CN100437234C - 驱动芯片及具有该驱动芯片的显示装置 - Google Patents
驱动芯片及具有该驱动芯片的显示装置 Download PDFInfo
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- CN100437234C CN100437234C CNB2004101012252A CN200410101225A CN100437234C CN 100437234 C CN100437234 C CN 100437234C CN B2004101012252 A CNB2004101012252 A CN B2004101012252A CN 200410101225 A CN200410101225 A CN 200410101225A CN 100437234 C CN100437234 C CN 100437234C
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- chip
- lead
- terminal
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030091951A KR101051013B1 (ko) | 2003-12-16 | 2003-12-16 | 구동 칩 및 이를 갖는 표시장치 |
KR200391951 | 2003-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1629926A CN1629926A (zh) | 2005-06-22 |
CN100437234C true CN100437234C (zh) | 2008-11-26 |
Family
ID=34793179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004101012252A Expired - Fee Related CN100437234C (zh) | 2003-12-16 | 2004-12-16 | 驱动芯片及具有该驱动芯片的显示装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7327411B2 (zh) |
JP (1) | JP4782410B2 (zh) |
KR (1) | KR101051013B1 (zh) |
CN (1) | CN100437234C (zh) |
TW (1) | TWI366015B (zh) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101051013B1 (ko) * | 2003-12-16 | 2011-07-21 | 삼성전자주식회사 | 구동 칩 및 이를 갖는 표시장치 |
TW200634375A (en) * | 2005-03-28 | 2006-10-01 | Elan Microelectronics Corp | Power line structure for liquid crystal display panel |
EP1770610A3 (en) * | 2005-09-29 | 2010-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5292665B2 (ja) * | 2005-10-31 | 2013-09-18 | 株式会社ジャパンディスプレイ | 表示装置 |
JP4943691B2 (ja) | 2005-10-31 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2008164787A (ja) | 2006-12-27 | 2008-07-17 | Epson Imaging Devices Corp | 液晶表示装置 |
KR101387922B1 (ko) * | 2007-07-24 | 2014-04-22 | 삼성디스플레이 주식회사 | 구동 칩, 이를 갖는 구동 칩 패키지 및 표시 장치 |
JP2009192796A (ja) * | 2008-02-14 | 2009-08-27 | Seiko Instruments Inc | 液晶表示装置 |
JP5246782B2 (ja) | 2008-03-06 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | 液晶装置および電子機器 |
US8299631B2 (en) * | 2008-09-01 | 2012-10-30 | Sharp Kabushiki Kaisha | Semiconductor element and display device provided with the same |
US20120080789A1 (en) * | 2009-06-16 | 2012-04-05 | Sharp Kabushiki Kaisha | SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended) |
KR20110014033A (ko) * | 2009-08-04 | 2011-02-10 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP5250525B2 (ja) * | 2009-10-16 | 2013-07-31 | 株式会社ジャパンディスプレイセントラル | 表示装置 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
JP2012227480A (ja) * | 2011-04-22 | 2012-11-15 | Japan Display East Co Ltd | 表示装置及び半導体集積回路装置 |
JP2014026042A (ja) * | 2012-07-25 | 2014-02-06 | Japan Display Inc | 表示装置 |
