CN101082636B - 探针顶端的检测方法、校准方法及探针装置 - Google Patents

探针顶端的检测方法、校准方法及探针装置 Download PDF

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Publication number
CN101082636B
CN101082636B CN2007101046271A CN200710104627A CN101082636B CN 101082636 B CN101082636 B CN 101082636B CN 2007101046271 A CN2007101046271 A CN 2007101046271A CN 200710104627 A CN200710104627 A CN 200710104627A CN 101082636 B CN101082636 B CN 101082636B
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probe
load
load sensor
platform
year
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CN101082636A (zh
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河野芳尚
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN2007101046271A 2006-05-31 2007-05-18 探针顶端的检测方法、校准方法及探针装置 Active CN101082636B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006152302 2006-05-31
JP2006-152302 2006-05-31
JP2006152302A JP4451416B2 (ja) 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置

Publications (2)

Publication Number Publication Date
CN101082636A CN101082636A (zh) 2007-12-05
CN101082636B true CN101082636B (zh) 2012-05-30

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CN2007101046271A Active CN101082636B (zh) 2006-05-31 2007-05-18 探针顶端的检测方法、校准方法及探针装置

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US (1) US7800387B2 (enExample)
JP (1) JP4451416B2 (enExample)
KR (1) KR100910668B1 (enExample)
CN (1) CN101082636B (enExample)
TW (1) TWI438853B (enExample)

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JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
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KR100948805B1 (ko) * 2009-08-07 2010-03-24 주식회사 에이디엔티 전자 방해 검출 장치 및 그 제어 방법
TWI509265B (zh) * 2012-04-18 2015-11-21 Chipmos Technologies Inc 垂直式探針卡及應用其之檢測模組
US8659308B1 (en) * 2012-10-09 2014-02-25 Rudolph Technolgies, Inc. Selective overtravel during electrical test of probe cards
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
CN102878974B (zh) * 2012-10-19 2015-10-07 上海华岭集成电路技术股份有限公司 探针卡平整度检测方法
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
JP5664938B2 (ja) * 2013-02-01 2015-02-04 株式会社東京精密 プローバ及びプローブ検査方法
JP5571224B2 (ja) * 2013-04-25 2014-08-13 東京エレクトロン株式会社 針先位置検出装置及びプローブ装置
US9417308B2 (en) 2013-07-03 2016-08-16 Stichting Continuiteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
CN103575176A (zh) * 2013-07-29 2014-02-12 共青城赛龙通信技术有限责任公司 贴合尺寸检测设备
CN103809100B (zh) * 2014-03-07 2016-03-09 上海华虹宏力半导体制造有限公司 晶圆自动测试系统
WO2016024346A1 (ja) 2014-08-13 2016-02-18 株式会社東京精密 プローバ及びプローブ検査方法
JP5692621B1 (ja) * 2014-12-11 2015-04-01 株式会社東京精密 測定装置及び測定方法
JP5747428B2 (ja) * 2015-02-06 2015-07-15 株式会社東京精密 位置決め固定装置
JP6515003B2 (ja) * 2015-09-24 2019-05-15 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
CN105223389B (zh) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 一种飞针测试机的对位方法
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP2017129395A (ja) * 2016-01-19 2017-07-27 三菱電機株式会社 半導体装置の検査装置および半導体装置の検査方法
JP6149338B1 (ja) * 2016-03-28 2017-06-21 株式会社東京精密 プローバ及びプローバの操作方法
WO2017170393A1 (ja) 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6308639B1 (ja) * 2017-08-07 2018-04-11 株式会社テクノホロン プロービングステーション
TWI652483B (zh) * 2017-12-12 2019-03-01 穩懋半導體股份有限公司 用於晶圓針測系統之非均質性接收器與非等向性發射器之對位方法
JP2019110259A (ja) * 2017-12-20 2019-07-04 東京エレクトロン株式会社 プローバ
US12055563B2 (en) * 2021-08-30 2024-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card, apparatus and method for detecting contact force of probe card
CN113917202B (zh) * 2021-09-23 2023-09-12 合肥欣奕华智能机器股份有限公司 探针安装高度校准设备、方法、控制器及计算机存储介质
CN116255942B (zh) * 2022-09-09 2025-10-21 厦门通富微电子有限公司 一种顶针检测装置及检测方法
CN115831797B (zh) * 2022-12-26 2023-10-13 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机
CN119085504B (zh) * 2024-08-28 2025-09-23 华工科技产业股份有限公司 一种探针焊接高度对位检测方法、设备及系统

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Also Published As

Publication number Publication date
US7800387B2 (en) 2010-09-21
TW200814217A (en) 2008-03-16
US20070296427A1 (en) 2007-12-27
KR100910668B1 (ko) 2009-08-04
TWI438853B (zh) 2014-05-21
CN101082636A (zh) 2007-12-05
JP4451416B2 (ja) 2010-04-14
JP2007324340A (ja) 2007-12-13
KR20070115737A (ko) 2007-12-06

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