DE602007003545D1 - LED-Element - Google Patents

LED-Element

Info

Publication number
DE602007003545D1
DE602007003545D1 DE602007003545T DE602007003545T DE602007003545D1 DE 602007003545 D1 DE602007003545 D1 DE 602007003545D1 DE 602007003545 T DE602007003545 T DE 602007003545T DE 602007003545 T DE602007003545 T DE 602007003545T DE 602007003545 D1 DE602007003545 D1 DE 602007003545D1
Authority
DE
Germany
Prior art keywords
led element
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007003545T
Other languages
German (de)
English (en)
Inventor
Toshiyuki Ozai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602007003545D1 publication Critical patent/DE602007003545D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
DE602007003545T 2006-09-22 2007-09-21 LED-Element Active DE602007003545D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006256581A JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子

Publications (1)

Publication Number Publication Date
DE602007003545D1 true DE602007003545D1 (de) 2010-01-14

Family

ID=39145241

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007003545T Active DE602007003545D1 (de) 2006-09-22 2007-09-21 LED-Element

Country Status (7)

Country Link
US (1) US7915362B2 (https=)
EP (1) EP1921114B1 (https=)
JP (1) JP4563977B2 (https=)
KR (1) KR101421292B1 (https=)
CN (1) CN101148542B (https=)
DE (1) DE602007003545D1 (https=)
TW (1) TWI419933B (https=)

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* Cited by examiner, † Cited by third party
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CN102112118A (zh) * 2008-04-25 2011-06-29 北卡罗来纳-查佩尔山大学 特别用于非湿润模型的颗粒复制的可降解化合物及其使用方法
JP2010027974A (ja) * 2008-07-23 2010-02-04 Sharp Corp 発光装置の製造方法
JP5621211B2 (ja) * 2009-04-20 2014-11-12 横浜ゴム株式会社 光半導体封止用シリコーン樹脂組成物
US8697458B2 (en) * 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
EP2422369A4 (en) * 2009-04-22 2014-12-24 Shat R Shield Inc LED EMITTING LIGHT, COATED WITH SILICONE
JP5443940B2 (ja) * 2009-10-21 2014-03-19 東亞合成株式会社 硬化型コーティング剤組成物
CN102859728A (zh) * 2010-04-27 2013-01-02 信越化学工业株式会社 发光装置及发光装置的制造方法
US20130203675A1 (en) 2010-09-16 2013-08-08 Joseph M. DeSimone Asymmetric biofunctional silyl monomers and particles thereof as prodrugs and delivery vehicles for pharmaceutical, chemical and biological agents
WO2012051749A1 (en) * 2010-10-19 2012-04-26 Ablestik (Shanghai) Ltd. Hybrid silicone composition for light emitting device
JP5921154B2 (ja) * 2011-11-09 2016-05-24 日東電工株式会社 光学フィルム、画像表示装置および画像表示装置の製造方法
CA2911523C (en) * 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
JP6285346B2 (ja) * 2014-12-08 2018-02-28 信越化学工業株式会社 透明樹脂組成物、該組成物からなる接着剤、該組成物からなるダイボンド材、該組成物を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6272747B2 (ja) * 2014-12-08 2018-01-31 信越化学工業株式会社 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置
JP6622171B2 (ja) * 2016-11-08 2019-12-18 信越化学工業株式会社 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置
PT3553840T (pt) * 2016-12-09 2022-02-22 Momentive Performance Mat Korea Co Ltd Composição para um agente de encapsulação de um elemento orgânico eletrónico e o agente de encapsulação formado por essa composição
WO2019065398A1 (ja) * 2017-09-29 2019-04-04 信越化学工業株式会社 紫外線硬化型シリコーン粘着剤組成物およびその硬化物
JP6978690B2 (ja) * 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
JP6962290B2 (ja) * 2018-08-02 2021-11-05 信越化学工業株式会社 光造形用紫外線硬化型シリコーン組成物およびその硬化物
JP7296748B2 (ja) * 2019-03-08 2023-06-23 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物、及び光半導体デバイス
JP7107279B2 (ja) * 2019-05-27 2022-07-27 信越化学工業株式会社 型取り用シリコーンゴム組成物およびシリコーンゴム型

Family Cites Families (23)

* Cited by examiner, † Cited by third party
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US4201808A (en) * 1978-06-12 1980-05-06 Union Carbide Corporation Radiation curable silicone release compositions
JPS58173174A (ja) * 1982-04-06 1983-10-12 Japan Synthetic Rubber Co Ltd ラジカル系接着剤組成物
JPS59185310A (ja) * 1983-04-06 1984-10-20 Toyo Contact Lens Co Ltd 酸素透過性軟質コンタクトレンズ用組成物
US4504629A (en) * 1983-07-20 1985-03-12 Loctite Corporation Polymers with graft α-alkylacrylate functionality
JPS62119141A (ja) * 1985-11-19 1987-05-30 Shin Etsu Chem Co Ltd 放射線硬化性光フアイバ−用被覆剤
JPH068335B2 (ja) * 1987-01-28 1994-02-02 信越化学工業株式会社 紫外線硬化性ゲル組成物
JPH0627162B2 (ja) * 1988-05-31 1994-04-13 信越化学工業株式会社 光硬化性オルガノポリシロキサン組成物
US4962165A (en) * 1989-01-12 1990-10-09 Rohm And Haas Company Process for making silicone particles
JPH0619029B2 (ja) * 1989-11-22 1994-03-16 信越化学工業株式会社 半導体装置保護コート用組成物及び半導体装置
JP3166262B2 (ja) 1992-01-22 2001-05-14 東レ株式会社 帯電防止性を有する熱可塑性樹脂フィルム
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JPH10228249A (ja) 1996-12-12 1998-08-25 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US5965299A (en) * 1997-06-23 1999-10-12 North Carolina State University Composite electrolyte containing surface modified fumed silica
JP4286935B2 (ja) 1998-10-14 2009-07-01 株式会社朝日ラバー 調色照明装置
EP1045009A1 (en) 1999-04-16 2000-10-18 Dow Corning Corporation Heat curable silcone acrylate coating compositions
JP2001123120A (ja) 1999-10-26 2001-05-08 Bridgestone Corp 木質仕上材用塗料及び表面塗装木質仕上材
EP1411073B1 (en) * 2001-06-27 2013-03-20 Daikin Industries, Ltd. Surface-treating agent composition and process for producing the same
JP2003128920A (ja) * 2001-10-26 2003-05-08 Dow Corning Toray Silicone Co Ltd 硬化性液状シリコーン組成物および半導体装置
JP4803339B2 (ja) * 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP2006328164A (ja) * 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
JP5015571B2 (ja) * 2006-01-12 2012-08-29 信越化学工業株式会社 発光ダイオード素子用紫外線硬化型シリコーン組成物
JP5239169B2 (ja) * 2006-04-25 2013-07-17 日立化成株式会社 光学部材

Also Published As

Publication number Publication date
TWI419933B (zh) 2013-12-21
TW200823265A (en) 2008-06-01
EP1921114A1 (en) 2008-05-14
EP1921114B1 (en) 2009-12-02
KR101421292B1 (ko) 2014-07-18
US20080076882A1 (en) 2008-03-27
US7915362B2 (en) 2011-03-29
CN101148542B (zh) 2011-10-05
KR20080027205A (ko) 2008-03-26
JP4563977B2 (ja) 2010-10-20
JP2008074982A (ja) 2008-04-03
CN101148542A (zh) 2008-03-26

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