CN100483713C - 半导体器件和显示器件 - Google Patents
半导体器件和显示器件 Download PDFInfo
- Publication number
- CN100483713C CN100483713C CNB2004100898266A CN200410089826A CN100483713C CN 100483713 C CN100483713 C CN 100483713C CN B2004100898266 A CNB2004100898266 A CN B2004100898266A CN 200410089826 A CN200410089826 A CN 200410089826A CN 100483713 C CN100483713 C CN 100483713C
- Authority
- CN
- China
- Prior art keywords
- circuit
- logic circuit
- gate
- gate circuit
- side logic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/20—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP373775/2003 | 2003-10-31 | ||
| JP2003373775A JP4683833B2 (ja) | 2003-10-31 | 2003-10-31 | 機能回路及びその設計方法 |
| JP373775/03 | 2003-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1612345A CN1612345A (zh) | 2005-05-04 |
| CN100483713C true CN100483713C (zh) | 2009-04-29 |
Family
ID=34649693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100898266A Expired - Fee Related CN100483713C (zh) | 2003-10-31 | 2004-11-01 | 半导体器件和显示器件 |
Country Status (4)
| Country | Link |
|---|---|
| US (5) | US7456660B2 (https=) |
| JP (1) | JP4683833B2 (https=) |
| KR (3) | KR101129597B1 (https=) |
| CN (1) | CN100483713C (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4481155B2 (ja) * | 2004-12-08 | 2010-06-16 | パナソニック株式会社 | セルの入力端子容量の算出方法、および遅延算出方法 |
| JP4801942B2 (ja) * | 2005-07-08 | 2011-10-26 | 東芝モバイルディスプレイ株式会社 | 薄膜トランジスタ搭載配線基板 |
| KR100729099B1 (ko) * | 2005-09-20 | 2007-06-14 | 삼성에스디아이 주식회사 | 주사 구동회로와 이를 이용한 유기 전계발광 장치 |
| US7867867B2 (en) * | 2005-11-07 | 2011-01-11 | Samsung Electronics Co., Ltd. | Methods of manufacturing semiconductor devices |
| CN100388491C (zh) * | 2006-03-13 | 2008-05-14 | 友达光电股份有限公司 | 显示器电路结构 |
| US7443202B2 (en) * | 2006-06-02 | 2008-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic apparatus having the same |
| US8976103B2 (en) | 2007-06-29 | 2015-03-10 | Japan Display West Inc. | Display apparatus, driving method for display apparatus and electronic apparatus |
| JP5457628B2 (ja) * | 2007-10-26 | 2014-04-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びそのタイミング制御方法 |
| CN102165578B (zh) * | 2008-09-23 | 2014-01-29 | 株式会社半导体能源研究所 | 用于制造半导体器件的方法 |
| US8384439B2 (en) * | 2008-11-28 | 2013-02-26 | Samsung Electronics Co., Ltd. | Semiconductor devices and methods of fabricating the same |
| JP5526561B2 (ja) * | 2009-02-26 | 2014-06-18 | 富士通セミコンダクター株式会社 | 半導体装置のセルレイアウト方法及び半導体装置 |
| JP5423809B2 (ja) * | 2009-12-18 | 2014-02-19 | 富士通株式会社 | ラッチ回路及びクロック制御回路 |
| US9425772B2 (en) | 2011-07-27 | 2016-08-23 | Nvidia Corporation | Coupling resistance and capacitance analysis systems and methods |
| WO2013016305A2 (en) | 2011-07-22 | 2013-01-31 | Nvidia Corporation | Component analysis systems and methods |
| US9448125B2 (en) | 2011-11-01 | 2016-09-20 | Nvidia Corporation | Determining on-chip voltage and temperature |
| US8952705B2 (en) * | 2011-11-01 | 2015-02-10 | Nvidia Corporation | System and method for examining asymetric operations |
