TWI438853B - The detection method of the probe tip, the alignment method, and the memory medium and the probe device - Google Patents

The detection method of the probe tip, the alignment method, and the memory medium and the probe device Download PDF

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Publication number
TWI438853B
TWI438853B TW096119374A TW96119374A TWI438853B TW I438853 B TWI438853 B TW I438853B TW 096119374 A TW096119374 A TW 096119374A TW 96119374 A TW96119374 A TW 96119374A TW I438853 B TWI438853 B TW I438853B
Authority
TW
Taiwan
Prior art keywords
probe
load
mounting table
load sensor
height
Prior art date
Application number
TW096119374A
Other languages
English (en)
Chinese (zh)
Other versions
TW200814217A (en
Inventor
Yoshinao Kono
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200814217A publication Critical patent/TW200814217A/zh
Application granted granted Critical
Publication of TWI438853B publication Critical patent/TWI438853B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096119374A 2006-05-31 2007-05-30 The detection method of the probe tip, the alignment method, and the memory medium and the probe device TWI438853B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006152302A JP4451416B2 (ja) 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置

Publications (2)

Publication Number Publication Date
TW200814217A TW200814217A (en) 2008-03-16
TWI438853B true TWI438853B (zh) 2014-05-21

Family

ID=38856870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119374A TWI438853B (zh) 2006-05-31 2007-05-30 The detection method of the probe tip, the alignment method, and the memory medium and the probe device

Country Status (5)

Country Link
US (1) US7800387B2 (enExample)
JP (1) JP4451416B2 (enExample)
KR (1) KR100910668B1 (enExample)
CN (1) CN101082636B (enExample)
TW (1) TWI438853B (enExample)

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JP4695106B2 (ja) * 2007-02-21 2011-06-08 東京エレクトロン株式会社 チャックトップの高さを求める方法及びこの方法を記録したプログラム記録媒体
JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
KR100948805B1 (ko) * 2009-08-07 2010-03-24 주식회사 에이디엔티 전자 방해 검출 장치 및 그 제어 방법
TWI509265B (zh) * 2012-04-18 2015-11-21 Chipmos Technologies Inc 垂直式探針卡及應用其之檢測模組
US8659308B1 (en) * 2012-10-09 2014-02-25 Rudolph Technolgies, Inc. Selective overtravel during electrical test of probe cards
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
CN102878974B (zh) * 2012-10-19 2015-10-07 上海华岭集成电路技术股份有限公司 探针卡平整度检测方法
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
JP5664938B2 (ja) * 2013-02-01 2015-02-04 株式会社東京精密 プローバ及びプローブ検査方法
JP5571224B2 (ja) * 2013-04-25 2014-08-13 東京エレクトロン株式会社 針先位置検出装置及びプローブ装置
US9417308B2 (en) 2013-07-03 2016-08-16 Stichting Continuiteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
CN103575176A (zh) * 2013-07-29 2014-02-12 共青城赛龙通信技术有限责任公司 贴合尺寸检测设备
CN103809100B (zh) * 2014-03-07 2016-03-09 上海华虹宏力半导体制造有限公司 晶圆自动测试系统
WO2016024346A1 (ja) 2014-08-13 2016-02-18 株式会社東京精密 プローバ及びプローブ検査方法
JP5692621B1 (ja) * 2014-12-11 2015-04-01 株式会社東京精密 測定装置及び測定方法
JP5747428B2 (ja) * 2015-02-06 2015-07-15 株式会社東京精密 位置決め固定装置
JP6515003B2 (ja) * 2015-09-24 2019-05-15 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
CN105223389B (zh) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 一种飞针测试机的对位方法
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP2017129395A (ja) * 2016-01-19 2017-07-27 三菱電機株式会社 半導体装置の検査装置および半導体装置の検査方法
JP6149338B1 (ja) * 2016-03-28 2017-06-21 株式会社東京精密 プローバ及びプローバの操作方法
WO2017170393A1 (ja) 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6308639B1 (ja) * 2017-08-07 2018-04-11 株式会社テクノホロン プロービングステーション
TWI652483B (zh) * 2017-12-12 2019-03-01 穩懋半導體股份有限公司 用於晶圓針測系統之非均質性接收器與非等向性發射器之對位方法
JP2019110259A (ja) * 2017-12-20 2019-07-04 東京エレクトロン株式会社 プローバ
US12055563B2 (en) * 2021-08-30 2024-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card, apparatus and method for detecting contact force of probe card
CN113917202B (zh) * 2021-09-23 2023-09-12 合肥欣奕华智能机器股份有限公司 探针安装高度校准设备、方法、控制器及计算机存储介质
CN116255942B (zh) * 2022-09-09 2025-10-21 厦门通富微电子有限公司 一种顶针检测装置及检测方法
CN115831797B (zh) * 2022-12-26 2023-10-13 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机
CN119085504B (zh) * 2024-08-28 2025-09-23 华工科技产业股份有限公司 一种探针焊接高度对位检测方法、设备及系统

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US4328553A (en) * 1976-12-07 1982-05-04 Computervision Corporation Method and apparatus for targetless wafer alignment
US5321352A (en) * 1991-08-01 1994-06-14 Tokyo Electron Yamanashi Limited Probe apparatus and method of alignment for the same
JP3163221B2 (ja) 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
US5642056A (en) 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5585738A (en) * 1994-03-31 1996-12-17 Tokyo Electron Limited Probe system having vertical height detection and double focal image pickup coinciding with probe contact in height adjustment
WO1996029607A1 (en) * 1995-03-18 1996-09-26 Tokyo Electron Limited Method and apparatus for inspecting substrate
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
JP3623413B2 (ja) 1999-10-29 2005-02-23 Ｎｅｃエレクトロニクス株式会社 プローブカード
JP4721247B2 (ja) 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
KR20030000352A (ko) * 2001-06-23 2003-01-06 삼성전자 주식회사 프로브 니들의 정렬 방법
JP4339631B2 (ja) 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Ｏｋｉセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体

Also Published As

Publication number Publication date
US7800387B2 (en) 2010-09-21
TW200814217A (en) 2008-03-16
US20070296427A1 (en) 2007-12-27
KR100910668B1 (ko) 2009-08-04
CN101082636B (zh) 2012-05-30
CN101082636A (zh) 2007-12-05
JP4451416B2 (ja) 2010-04-14
JP2007324340A (ja) 2007-12-13
KR20070115737A (ko) 2007-12-06

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