400 to very small values. As a result, the measurement accuracy of the circuit board 400 can be greatly improved.

  In this embodiment, the outer periphery of the base portion 402 of the substrate body 401 is covered with mold resin fixing portions 372 and 373 for forming the housing 302 to form fixing surfaces 432 and 434. In the embodiment shown in FIG. 9A, as a fixing means for fixing more firmly, the substrate body 401 of the circuit board 400 is provided with a through hole 404, and the substrate body 401 is fixed by filling the through hole 404 with a mold resin. The power is increased. The through hole 404 is provided at a place fixed by the partition wall 335, and the front side and the back side of the partition wall 335 are connected via the through hole 404.

  The through hole 404 is preferably provided at a location corresponding to the partition wall 335. Since the mold resin is a thermoplastic resin and the substrate body 401 is made of glass epoxy, the chemical bond action is low and it is difficult to adhere to each other. The partition wall 335 is long with respect to the width, and has a structure that can be easily separated in a direction away from the substrate body 401. Therefore, by providing the through holes 404 at locations corresponding to the partition walls 335, the partition walls 335 sandwiching the substrate body 401 therebetween can be physically coupled to each other via the through holes 404. Therefore, the circuit board 400 can be more firmly fixed to the housing 302, and a gap can be prevented from being formed between the protrusions 403. Therefore, the gas 30 to be measured can be prevented from entering the circuit chamber Rc through the gap between the partition wall 335 and the protruding portion 403, and the inside of the circuit chamber Rc can be completely sealed.

  In the embodiment shown in FIG. 9B, in addition to the through-hole 404, a round-hole-shaped through-hole 405 is provided on each of the upstream end and the downstream end of the base portion 402. The fixing force of the substrate body 401 is further increased by filling 405 with mold resin. The upstream side edge and the downstream side edge of the base part 402 are sandwiched from both sides in the thickness direction by the fixing parts 372 and 373, and the front side and the back side are connected via the through hole 405. Therefore, the circuit board 400 can be more firmly fixed to the housing 302.

  Although it is preferable to provide the through hole 404 in the partition wall 335, the through hole 404 can be omitted when the partition wall 335 is fixed to the substrate body 401 with a predetermined fixing force. In the embodiment shown in FIG. 9C, the through hole 404 is omitted, and the through hole 405 is provided on the upstream side edge and the downstream side edge of the base portion 402. Also with this configuration, the board body 401 of the circuit board 400 can be firmly fixed to the housing 302.

  The through hole is not limited to the round hole shape, and may be a long hole shaped through hole 406 as shown in FIG. 9-4, for example. In this embodiment, the elongated hole-shaped through hole 406 is provided so as to extend along the upstream side edge and the downstream side edge of the base portion 402. The through-hole 406 has a larger amount of resin that connects the front side and the back side of the measurement unit 331 than a round hole, and can obtain a higher fixing force.

  In each of the above-described embodiments, the case of the through holes 404, 405, and 406 has been described as an example of the fixing means, but the present invention is not limited to the through holes. For example, in the embodiment shown in FIG. 9-5, large cutout portions 407 extending in the length direction are provided on the upstream side edge and the downstream side edge of the base portion 402. In the embodiment shown in FIG. 9-6, a notch 408 is provided between the base portion 402 and the protruding portion 403. Further, in the embodiment shown in FIG. 9-7, a plurality of notches 409 are arranged at predetermined intervals on the upstream side edge and the downstream side edge of the base portion 402. In the embodiment shown in FIG. 9-8, a pair of cutout portions 410 cut out from both sides of the protruding portion 403 toward the base portion 402 are provided. Also with these configurations, the board body 401 of the circuit board 400 can be firmly fixed to the housing 302.

4.5 Formation of Coating Film on Side of Circuit Board and Effect thereof FIG. 12-1 is a front view of the circuit board, and FIG. 12-2 is a cross-sectional view taken along the line DD of FIG. 12-3 is a front view showing another embodiment of the circuit board, and FIG. 12-4 is a cross-sectional view taken along line EE of FIG. 12-3. Similarly, FIG. 12-5 is a front view showing another embodiment of the circuit board, and FIG. 12-6 is a sectional view taken along line FF of FIG. 12-5.

