CN101148542B - 热固性硅树脂组合物及使用其的发光二极管元件 - Google Patents
热固性硅树脂组合物及使用其的发光二极管元件 Download PDFInfo
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- CN101148542B CN101148542B CN2007101543382A CN200710154338A CN101148542B CN 101148542 B CN101148542 B CN 101148542B CN 2007101543382 A CN2007101543382 A CN 2007101543382A CN 200710154338 A CN200710154338 A CN 200710154338A CN 101148542 B CN101148542 B CN 101148542B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- Chemical & Material Sciences (AREA)
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| JP2006-256581 | 2006-09-22 | ||
| JP2006256581 | 2006-09-22 |
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| CN101148542B true CN101148542B (zh) | 2011-10-05 |
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| EP (1) | EP1921114B1 (https=) |
| JP (1) | JP4563977B2 (https=) |
| KR (1) | KR101421292B1 (https=) |
| CN (1) | CN101148542B (https=) |
| DE (1) | DE602007003545D1 (https=) |
| TW (1) | TWI419933B (https=) |
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| CN102112118A (zh) * | 2008-04-25 | 2011-06-29 | 北卡罗来纳-查佩尔山大学 | 特别用于非湿润模型的颗粒复制的可降解化合物及其使用方法 |
| JP2010027974A (ja) * | 2008-07-23 | 2010-02-04 | Sharp Corp | 発光装置の製造方法 |
| JP5621211B2 (ja) * | 2009-04-20 | 2014-11-12 | 横浜ゴム株式会社 | 光半導体封止用シリコーン樹脂組成物 |
| US8697458B2 (en) * | 2009-04-22 | 2014-04-15 | Shat-R-Shield, Inc. | Silicone coated light-emitting diode |
| EP2422369A4 (en) * | 2009-04-22 | 2014-12-24 | Shat R Shield Inc | LED EMITTING LIGHT, COATED WITH SILICONE |
| JP5443940B2 (ja) * | 2009-10-21 | 2014-03-19 | 東亞合成株式会社 | 硬化型コーティング剤組成物 |
| CN102859728A (zh) * | 2010-04-27 | 2013-01-02 | 信越化学工业株式会社 | 发光装置及发光装置的制造方法 |
| US20130203675A1 (en) | 2010-09-16 | 2013-08-08 | Joseph M. DeSimone | Asymmetric biofunctional silyl monomers and particles thereof as prodrugs and delivery vehicles for pharmaceutical, chemical and biological agents |
| WO2012051749A1 (en) * | 2010-10-19 | 2012-04-26 | Ablestik (Shanghai) Ltd. | Hybrid silicone composition for light emitting device |
| JP5921154B2 (ja) * | 2011-11-09 | 2016-05-24 | 日東電工株式会社 | 光学フィルム、画像表示装置および画像表示装置の製造方法 |
| CA2911523C (en) * | 2013-05-10 | 2018-10-02 | Abl Ip Holding Llc | Silicone optics |
| JP6072663B2 (ja) * | 2013-10-15 | 2017-02-01 | 信越化学工業株式会社 | 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。 |
| JP6285346B2 (ja) * | 2014-12-08 | 2018-02-28 | 信越化学工業株式会社 | 透明樹脂組成物、該組成物からなる接着剤、該組成物からなるダイボンド材、該組成物を用いた導電接続方法、及び該方法によって得られた光半導体装置 |
| JP6272747B2 (ja) * | 2014-12-08 | 2018-01-31 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置 |
| JP6622171B2 (ja) * | 2016-11-08 | 2019-12-18 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置 |
| PT3553840T (pt) * | 2016-12-09 | 2022-02-22 | Momentive Performance Mat Korea Co Ltd | Composição para um agente de encapsulação de um elemento orgânico eletrónico e o agente de encapsulação formado por essa composição |
| WO2019065398A1 (ja) * | 2017-09-29 | 2019-04-04 | 信越化学工業株式会社 | 紫外線硬化型シリコーン粘着剤組成物およびその硬化物 |
| JP6978690B2 (ja) * | 2018-05-25 | 2021-12-08 | 日亜化学工業株式会社 | 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置 |
| JP6962290B2 (ja) * | 2018-08-02 | 2021-11-05 | 信越化学工業株式会社 | 光造形用紫外線硬化型シリコーン組成物およびその硬化物 |
| JP7296748B2 (ja) * | 2019-03-08 | 2023-06-23 | 信越化学工業株式会社 | ウェハーレベル光半導体デバイス用樹脂組成物、及び光半導体デバイス |
| JP7107279B2 (ja) * | 2019-05-27 | 2022-07-27 | 信越化学工業株式会社 | 型取り用シリコーンゴム組成物およびシリコーンゴム型 |
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- 2007-09-21 DE DE602007003545T patent/DE602007003545D1/de active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI419933B (zh) | 2013-12-21 |
| TW200823265A (en) | 2008-06-01 |
| EP1921114A1 (en) | 2008-05-14 |
| DE602007003545D1 (de) | 2010-01-14 |
| EP1921114B1 (en) | 2009-12-02 |
| KR101421292B1 (ko) | 2014-07-18 |
| US20080076882A1 (en) | 2008-03-27 |
| US7915362B2 (en) | 2011-03-29 |
| KR20080027205A (ko) | 2008-03-26 |
| JP4563977B2 (ja) | 2010-10-20 |
| JP2008074982A (ja) | 2008-04-03 |
| CN101148542A (zh) | 2008-03-26 |
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