CN100450643C - 狭缝喷嘴前端的调整装置和调整方法 - Google Patents
狭缝喷嘴前端的调整装置和调整方法 Download PDFInfo
- Publication number
- CN100450643C CN100450643C CNB200510067722XA CN200510067722A CN100450643C CN 100450643 C CN100450643 C CN 100450643C CN B200510067722X A CNB200510067722X A CN B200510067722XA CN 200510067722 A CN200510067722 A CN 200510067722A CN 100450643 C CN100450643 C CN 100450643C
- Authority
- CN
- China
- Prior art keywords
- spray nozzle
- slit spray
- mentioned
- cleaning part
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004089524A JP4526288B2 (ja) | 2004-03-25 | 2004-03-25 | スリットノズル先端の調整装置及び調整方法 |
JP89524/2004 | 2004-03-25 | ||
JP89524/04 | 2004-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1672806A CN1672806A (zh) | 2005-09-28 |
CN100450643C true CN100450643C (zh) | 2009-01-14 |
Family
ID=35045730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510067722XA Active CN100450643C (zh) | 2004-03-25 | 2005-03-24 | 狭缝喷嘴前端的调整装置和调整方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4526288B2 (zh) |
KR (1) | KR101075276B1 (zh) |
CN (1) | CN100450643C (zh) |
TW (1) | TWI364063B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100756811B1 (ko) * | 2005-11-24 | 2007-09-10 | 쥬가이로 고교 가부시키가이샤 | 토출 노즐의 세정장치 |
JP4841280B2 (ja) * | 2006-03-24 | 2011-12-21 | 東京応化工業株式会社 | スリットノズル洗浄方法 |
JP2008118027A (ja) * | 2006-11-07 | 2008-05-22 | Disco Abrasive Syst Ltd | 保護膜被覆装置 |
JP5301120B2 (ja) * | 2007-07-03 | 2013-09-25 | 東京応化工業株式会社 | 洗浄装置、洗浄方法、予備吐出装置、及び塗布装置 |
JP5144976B2 (ja) * | 2007-07-03 | 2013-02-13 | 東京応化工業株式会社 | 洗浄装置、洗浄方法、予備吐出装置、及び塗布装置 |
JP5337357B2 (ja) * | 2007-07-06 | 2013-11-06 | 東京応化工業株式会社 | 塗布装置 |
JP5036664B2 (ja) * | 2008-09-04 | 2012-09-26 | 東京エレクトロン株式会社 | 液処理におけるノズル洗浄、処理液乾燥防止方法及びその装置 |
JP2010240550A (ja) * | 2009-04-03 | 2010-10-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP5226046B2 (ja) * | 2010-08-18 | 2013-07-03 | 東京エレクトロン株式会社 | 塗布装置及びノズルのメンテナンス方法 |
KR101960272B1 (ko) * | 2012-09-07 | 2019-03-20 | 세메스 주식회사 | 처리액 도포 장치 및 방법 |
KR101977627B1 (ko) * | 2012-10-23 | 2019-05-13 | 세메스 주식회사 | 처리액 도포 장치 |
JP6319941B2 (ja) | 2013-03-15 | 2018-05-09 | 株式会社Screenホールディングス | 基板処理装置および吐出ヘッド待機方法 |
JP6077437B2 (ja) * | 2013-05-31 | 2017-02-08 | 東京エレクトロン株式会社 | 基板処理装置およびノズル洗浄方法 |
CN103331276B (zh) * | 2013-07-12 | 2016-05-18 | 深圳市华星光电技术有限公司 | 超声波清洗装置和具有该超声波清洗装置的涂布机 |
CN106345720B (zh) * | 2015-07-17 | 2019-04-30 | 沈阳芯源微电子设备有限公司 | 一种喷涂用喷嘴自动清洗装置及其清洗方法 |
CN106040541B (zh) * | 2016-06-17 | 2018-07-03 | 厦门大学 | 太阳能电池片焊带自动清洗与助焊剂涂抹的方法及装置 |
CN106824680B (zh) * | 2017-03-20 | 2019-12-20 | 合肥京东方光电科技有限公司 | 一种用于狭缝喷嘴的排废液槽及狭缝喷嘴清洗装置 |
JP6993871B2 (ja) * | 2017-12-28 | 2022-01-14 | 東京応化工業株式会社 | 塗布装置及び塗布装置の制御方法 |
CN108704897B (zh) * | 2018-05-21 | 2021-04-23 | 昆山龙腾光电股份有限公司 | 涂布机喷嘴的清洁装置以及清洁方法 |
JP6965445B2 (ja) * | 2018-06-18 | 2021-11-10 | 株式会社Fuji | 吸着ノズル管理装置と吸着ノズル管理方法 |
CN108817123B (zh) * | 2018-08-13 | 2023-08-18 | 佛山博睿荣创智能科技有限公司 | 一种型材自动化生产线 |
CN108906757B (zh) * | 2018-08-13 | 2023-08-22 | 佛山博睿荣创智能科技有限公司 | 一种型材的清洗方法及清洗设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10308338A (ja) * | 1997-05-01 | 1998-11-17 | Tokyo Ohka Kogyo Co Ltd | 塗布ノズルの洗浄装置及び洗浄方法 |
CN1435733A (zh) * | 2002-01-28 | 2003-08-13 | 株式会社东芝 | 基板处理方法和装置、显影方法及半导体装置的制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11219218A (ja) * | 1998-02-03 | 1999-08-10 | Mitsubishi Chemical Engineering Corp | 計量分流装置 |
JP4253376B2 (ja) * | 1998-08-25 | 2009-04-08 | 高砂熱学工業株式会社 | 空気通路の流量調節装置 |
JP3808649B2 (ja) * | 1998-12-10 | 2006-08-16 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3511106B2 (ja) * | 1999-04-07 | 2004-03-29 | 東京応化工業株式会社 | スリットノズルの洗浄装置 |
JP3836305B2 (ja) * | 2000-07-24 | 2006-10-25 | 東京エレクトロン株式会社 | 現像処理装置 |
-
2004
- 2004-03-25 JP JP2004089524A patent/JP4526288B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-24 CN CNB200510067722XA patent/CN100450643C/zh active Active
- 2005-03-24 KR KR1020050024438A patent/KR101075276B1/ko active IP Right Grant
- 2005-03-25 TW TW094109478A patent/TWI364063B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10308338A (ja) * | 1997-05-01 | 1998-11-17 | Tokyo Ohka Kogyo Co Ltd | 塗布ノズルの洗浄装置及び洗浄方法 |
US6090216A (en) * | 1997-05-01 | 2000-07-18 | Tokyo Ohka Kogyo Co., Ltd. | Cleaning device and cleaning method for applicator nozzle |
CN1435733A (zh) * | 2002-01-28 | 2003-08-13 | 株式会社东芝 | 基板处理方法和装置、显影方法及半导体装置的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1672806A (zh) | 2005-09-28 |
JP2005270848A (ja) | 2005-10-06 |
TW200535993A (en) | 2005-11-01 |
KR101075276B1 (ko) | 2011-10-19 |
KR20060044674A (ko) | 2006-05-16 |
TWI364063B (en) | 2012-05-11 |
JP4526288B2 (ja) | 2010-08-18 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230609 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. Effective date of registration: 20230609 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Address before: Kawasaki, Japan Patentee before: TOKYO OHKA KOGYO CO.,LTD. |