  The printed circuit boards described in the embodiments of the present invention often refer to printed circuit boards ranked as FR-4. Because the glass cloth which weaved the epoxy resin sheet and the glass fiber into the cloth and the copper foil pattern formed in the predetermined circuit wiring pattern are alternately laminated, the hot-pressed circuit board is manufactured in multiple pieces, The side surface of the circuit board 400 is divided and cut into individual pieces by pressing or router processing. The processed side surface of the circuit board is processed and exposed, as shown in FIGS. 13-1 and 13-2, the glass cloth filler is exposed, the glass filler is partially damaged, and the epoxy There is a concern about deterioration of mechanical characteristics due to hydrolysis of the circuit board 400 due to moisture absorption from the processed end face due to irregularities that can adsorb moisture at the interface between the sheet and the glass cloth. There is also concern about deterioration and corrosion of the circuit board forming material due to permeation from the side surface of the circuit board 400 due to adhesion of engine oil vapor, fuel vapor such as gasoline, and a clean spray component of the injector. Further, there is a concern that the salt water adheres to the side surface of the circuit board 400 and corrodes and deteriorates due to penetration into the inside of the board.

  In FIG. 12A and FIG. 12B, the coating film 460 is formed on the side surface portion of the circuit board 400 including the physical quantity detection unit 602 where a part of the circuit board 400 is exposed to the main passage 124. The coating film 460 is preferably formed of the same material as the solder resist 461 formed on the surface of the circuit board 400. When the solder resist 461 is formed on the front and back surfaces of the printed circuit board 400 by spray coating, in order to form the coating film 461 on the entire side surface of the circuit board 400, the spray angle is changed, or the position and inclination of the board are changed. The process to perform becomes complicated and may cause variations.

If the side surface is not the entire circuit board 400 but only the part exposed to the main passage 124, the coating film 460 on the side surface can be formed with a resist material by spray coating with simple condition setting, so that the coated state of the side surface is stabilized, Variations in the covering film 460 are also reduced.
As a material for the coating film 460 made of resist formed on the front and back surfaces of the circuit board 400 and a part of the side surfaces, an epoxy resin having low water absorption and heat resistance is preferable. A stable coating film can be formed even with a coating film made of an acrylic resin, but most of the acrylic resins have a glass transition temperature of around 80 ° C, and heat resistance is required for in-vehicle sensors that require 150 ° C heat resistance as in-vehicle electronic devices. It is difficult to adopt because of the shortage.

There is also a process in which the solder resist 461 formed on the planar portion of the circuit board is formed by screen printing. When the solder resist 461 is formed by screen printing, screen printing cannot be performed on the side surface portion of the circuit board 400. In this case, the side surface portion is likely to be hand-painted manually and is not suitable for mass production. Spray formation that can form a resist coating film 461 on the side surfaces at the same time when forming 461 is recommended.
In addition to forming the coating film 461 with a resist formed on the planar portion of the circuit board 400, a method of forming the coating film 462 on the side surface by plating can be realized. In consideration of corrosion resistance, it is desirable to form a noble metal plating on the surface of the coating film formed by plating. As an example, a hierarchical structure in which nickel plating is applied to the side surface of the circuit board and gold plating is possible, but a nickel plating is applied to the side surface of the circuit board to form an intermediate film of palladium or boron and further gold is applied. Structural plating is suitable as the side coating film 462 having corrosion resistance.

  When the coating film is formed by plating, as a characteristic of the plating, since the film thickness at the end tends to be thin, the portion to be plated as shown in FIGS. 12-3 and 12-4 is the circuit board 400. It is desirable to perform plating in an overhanged state not only from the side surfaces but also from the front and back end portions of the circuit board. At this time, if the overhang from the end portion of the circuit board is set to an overhang within the thickness of the circuit board, the deposition dimension of the plating film is equalized and the plating is stabilized including the corner portion.

