CN101077956B - 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 - Google Patents

挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 Download PDF

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Publication number
CN101077956B
CN101077956B CN2007101061106A CN200710106110A CN101077956B CN 101077956 B CN101077956 B CN 101077956B CN 2007101061106 A CN2007101061106 A CN 2007101061106A CN 200710106110 A CN200710106110 A CN 200710106110A CN 101077956 B CN101077956 B CN 101077956B
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China
Prior art keywords
solder resist
flexible substrate
resist composition
epoxy resin
type epoxy
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CN2007101061106A
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Chinese (zh)
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CN101077956A (zh
Inventor
大胡义和
宇敷滋
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2007101061106A 2006-05-26 2007-05-25 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 Active CN101077956B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006146994 2006-05-26
JP2006146994A JP4864545B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法
JP2006146993A JP4871646B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板およびフレキシブル基板の製造方法
JP2006-146994 2006-05-26
JP2006146993 2006-05-26
JP2006-146993 2006-05-26

Publications (2)

Publication Number Publication Date
CN101077956A CN101077956A (zh) 2007-11-28
CN101077956B true CN101077956B (zh) 2010-12-08

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Country Status (4)

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JP (2) JP4864545B2 (enExample)
KR (1) KR100830810B1 (enExample)
CN (1) CN101077956B (enExample)
TW (1) TW200811236A (enExample)

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DE102010014319A1 (de) * 2010-01-29 2011-08-04 Siemens Aktiengesellschaft, 80333 Dämpfungsmasse für Ultraschallsensor, Verwendung eines Epoxidharzes
TWI546150B (zh) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
CN102933033B (zh) * 2012-10-31 2015-04-22 广州金鹏源康精密电路股份有限公司 一种pi油墨的运用方法
KR101451568B1 (ko) 2013-03-27 2014-10-22 주식회사 엘 앤 에프 방열구조를 갖는 인쇄회로기판
KR101687394B1 (ko) 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
CN105820646A (zh) * 2015-01-04 2016-08-03 赖中平 防焊油墨及其制造方法
JP7306381B2 (ja) * 2018-05-11 2023-07-11 株式会社レゾナック 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP7071300B2 (ja) * 2019-01-21 2022-05-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム、半導体積層体、半導体積層体の製造方法及び半導体装置の製造方法
JP7336881B2 (ja) * 2019-06-06 2023-09-01 太陽ホールディングス株式会社 熱硬化性組成物及びその硬化被膜を有する被覆基材

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CN1498236A (zh) * 2001-03-23 2004-05-19 太阳油墨制造株式会社 活性能量线固化树脂和含其的光固化·热固性树脂组合物
CN1523058A (zh) * 2003-02-18 2004-08-25 �������ɹ�ҵ��ʽ���� 绝缘树脂组合物及其制备方法、多层布线板及其生产方法
WO2005100448A1 (ja) * 2004-03-31 2005-10-27 Taiyo Ink Manufacturing Co., Ltd. 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物

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TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
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CN1498236A (zh) * 2001-03-23 2004-05-19 太阳油墨制造株式会社 活性能量线固化树脂和含其的光固化·热固性树脂组合物
CN1523058A (zh) * 2003-02-18 2004-08-25 �������ɹ�ҵ��ʽ���� 绝缘树脂组合物及其制备方法、多层布线板及其生产方法
WO2005100448A1 (ja) * 2004-03-31 2005-10-27 Taiyo Ink Manufacturing Co., Ltd. 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物

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Also Published As

Publication number Publication date
KR100830810B1 (ko) 2008-05-19
JP4864545B2 (ja) 2012-02-01
JP2007317945A (ja) 2007-12-06
JP4871646B2 (ja) 2012-02-08
JP2007314695A (ja) 2007-12-06
TWI379865B (enExample) 2012-12-21
KR20070114027A (ko) 2007-11-29
CN101077956A (zh) 2007-11-28
TW200811236A (en) 2008-03-01

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EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20071128

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Welding resistant agent composition for flexible substrate, flexible substrate and preparation method for the flexible substrate

Granted publication date: 20101208

License type: Common License

Record date: 20110302

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
EC01 Cancellation of recordation of patent licensing contract

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Date of cancellation: 20250512

EC01 Cancellation of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20071128

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: X2025990000228

Denomination of invention: Welding resistant agent composition for flexible substrate, flexible substrate and preparation method for the flexible substrate

Granted publication date: 20101208

License type: Common License

Record date: 20250609

EE01 Entry into force of recordation of patent licensing contract