TWI561917B - - Google Patents

Info

Publication number
TWI561917B
TWI561917B TW102119589A TW102119589A TWI561917B TW I561917 B TWI561917 B TW I561917B TW 102119589 A TW102119589 A TW 102119589A TW 102119589 A TW102119589 A TW 102119589A TW I561917 B TWI561917 B TW I561917B
Authority
TW
Taiwan
Application number
TW102119589A
Other versions
TW201337454A (zh
Inventor
Shuichi Yamamoto
Chiho Ueta
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39980670&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI561917(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201337454A publication Critical patent/TW201337454A/zh
Application granted granted Critical
Publication of TWI561917B publication Critical patent/TWI561917B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW102119589A 2007-04-06 2008-04-03 黑色阻焊劑組成物及其硬化物 TW201337454A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007100685A JP4994923B2 (ja) 2007-04-06 2007-04-06 黒色ソルダーレジスト組成物およびその硬化物

Publications (2)

Publication Number Publication Date
TW201337454A TW201337454A (zh) 2013-09-16
TWI561917B true TWI561917B (zh) 2016-12-11

Family

ID=39980670

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097112333A TWI428692B (zh) 2007-04-06 2008-04-03 Black solder resist composition and hardened material
TW102119589A TW201337454A (zh) 2007-04-06 2008-04-03 黑色阻焊劑組成物及其硬化物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW097112333A TWI428692B (zh) 2007-04-06 2008-04-03 Black solder resist composition and hardened material

Country Status (5)

