KR101421292B1 - 열경화형 실리콘 조성물 및 이를 이용한 발광 다이오드소자 - Google Patents

열경화형 실리콘 조성물 및 이를 이용한 발광 다이오드소자 Download PDF

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Publication number
KR101421292B1
KR101421292B1 KR1020070096619A KR20070096619A KR101421292B1 KR 101421292 B1 KR101421292 B1 KR 101421292B1 KR 1020070096619 A KR1020070096619 A KR 1020070096619A KR 20070096619 A KR20070096619 A KR 20070096619A KR 101421292 B1 KR101421292 B1 KR 101421292B1
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South Korea
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emitting diode
light emitting
component
thermosetting silicone
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Korean (ko)
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KR20080027205A (ko
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도시유끼 오자이
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신에쓰 가가꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
KR1020070096619A 2006-09-22 2007-09-21 열경화형 실리콘 조성물 및 이를 이용한 발광 다이오드소자 Active KR101421292B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006256581A JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
JPJP-P-2006-00256581 2006-09-22

Publications (2)

Publication Number Publication Date
KR20080027205A KR20080027205A (ko) 2008-03-26
KR101421292B1 true KR101421292B1 (ko) 2014-07-18

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KR1020070096619A Active KR101421292B1 (ko) 2006-09-22 2007-09-21 열경화형 실리콘 조성물 및 이를 이용한 발광 다이오드소자

Country Status (7)

Country Link
US (1) US7915362B2 (https=)
EP (1) EP1921114B1 (https=)
JP (1) JP4563977B2 (https=)
KR (1) KR101421292B1 (https=)
CN (1) CN101148542B (https=)
DE (1) DE602007003545D1 (https=)
TW (1) TWI419933B (https=)

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KR20200061358A (ko) * 2017-09-29 2020-06-02 신에쓰 가가꾸 고교 가부시끼가이샤 자외선 경화형 실리콘 점착제 조성물 및 그 경화물

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CN102112118A (zh) * 2008-04-25 2011-06-29 北卡罗来纳-查佩尔山大学 特别用于非湿润模型的颗粒复制的可降解化合物及其使用方法
JP2010027974A (ja) * 2008-07-23 2010-02-04 Sharp Corp 発光装置の製造方法
JP5621211B2 (ja) * 2009-04-20 2014-11-12 横浜ゴム株式会社 光半導体封止用シリコーン樹脂組成物
US8697458B2 (en) * 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
EP2422369A4 (en) * 2009-04-22 2014-12-24 Shat R Shield Inc LED EMITTING LIGHT, COATED WITH SILICONE
JP5443940B2 (ja) * 2009-10-21 2014-03-19 東亞合成株式会社 硬化型コーティング剤組成物
CN102859728A (zh) * 2010-04-27 2013-01-02 信越化学工业株式会社 发光装置及发光装置的制造方法
US20130203675A1 (en) 2010-09-16 2013-08-08 Joseph M. DeSimone Asymmetric biofunctional silyl monomers and particles thereof as prodrugs and delivery vehicles for pharmaceutical, chemical and biological agents
WO2012051749A1 (en) * 2010-10-19 2012-04-26 Ablestik (Shanghai) Ltd. Hybrid silicone composition for light emitting device
JP5921154B2 (ja) * 2011-11-09 2016-05-24 日東電工株式会社 光学フィルム、画像表示装置および画像表示装置の製造方法
CA2911523C (en) * 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
JP6285346B2 (ja) * 2014-12-08 2018-02-28 信越化学工業株式会社 透明樹脂組成物、該組成物からなる接着剤、該組成物からなるダイボンド材、該組成物を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6272747B2 (ja) * 2014-12-08 2018-01-31 信越化学工業株式会社 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置
JP6622171B2 (ja) * 2016-11-08 2019-12-18 信越化学工業株式会社 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置
PT3553840T (pt) * 2016-12-09 2022-02-22 Momentive Performance Mat Korea Co Ltd Composição para um agente de encapsulação de um elemento orgânico eletrónico e o agente de encapsulação formado por essa composição
JP6978690B2 (ja) * 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
JP6962290B2 (ja) * 2018-08-02 2021-11-05 信越化学工業株式会社 光造形用紫外線硬化型シリコーン組成物およびその硬化物
JP7296748B2 (ja) * 2019-03-08 2023-06-23 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物、及び光半導体デバイス
JP7107279B2 (ja) * 2019-05-27 2022-07-27 信越化学工業株式会社 型取り用シリコーンゴム組成物およびシリコーンゴム型

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JP2003128920A (ja) * 2001-10-26 2003-05-08 Dow Corning Toray Silicone Co Ltd 硬化性液状シリコーン組成物および半導体装置

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US4504629A (en) * 1983-07-20 1985-03-12 Loctite Corporation Polymers with graft α-alkylacrylate functionality
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200061358A (ko) * 2017-09-29 2020-06-02 신에쓰 가가꾸 고교 가부시끼가이샤 자외선 경화형 실리콘 점착제 조성물 및 그 경화물
KR102560796B1 (ko) 2017-09-29 2023-07-28 신에쓰 가가꾸 고교 가부시끼가이샤 자외선 경화형 실리콘 점착제 조성물 및 그 경화물

Also Published As

Publication number Publication date
TWI419933B (zh) 2013-12-21
TW200823265A (en) 2008-06-01
EP1921114A1 (en) 2008-05-14
DE602007003545D1 (de) 2010-01-14
EP1921114B1 (en) 2009-12-02
US20080076882A1 (en) 2008-03-27
US7915362B2 (en) 2011-03-29
CN101148542B (zh) 2011-10-05
KR20080027205A (ko) 2008-03-26
JP4563977B2 (ja) 2010-10-20
JP2008074982A (ja) 2008-04-03
CN101148542A (zh) 2008-03-26

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