12-5 and 12-6 show the case where the coating film formed on the side surface of the circuit board 400 is made of a material different from the coating film 461 made of solder resist.
The purpose of forming the coating film 460 on the side surface of the circuit board 400 is to prevent liquid and vapor components from penetrating the side surface from penetrating and corroding and deteriorating the circuit board 400.
Therefore, it is desirable to form the coating film 463 having excellent water resistance and corrosion resistance on the side surface of the circuit board. As a material of the coating film, there is a coating film 463 made of silicone resin. A high-quality coating film is obtained by the water repellency of the silicone resin and the stability of the heat resistance of the resin. The fluorine coat also has water repellency and oil repellency and becomes a coating film. In particular, the fluorine coating has been improved in recent years, and a coating material that is dried at room temperature after being applied by spraying or coating is commercially available, and a coating film can be formed.
The fluorine coat is applied not only to the coating film 463 on the side surface of the circuit board 400 but also to the entire circuit 401 having the substantially rectangular projections 403 smaller than the base part 402 in the circuit board 403 or the first sub-layer where the circuit board is exposed. Even if the entire passage interior of the passage 305 and the second sub-passage 306 is coated, or the entire physical quantity detection device 300 and a part including the passage are partially coated, not only the circuit board 400 but also the physical quantity detection device, It is effective as a coating film that can prevent moisture adhesion, organic matter adhesion, dust adhesion prevention, and maintenance of the surface condition in the passage, and contributes to quality improvement.

5. Circuit Configuration of Physical Quantity Detection Device 300 5.1 Overall Circuit Configuration of Physical Quantity Detection Device 300 FIG. 11A is a circuit diagram of physical quantity detection device 300. The physical quantity detection device 300 includes a flow rate detection circuit 601 and a temperature / humidity detection circuit 701.

  The flow rate detection circuit 601 includes a flow rate detection unit 602 having a heating element 608 and a processing unit 604. The processing unit 604 controls the amount of heat generated by the heating element 608 of the flow rate detection unit 602 and outputs a signal representing the flow rate to the microcomputer 415 via the terminal 662 based on the output of the flow rate detection unit 602. In order to perform the processing, the processing unit 604 includes a central processing unit (hereinafter referred to as a CPU) 612, an input circuit 614, an output circuit 616, a memory 618 that holds data representing a relationship between a correction value, a measured value, and a flow rate, A power supply circuit 622 is provided to supply a constant voltage to each necessary circuit. The power supply circuit 622 is supplied with DC power from an external power source such as an in-vehicle battery via a terminal 664 and a ground terminal (not shown).

  The flow rate detector 602 is provided with a heating element 608 for heating the measurement target gas 30. The voltage V1 is supplied from the power supply circuit 622 to the collector of the transistor 606 constituting the current supply circuit of the heating element 608, and a control signal is applied from the CPU 612 to the base of the transistor 606 via the output circuit 616. Accordingly, a current is supplied from the transistor 606 to the heating element 608 through the terminal 624. The amount of current supplied to the heating element 608 is controlled by a control signal applied from the CPU 612 to the transistor 606 constituting the current supply circuit of the heating element 608 via the output circuit 616. The processing unit 604 controls the amount of heat generated by the heating element 608 so that the temperature of the measurement target gas 30 is higher than the initial temperature by a predetermined temperature, for example, 100 ° C., when heated by the heating element 608.

  The flow rate detection unit 602 includes a heat generation control bridge 640 for controlling the amount of heat generated by the heating element 608 and a flow rate detection bridge 650 for measuring the flow rate. One end of the heat generation control bridge 640 is supplied with a constant voltage V3 from the power supply circuit 622 via a terminal 626, and the other end of the heat generation control bridge 640 is connected to the ground terminal 630. A constant voltage V2 is supplied from one end of the flow rate detection bridge 650 from the power supply circuit 622 via a terminal 625, and the other end of the flow rate detection bridge 650 is connected to the ground terminal 630.