KR20140025253A (ko) * | 2012-08-22 | 2014-03-04 | 삼성디스플레이 주식회사 | 구동칩 및 그 제조방법 |
CN104704621B (zh) * | 2012-10-11 | 2017-08-25 | 夏普株式会社 | 驱动芯片和显示装置 |
KR101983374B1 (ko) * | 2012-11-06 | 2019-08-29 | 삼성디스플레이 주식회사 | 표시 패널, 칩 온 필름, 및 이들을 포함하는 표시 장치 |
US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
KR102379591B1 (ko) * | 2014-04-10 | 2022-03-30 | 삼성디스플레이 주식회사 | 전자부품, 이를 포함하는 전자기기 및 전자기기의 본딩 방법 |
CN103488338A (zh) * | 2013-08-30 | 2014-01-01 | 江西合力泰科技股份有限公司 | 一种改善触摸屏邦定效果的方法 |
KR101849339B1 (ko) | 2013-09-30 | 2018-04-17 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
JP6457214B2 (ja) * | 2014-08-08 | 2019-01-23 | デクセリアルズ株式会社 | 電子部品、接続体、接続体の製造方法及び電子部品の接続方法 |
KR102373907B1 (ko) * | 2013-12-20 | 2022-03-15 | 데쿠세리아루즈 가부시키가이샤 | 전자 부품, 접속체, 접속체의 제조 방법 및 전자 부품의 접속 방법 |
KR102081129B1 (ko) * | 2013-12-20 | 2020-02-25 | 엘지디스플레이 주식회사 | 액정표시장치 |
JP6434210B2 (ja) * | 2013-12-20 | 2018-12-05 | デクセリアルズ株式会社 | 電子部品、接続体、接続体の製造方法及び電子部品の接続方法 |
JP6645730B2 (ja) | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
JP6324746B2 (ja) | 2014-02-03 | 2018-05-16 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、電子機器 |
JP2015179831A (ja) | 2014-02-27 | 2015-10-08 | デクセリアルズ株式会社 | 接続体、接続体の製造方法及び検査方法 |
JP6435627B2 (ja) | 2014-03-20 | 2018-12-12 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1135798A (zh) * | 1994-09-16 | 1996-11-13 | 精工爱普生株式会社 | 液晶显示装置、其安装结构及电子设备 |
CN1242840A (zh) * | 1997-10-20 | 2000-01-26 | 西铁城时计株式会社 | 用于驱动液晶的集成电路 |
JP2001094053A (ja) * | 1999-09-22 | 2001-04-06 | Hitachi Ltd | 半導体集積回路および液晶表示装置 |
CN1319825A (zh) * | 2000-02-02 | 2001-10-31 | 卡西欧计算机株式会社 | 显示装置 |
JP2002215059A (ja) * | 2001-01-18 | 2002-07-31 | Seiko Epson Corp | 電気光学装置 |
CN1368718A (zh) * | 2001-02-07 | 2002-09-11 | 三星电子株式会社 | 液晶显示器及其制造方法 |
CN1387633A (zh) * | 2000-09-08 | 2002-12-25 | 西铁城时计株式会社 | 液晶显示装置 |
CN1410965A (zh) * | 2001-09-26 | 2003-04-16 | 株式会社日立制作所 | 显示装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05235089A (ja) * | 1992-02-26 | 1993-09-10 | Fujitsu Ltd | フェイスダウン実装用半導体チップ |
JP3334816B2 (ja) * | 1993-09-10 | 2002-10-15 | ソニー株式会社 | 半導体装置及び半導体装置の実装方法 |
JP2732553B2 (ja) * | 1993-11-26 | 1998-03-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶ディスプレイ、接続方法、熱応力伝搬防止方法 |
JP3556315B2 (ja) * | 1995-03-20 | 2004-08-18 | 株式会社東芝 | 表示装置及び半導体素子 |
US6172732B1 (en) * | 1995-06-16 | 2001-01-09 | Hitachi, Ltd. | Liquid crystal display device suited to narrow frame |
US6054975A (en) * | 1996-08-01 | 2000-04-25 | Hitachi, Ltd. | Liquid crystal display device having tape carrier packages |
JPH10154727A (ja) * | 1996-11-25 | 1998-06-09 | Toshiba Electron Eng Corp | 細長型ドライバic及びこれを用いた平面表示装置 |