Country Link
JP (1) JP4994923B2 (zh)
KR (1) KR20080091034A (zh)
CN (1) CN101281368B (zh)
HK (1) HK1121815A1 (zh)
TW (2) TWI428692B (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP5380034B2 (ja) * 2008-10-09 2014-01-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物及びその硬化物
JP5306952B2 (ja) * 2009-09-29 2013-10-02 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにプリント配線板
JP2012003225A (ja) 2010-01-27 2012-01-05 Fujifilm Corp ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法
WO2011118171A1 (ja) * 2010-03-26 2011-09-29 住友ベークライト株式会社 感光性樹脂組成物及び受光装置
TWI546150B (zh) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
CN102792225B (zh) * 2010-03-31 2016-01-20 太阳控股株式会社 光固化性树脂组合物
JP5757749B2 (ja) 2010-05-19 2015-07-29 富士フイルム株式会社 重合性組成物
JP5007453B2 (ja) * 2010-06-11 2012-08-22 株式会社タムラ製作所 黒色硬化性樹脂組成物
JP5544239B2 (ja) 2010-07-29 2014-07-09 富士フイルム株式会社 重合性組成物
JP5731229B2 (ja) * 2010-08-20 2015-06-10 株式会社タムラ製作所 アルカリ可溶性透明樹脂組成物
JP5674399B2 (ja) 2010-09-22 2015-02-25 富士フイルム株式会社 重合性組成物、感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
JP5417364B2 (ja) 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
JP2012237864A (ja) * 2011-05-11 2012-12-06 Kaneka Corp 新規な黒色感光性樹脂組成物及びその利用
CN103975274B (zh) 2011-12-06 2016-10-26 株式会社钟化 黑色感光性树脂组合物及其利用
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5991040B2 (ja) * 2012-06-22 2016-09-14 凸版印刷株式会社 黒色感光性樹脂組成物、ブラックマトリックス及びカラーフィルタ
TWI586230B (zh) 2012-07-18 2017-06-01 鐘化股份有限公司 補強板一體型軟性印刷基板
TWI627875B (zh) 2012-07-18 2018-06-21 鐘化股份有限公司 導電層一體型軟性印刷基板
JP5766671B2 (ja) * 2012-09-05 2015-08-19 株式会社タムラ製作所 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板
JP5695622B2 (ja) 2012-09-24 2015-04-08 株式会社タムラ製作所 黒色硬化性樹脂組成物
KR101658374B1 (ko) * 2013-01-25 2016-09-22 롬엔드하스전자재료코리아유한회사 컬럼 스페이서 및 블랙 매트릭스를 동시에 구현할 수 있는 착색 감광성 수지 조성물
TWI484295B (zh) * 2013-03-19 2015-05-11 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及液晶顯示元件
KR102066893B1 (ko) * 2013-03-28 2020-01-17 교리쯔 가가꾸 산교 가부시키가이샤 자외선 경화성 차광용 조성물
JP6134187B2 (ja) * 2013-04-03 2017-05-24 株式会社カネカ 黒色感光性樹脂組成物及びその利用
WO2015025925A1 (ja) * 2013-08-23 2015-02-26 味の素株式会社 感光性樹脂組成物
JP5670533B1 (ja) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
CN104749883B (zh) * 2013-12-30 2022-04-01 上海飞凯光电材料股份有限公司 一种光刻胶
JP6383621B2 (ja) 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
KR101975430B1 (ko) * 2014-12-10 2019-05-07 고오 가가쿠고교 가부시키가이샤 솔더 레지스트 조성물 및 피복 프린트 배선판
CN105785716A (zh) * 2014-12-26 2016-07-20 上海飞凯光电材料股份有限公司 一种光刻胶
JP6185943B2 (ja) * 2015-02-10 2017-08-23 互応化学工業株式会社 ソルダーレジスト組成物、被覆プリント配線板
KR102092910B1 (ko) * 2015-06-30 2020-03-24 동우 화인켐 주식회사 착색 경화성 수지 조성물, 컬러 필터 및 표시 장치
JP6799949B2 (ja) * 2015-07-21 2020-12-16 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． 着色硬化性樹脂組成物、カラーフィルタ及び表示装置
JP6610069B2 (ja) * 2015-08-06 2019-11-27 住友ベークライト株式会社 ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法
JP6346228B2 (ja) * 2015-09-29 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
US10822465B2 (en) 2015-11-06 2020-11-03 Kaneka Corporation Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
TW201842064A (zh) 2017-03-02 2018-12-01 日商捷恩智股份有限公司 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物
CN109254498B (zh) * 2017-07-14 2023-07-14 株式会社田村制作所 感光性树脂组合物
JP6542435B2 (ja) * 2017-07-14 2019-07-10 株式会社タムラ製作所 感光性樹脂組成物
JP7052482B2 (ja) * 2018-03-29 2022-04-12 住友ベークライト株式会社 プリプレグ用樹脂組成物、プリプレグ、金属張積層板、プリント配線板、および半導体装置
JP7324595B2 (ja) * 2018-03-30 2023-08-10 太陽ホールディングス株式会社 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板
WO2020021717A1 (ja) * 2018-07-27 2020-01-30 東洋インキＳｃホールディングス株式会社 ドライレジストフィルム、ソルダーレジスト、電磁波シールドシート付きプリント配線板およびその製造方法、並びに電子機器
JP6455623B1 (ja) * 2018-07-30 2019-01-23 東洋インキＳｃホールディングス株式会社 電磁波シールドシート付きプリント配線板
JP6465243B1 (ja) * 2018-07-30 2019-02-06 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム、プリント配線板および電子機器。
CN111381441A (zh) * 2018-12-27 2020-07-07 株式会社田村制作所 黑色感光性树脂组合物
JP6843949B2 (ja) 2018-12-27 2021-03-17 株式会社タムラ製作所 黒色感光性樹脂組成物
CN111077730A (zh) * 2019-12-13 2020-04-28 Tcl华星光电技术有限公司 一种黑色光刻胶及其制备方法、显示面板、显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04190362A (ja) * 1990-11-26 1992-07-08 Idemitsu Kosan Co Ltd 遮光膜およびその製造方法
JP2002294131A (ja) * 2001-03-30 2002-10-09 Goo Chemical Co Ltd フォトソルダーレジストインク
JP2007017458A (ja) * 2005-07-05 2007-01-25 Taiyo Ink Mfg Ltd 着色感光性樹脂組成物及びその硬化物
JP2007071994A (ja) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd 黒色感光性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04190362A (ja) * 1990-11-26 1992-07-08 Idemitsu Kosan Co Ltd 遮光膜およびその製造方法
JP2002294131A (ja) * 2001-03-30 2002-10-09 Goo Chemical Co Ltd フォトソルダーレジストインク
JP2007017458A (ja) * 2005-07-05 2007-01-25 Taiyo Ink Mfg Ltd 着色感光性樹脂組成物及びその硬化物
JP2007071994A (ja) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd 黒色感光性樹脂組成物

Also Published As

Publication number Publication date
JP2008257045A (ja) 2008-10-23
JP4994923B2 (ja) 2012-08-08
HK1121815A1 (en) 2009-04-30
TW200907566A (en) 2009-02-16
KR20080091034A (ko) 2008-10-09
TWI428692B (zh) 2014-03-01
CN101281368B (zh) 2011-07-13
TW201337454A (zh) 2013-09-16
CN101281368A (zh) 2008-10-08

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