JP4451416B2 - プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置 - Google Patents

プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置 Download PDF

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Publication number
JP4451416B2
JP4451416B2 JP2006152302A JP2006152302A JP4451416B2 JP 4451416 B2 JP4451416 B2 JP 4451416B2 JP 2006152302 A JP2006152302 A JP 2006152302A JP 2006152302 A JP2006152302 A JP 2006152302A JP 4451416 B2 JP4451416 B2 JP 4451416B2
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probe
mounting table
load
height
load sensor
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JP2006152302A
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English (en)
Japanese (ja)
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JP2007324340A5 (enExample
JP2007324340A (ja
Inventor
芳尚 河野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2006152302A priority Critical patent/JP4451416B2/ja
Priority to CN2007101046271A priority patent/CN101082636B/zh
Priority to TW096119374A priority patent/TWI438853B/zh
Priority to US11/756,281 priority patent/US7800387B2/en
Priority to KR1020070053153A priority patent/KR100910668B1/ko
Publication of JP2007324340A publication Critical patent/JP2007324340A/ja
Publication of JP2007324340A5 publication Critical patent/JP2007324340A5/ja
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Publication of JP4451416B2 publication Critical patent/JP4451416B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006152302A 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置 Active JP4451416B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006152302A JP4451416B2 (ja) 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置
CN2007101046271A CN101082636B (zh) 2006-05-31 2007-05-18 探针顶端的检测方法、校准方法及探针装置
TW096119374A TWI438853B (zh) 2006-05-31 2007-05-30 The detection method of the probe tip, the alignment method, and the memory medium and the probe device
US11/756,281 US7800387B2 (en) 2006-05-31 2007-05-31 Method for detecting tips of probes, alignment method and storage medium storing the methods, and probe apparatus
KR1020070053153A KR100910668B1 (ko) 2006-05-31 2007-05-31 프로브선단의 검출 방법, 얼라인먼트 방법 및 이들방법들을 기록한 기억 매체, 및 프로브 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006152302A JP4451416B2 (ja) 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置

Publications (3)

Publication Number Publication Date
JP2007324340A JP2007324340A (ja) 2007-12-13
JP2007324340A5 JP2007324340A5 (enExample) 2009-06-18
JP4451416B2 true JP4451416B2 (ja) 2010-04-14

Family

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Family Applications (1)

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JP2006152302A Active JP4451416B2 (ja) 2006-05-31 2006-05-31 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置

Country Status (5)

Country Link
US (1) US7800387B2 (enExample)
JP (1) JP4451416B2 (enExample)
KR (1) KR100910668B1 (enExample)
CN (1) CN101082636B (enExample)
TW (1) TWI438853B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190074966A (ko) 2017-12-20 2019-06-28 도쿄엘렉트론가부시키가이샤 프로버

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4695106B2 (ja) * 2007-02-21 2011-06-08 東京エレクトロン株式会社 チャックトップの高さを求める方法及びこの方法を記録したプログラム記録媒体
JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
KR100948805B1 (ko) * 2009-08-07 2010-03-24 주식회사 에이디엔티 전자 방해 검출 장치 및 그 제어 방법
TWI509265B (zh) * 2012-04-18 2015-11-21 Chipmos Technologies Inc 垂直式探針卡及應用其之檢測模組
US8659308B1 (en) * 2012-10-09 2014-02-25 Rudolph Technolgies, Inc. Selective overtravel during electrical test of probe cards
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
CN102878974B (zh) * 2012-10-19 2015-10-07 上海华岭集成电路技术股份有限公司 探针卡平整度检测方法
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
JP5664938B2 (ja) * 2013-02-01 2015-02-04 株式会社東京精密 プローバ及びプローブ検査方法
JP5571224B2 (ja) * 2013-04-25 2014-08-13 東京エレクトロン株式会社 針先位置検出装置及びプローブ装置
US9417308B2 (en) 2013-07-03 2016-08-16 Stichting Continuiteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
CN103575176A (zh) * 2013-07-29 2014-02-12 共青城赛龙通信技术有限责任公司 贴合尺寸检测设备
CN103809100B (zh) * 2014-03-07 2016-03-09 上海华虹宏力半导体制造有限公司 晶圆自动测试系统
WO2016024346A1 (ja) 2014-08-13 2016-02-18 株式会社東京精密 プローバ及びプローブ検査方法
JP5692621B1 (ja) * 2014-12-11 2015-04-01 株式会社東京精密 測定装置及び測定方法
JP5747428B2 (ja) * 2015-02-06 2015-07-15 株式会社東京精密 位置決め固定装置
JP6515003B2 (ja) * 2015-09-24 2019-05-15 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
CN105223389B (zh) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 一种飞针测试机的对位方法
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP2017129395A (ja) * 2016-01-19 2017-07-27 三菱電機株式会社 半導体装置の検査装置および半導体装置の検査方法
JP6149338B1 (ja) * 2016-03-28 2017-06-21 株式会社東京精密 プローバ及びプローバの操作方法
WO2017170393A1 (ja) 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6308639B1 (ja) * 2017-08-07 2018-04-11 株式会社テクノホロン プロービングステーション
TWI652483B (zh) * 2017-12-12 2019-03-01 穩懋半導體股份有限公司 用於晶圓針測系統之非均質性接收器與非等向性發射器之對位方法
US12055563B2 (en) * 2021-08-30 2024-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card, apparatus and method for detecting contact force of probe card
CN113917202B (zh) * 2021-09-23 2023-09-12 合肥欣奕华智能机器股份有限公司 探针安装高度校准设备、方法、控制器及计算机存储介质
CN116255942B (zh) * 2022-09-09 2025-10-21 厦门通富微电子有限公司 一种顶针检测装置及检测方法
CN115831797B (zh) * 2022-12-26 2023-10-13 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机
CN119085504B (zh) * 2024-08-28 2025-09-23 华工科技产业股份有限公司 一种探针焊接高度对位检测方法、设备及系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328553A (en) * 1976-12-07 1982-05-04 Computervision Corporation Method and apparatus for targetless wafer alignment
US5321352A (en) * 1991-08-01 1994-06-14 Tokyo Electron Yamanashi Limited Probe apparatus and method of alignment for the same
JP3163221B2 (ja) 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
US5642056A (en) 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5585738A (en) * 1994-03-31 1996-12-17 Tokyo Electron Limited Probe system having vertical height detection and double focal image pickup coinciding with probe contact in height adjustment
WO1996029607A1 (en) * 1995-03-18 1996-09-26 Tokyo Electron Limited Method and apparatus for inspecting substrate
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
JP3623413B2 (ja) 1999-10-29 2005-02-23 Ｎｅｃエレクトロニクス株式会社 プローブカード
JP4721247B2 (ja) 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
KR20030000352A (ko) * 2001-06-23 2003-01-06 삼성전자 주식회사 프로브 니들의 정렬 방법
JP4339631B2 (ja) 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Ｏｋｉセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190074966A (ko) 2017-12-20 2019-06-28 도쿄엘렉트론가부시키가이샤 프로버
JP2019110259A (ja) * 2017-12-20 2019-07-04 東京エレクトロン株式会社 プローバ

Also Published As

Publication number Publication date
US7800387B2 (en) 2010-09-21
TW200814217A (en) 2008-03-16
US20070296427A1 (en) 2007-12-27
KR100910668B1 (ko) 2009-08-04
CN101082636B (zh) 2012-05-30
TWI438853B (zh) 2014-05-21
CN101082636A (zh) 2007-12-05
JP2007324340A (ja) 2007-12-13
KR20070115737A (ko) 2007-12-06

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