  The heat generation control bridge 640 includes a resistor 642 that is a resistance temperature detector whose resistance value changes based on the temperature of the heated measurement target gas 30. The resistor 642, the resistor 644, the resistor 646, and the resistor 648 are bridges. The circuit is configured. The potential difference between the intersection A of the resistor 642 and the resistor 646 and the potential B at the intersection B of the resistor 644 and 648 is input to the input circuit 614 via the terminal 627 and the terminal 628, and the CPU 612 has a predetermined potential difference between the intersection A and the intersection B. In this embodiment, the amount of heat generated by the heating element 608 is controlled by controlling the current supplied from the transistor 606 so as to be zero volts. The flow rate detection circuit 601 described in FIG. 11A heats the measurement target gas 30 with the heating element 608 so as to be higher than the original temperature of the measurement target gas 30 by a constant temperature, for example, 100 ° C. at all times. In order to perform this heating control with high accuracy, when the temperature of the gas 30 to be measured heated by the heating element 608 becomes a constant temperature, for example, 100 ° C., always higher than the initial temperature, the intersection A and the intersection A The resistance value of each resistor constituting the heat generation control bridge 640 is set so that the potential difference between B becomes zero volts. Therefore, in the flow rate detection circuit 601, the CPU 612 controls the supply current to the heating element 608 so that the potential difference between the intersection A and the intersection B becomes zero volts.

  The flow rate detection bridge 650 includes four resistance temperature detectors, a resistor 652, a resistor 654, a resistor 656, and a resistor 658. These four resistance temperature detectors are arranged along the flow of the gas to be measured 30, and the resistor 652 and the resistor 654 are arranged upstream of the heating element 608 in the flow path of the gas to be measured 30, and the resistor 656. And the resistor 658 are arranged on the downstream side in the flow path of the measurement target gas 30 with respect to the heating element 608. In order to increase the measurement accuracy, the resistor 652 and the resistor 654 are arranged so that the distance to the heating element 608 is substantially the same, and the resistor 656 and the resistor 658 are substantially the same distance to the heating element 608. Has been placed.

  A potential difference between an intersection C of the resistor 652 and the resistor 656 and an intersection D of the resistor 654 and the resistor 658 is input to the input circuit 614 through the terminal 631 and the terminal 632. In order to improve the measurement accuracy, for example, each resistance of the flow rate detection bridge 650 is set so that the potential difference between the intersection C and the intersection D becomes zero when the flow of the measurement target gas 30 is zero. Therefore, when the potential difference between the intersection point C and the intersection point D is, for example, zero volts, the CPU 612 generates an electric signal indicating that the flow rate of the main passage 124 is zero based on the measurement result that the flow rate of the measurement target gas 30 is zero. Output from the terminal 662.

  When the gas 30 to be measured flows in the direction of the arrow in FIG. 11A, the resistor 652 and the resistor 654 arranged on the upstream side are cooled by the gas 30 to be measured and arranged downstream of the gas 30 to be measured. The resistor 656 and the resistor 658 are heated by the measurement target gas 30 heated by the heating element 608, and the temperatures of the resistors 656 and 658 are increased. Therefore, a potential difference is generated between the intersection C and the intersection D of the flow rate detection bridge 650, and this potential difference is input to the input circuit 614 via the terminal 631 and the terminal 632. The CPU 612 retrieves data representing the relationship between the potential difference stored in the memory 618 and the flow rate of the main passage 124 based on the potential difference between the intersection C and the intersection D of the flow rate detection bridge 650, and Find the flow rate. An electrical signal representing the flow rate of the main passage 124 obtained in this way is output via the terminal 662. In addition, although the terminal 664 and the terminal 662 which are shown to FIGS. 11-1 have indicated the reference number newly, they are contained in the connection terminal 412 shown to FIGS. 9-1 demonstrated previously.

  The memory 618 stores data representing the relationship between the potential difference between the intersection C and the intersection D and the flow rate of the main passage 124, and is obtained based on the actual measured value of gas after the circuit board 400 is produced. In addition, correction data for reducing measurement errors such as variations is stored.