| KR101947019B1 (ko) * | 2012-10-26 | 2019-02-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| CN103983809A (zh) | 2013-02-08 | 2014-08-13 | 辉达公司 | Pcb板及其在线测试结构以及该在线测试结构的制造方法 |
| US8904322B2 (en) * | 2013-03-26 | 2014-12-02 | International Business Machines Corporation | Structure for stacked CMOS circuits |
| US9122823B2 (en) | 2013-12-20 | 2015-09-01 | International Business Machines Corporation | Stacked multiple-input delay gates |
| JP2015188071A (ja) | 2014-03-14 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6836137B2 (ja) * | 2016-11-17 | 2021-02-24 | セイコーエプソン株式会社 | 半導体装置及びそのレイアウト設計方法 |
| CN107330200B (zh) * | 2017-07-03 | 2020-12-08 | 京东方科技集团股份有限公司 | 薄膜晶体管的耐受静电电压的确定方法及设备 |
| US10586865B2 (en) * | 2017-09-29 | 2020-03-10 | Cirrus Logic, Inc. | Dual gate metal-oxide-semiconductor field-effect transistor |
| CN108735163B (zh) * | 2018-05-30 | 2020-11-17 | 京东方科技集团股份有限公司 | 用于阵列基板行驱动单元的或逻辑运算电路 |
| CN113571585B (zh) * | 2021-07-07 | 2023-10-13 | 沈阳工业大学 | 低功耗双层阻挡接触式双向异或非门集成电路及制造方法 |
| KR102832645B1 (ko) | 2021-10-26 | 2025-07-09 | 삼성전자주식회사 | 집적된 표준 셀 구조를 포함하는 집적 회로 |
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| JPH0794586B2 (ja) | 1987-06-03 | 1995-10-11 | 株式会社日本触媒 | 耐熱分解性の改良されたメタクリル系樹脂組成物 |
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-
2003
- 2003-10-31 JP JP2003373775A patent/JP4683833B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-18 US US10/965,894 patent/US7456660B2/en not_active Expired - Fee Related
- 2004-10-28 KR KR1020040086469A patent/KR101129597B1/ko not_active Expired - Fee Related
- 2004-11-01 CN CNB2004100898266A patent/CN100483713C/zh not_active Expired - Fee Related
-
2008
- 2008-11-14 US US12/270,903 patent/US7791373B2/en not_active Expired - Fee Related
-
2010
- 2010-09-03 US US12/875,172 patent/US8143919B2/en not_active Expired - Fee Related
-
2011
- 2011-11-22 KR KR1020110122105A patent/KR101440805B1/ko not_active Expired - Fee Related
-
2012
- 2012-03-26 US US13/429,595 patent/US8704551B2/en not_active Expired - Fee Related
-
2013
- 2013-06-04 KR KR1020130064011A patent/KR101401517B1/ko not_active Expired - Fee Related
-
2014
- 2014-04-21 US US14/257,073 patent/US9166600B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8704551B2 (en) | 2014-04-22 |
| US20100327911A1 (en) | 2010-12-30 |
| KR101129597B1 (ko) | 2012-03-27 |
| US20140225647A1 (en) | 2014-08-14 |
| KR20050041913A (ko) | 2005-05-04 |
| KR101401517B1 (ko) | 2014-06-03 |
| KR20110132541A (ko) | 2011-12-08 |
| US7456660B2 (en) | 2008-11-25 |
| JP4683833B2 (ja) | 2011-05-18 |
| US7791373B2 (en) | 2010-09-07 |
| JP2005136359A (ja) | 2005-05-26 |
| CN1612345A (zh) | 2005-05-04 |
| US20090072862A1 (en) | 2009-03-19 |
| KR20130069703A (ko) | 2013-06-26 |
| US20050138507A1 (en) | 2005-06-23 |
| US9166600B2 (en) | 2015-10-20 |
| KR101440805B1 (ko) | 2014-09-23 |
| US20120229166A1 (en) | 2012-09-13 |
| US8143919B2 (en) | 2012-03-27 |
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