JPH10319419A (ja) | 1997-05-19 | 1998-12-04 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
KR20010018964A (ko) * | 1999-08-24 | 2001-03-15 | 윤종용 | 리드가 없는 반도체 패키지 |
JP2002217237A (ja) | 2001-01-17 | 2002-08-02 | Toshiba Corp | 平面表示装置 |
JP3744450B2 (ja) * | 2001-05-09 | 2006-02-08 | セイコーエプソン株式会社 | 電気光学装置、駆動用ic及び電子機器 |
TW506103B (en) * | 2001-08-06 | 2002-10-11 | Au Optronics Corp | Bump layout on a chip |
JP3895199B2 (ja) * | 2002-03-08 | 2007-03-22 | 株式会社 日立ディスプレイズ | 表示装置 |
KR100857494B1 (ko) * | 2002-04-30 | 2008-09-08 | 삼성전자주식회사 | 구동 집적 회로 패키지 및 이를 이용한 칩 온 글래스액정표시장치 |
KR101022278B1 (ko) * | 2003-12-15 | 2011-03-21 | 삼성전자주식회사 | 구동 칩 및 이를 갖는 표시장치 |
KR101051013B1 (ko) * | 2003-12-16 | 2011-07-21 | 삼성전자주식회사 | 구동 칩 및 이를 갖는 표시장치 |
JP4228948B2 (ja) * | 2004-03-16 | 2009-02-25 | 日本電気株式会社 | 表示装置 |
TWI271691B (en) * | 2004-07-07 | 2007-01-21 | Chi Mei Optoelectronics Corp | Liquid crystal panel structure |
US7446398B2 (en) * | 2006-08-01 | 2008-11-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bump pattern design for flip chip semiconductor package |
-
2003
- 2003-12-16 KR KR1020030091951A patent/KR101051013B1/ko not_active IP Right Cessation
-
2004
- 2004-12-13 JP JP2004359397A patent/JP4782410B2/ja not_active Expired - Fee Related
- 2004-12-15 TW TW093138916A patent/TWI366015B/zh not_active IP Right Cessation
- 2004-12-16 US US11/012,228 patent/US7327411B2/en not_active Expired - Fee Related
- 2004-12-16 CN CNB2004101012252A patent/CN100437234C/zh not_active Expired - Fee Related
-
2007
- 2007-12-12 US US11/954,772 patent/US7903067B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1135798A (zh) * | 1994-09-16 | 1996-11-13 | 精工爱普生株式会社 | 液晶显示装置、其安装结构及电子设备 |
CN1242840A (zh) * | 1997-10-20 | 2000-01-26 | 西铁城时计株式会社 | 用于驱动液晶的集成电路 |
JP2001094053A (ja) * | 1999-09-22 | 2001-04-06 | Hitachi Ltd | 半導体集積回路および液晶表示装置 |
CN1319825A (zh) * | 2000-02-02 | 2001-10-31 | 卡西欧计算机株式会社 | 显示装置 |
CN1387633A (zh) * | 2000-09-08 | 2002-12-25 | 西铁城时计株式会社 | 液晶显示装置 |
JP2002215059A (ja) * | 2001-01-18 | 2002-07-31 | Seiko Epson Corp | 電気光学装置 |
CN1368718A (zh) * | 2001-02-07 | 2002-09-11 | 三星电子株式会社 | 液晶显示器及其制造方法 |
CN1410965A (zh) * | 2001-09-26 | 2003-04-16 | 株式会社日立制作所 | 显示装置 |
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KR20050060349A (ko) | 2005-06-22 |
CN1629926A (zh) | 2005-06-22 |
JP2005203758A (ja) | 2005-07-28 |
US20050162577A1 (en) | 2005-07-28 |
JP4782410B2 (ja) | 2011-09-28 |
US7327411B2 (en) | 2008-02-05 |
TWI366015B (en) | 2012-06-11 |
TW200530676A (en) | 2005-09-16 |
US20080174535A1 (en) | 2008-07-24 |
KR101051013B1 (ko) | 2011-07-21 |
US7903067B2 (en) | 2011-03-08 |
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