  The temperature / humidity detection circuit 701 holds an input circuit such as an amplifier / A / D for inputting detection signals from the temperature sensor 453 and the humidity sensor 422, an output circuit, and data representing a relationship between a correction value, temperature, and absolute humidity. And a power supply circuit 622 for supplying a certain voltage to necessary circuits. Signals output from the flow rate detection circuit 601 and the temperature / humidity detection circuit 701 are input to the microcomputer 415. The microcomputer 415 includes a flow rate calculation unit, a temperature calculation unit, and an absolute humidity calculation unit, calculates a flow rate, a temperature, and an absolute humidity, which are physical quantities of the measurement target gas 30 based on the signal, and outputs them to the ECU 200. .

  The physical quantity detection device 300 and the ECU 200 are connected by a communication cable, and communication using a digital signal is performed according to a communication standard such as SENT, LIN, or CAN. In this embodiment, a signal is input from the microcomputer 415 to the LIN driver 420, and LIN communication is performed from the LIN driver 420. Information output from the LIN driver of the physical quantity detection device 300 to the ECU 200 is output by being superimposed by digital communication using a single or two-wire communication cable.

  The absolute humidity calculation unit of the microcomputer 415 calculates the absolute humidity based on the relative humidity information and temperature information output from the humidity sensor 422, and performs a process of correcting the absolute humidity based on the error. The corrected absolute humidity calculated by the absolute humidity calculation unit is used for various engine operation controls by the control unit 62 of the ECU 18. Further, the ECU 18 can directly use the information on the total error for various engine operation controls.

  In the above-described embodiment illustrated in FIG. 11, the case where the physical quantity detection device 300 includes the LIN driver 420 and performs LIN communication has been described. However, the present invention is not limited to this, and FIG. As shown, communication may be performed directly with the microcomputer 415 without using LIN communication.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

30 Measurement target gas 124 Main passage 300 Physical quantity detection device 302 Housing 400 Circuit board 460 Side coating film 461 formed by resist Solder resist coating film 462 formed on the front and back surfaces of the circuit board Side coating film formed by plating 463 Side coating film formed of resin

Claims (7)

A circuit board provided with at least one detection unit that detects a physical quantity of the gas to be measured passing through the main passage, a circuit unit that performs arithmetic processing on the physical quantity detected by the detection unit, and a housing that houses the circuit board A physical quantity measuring device comprising:
Forming a coating film on a side surface of the circuit board ;
The physical quantity detection device according to claim 1, wherein the coating film formed on the side surface of the circuit board is formed in the same process as the solder resist material formed on the surface of the circuit board. A circuit board provided with at least one detection unit that detects a physical quantity of the gas to be measured passing through the main passage, a circuit unit that performs arithmetic processing on the physical quantity detected by the detection unit, and a housing that houses the circuit board A physical quantity measuring device comprising:
Forming a coating film on a side surface of the circuit board ;
The coating film formed on the side surface of the circuit is a solder resist, and is formed of an epoxy resin having at least a glass transition point of 80 ° C. or higher. A circuit board provided with at least one detection unit that detects a physical quantity of the gas to be measured passing through the main passage, a circuit unit that performs arithmetic processing on the physical quantity detected by the detection unit, and a housing that houses the circuit board A physical quantity measuring device comprising:
Forming a coating film on a side surface of the circuit board ;
The physical quantity detection device, wherein the coating film formed on the side surface of the circuit board is a metal coating film formed by plating. The physical quantity detection device according to claim 3, wherein the metal coating film formed by plating on the side surface of the circuit board is subjected to noble metal plating such as gold plating on a surface layer. Metallization by plating to be formed on the side surface of the circuit board, the nickel as a base film, a palladium film or boron film to the intermediate film, according to claim 3 characterized in that further a hierarchical structure plated with gold on the surface layer The physical quantity detection device described. The part to be coated with metal by plating formed on the side surface of the circuit board is formed in an overhanging state with a coating width of at least the board thickness from the front and back end faces of the circuit board to the inner plane part. The physical quantity detection device according to claim 3, wherein The housing includes a passage that takes in a part of the measurement target gas,
A portion of the circuit board is arranged to be exposed to the passage;
The physical quantity detection device according to claim 1, wherein a coating film is formed on a side surface of the circuit board exposed to the passage.

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