CN100396440C - 用于半导体晶片的包含升降机构的适合高压的真空吸盘 - Google Patents

用于半导体晶片的包含升降机构的适合高压的真空吸盘 Download PDF

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Publication number
CN100396440C
CN100396440C CNB2003801028396A CN200380102839A CN100396440C CN 100396440 C CN100396440 C CN 100396440C CN B2003801028396 A CNB2003801028396 A CN B2003801028396A CN 200380102839 A CN200380102839 A CN 200380102839A CN 100396440 C CN100396440 C CN 100396440C
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CN
China
Prior art keywords
wafer
lift pin
platen
actuator mechanism
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2003801028396A
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English (en)
Chinese (zh)
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CN1711154A (zh
Inventor
T·R·苏顿
M·A·比伯格
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1711154A publication Critical patent/CN1711154A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB2003801028396A 2002-11-06 2003-11-03 用于半导体晶片的包含升降机构的适合高压的真空吸盘 Expired - Fee Related CN100396440C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/289,830 2002-11-06
US10/289,830 US6722642B1 (en) 2002-11-06 2002-11-06 High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism

Publications (2)

Publication Number Publication Date
CN1711154A CN1711154A (zh) 2005-12-21
CN100396440C true CN100396440C (zh) 2008-06-25

Family

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Family Applications (1)

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CNB2003801028396A Expired - Fee Related CN100396440C (zh) 2002-11-06 2003-11-03 用于半导体晶片的包含升降机构的适合高压的真空吸盘

Country Status (7)

Country Link
US (1) US6722642B1 (https=)
EP (1) EP1560680A2 (https=)
JP (1) JP2006505952A (https=)
CN (1) CN100396440C (https=)
AU (1) AU2003291698A1 (https=)
TW (1) TWI317675B (https=)
WO (1) WO2004044953A2 (https=)

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KR101071180B1 (ko) * 2009-04-03 2011-10-10 한국생산기술연구원 반도체 웨이퍼 관통 비아홀 내의 금속 필링장치 및 이를 이용한 필링방법
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CN102110634B (zh) * 2010-11-22 2012-04-11 沈阳芯源微电子设备有限公司 可旋转加热的吸附装置
CN102486617B (zh) * 2010-12-06 2013-11-13 上海微电子装备有限公司 精密调整装置
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CN102610543B (zh) * 2012-01-18 2014-07-23 清华大学 用于内部稀薄气流模拟验证及压力检测的变结构真空腔室
CN103219259B (zh) * 2012-01-19 2017-09-12 昆山思拓机器有限公司 一种晶圆加工治具
CN103325722B (zh) * 2013-05-24 2016-04-20 沈阳拓荆科技有限公司 晶圆输送机构及使用方法
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CN104924234B (zh) * 2015-04-30 2016-11-23 东南大学 用于半球试件湿法刻蚀各向异性速率测试的可调整式夹具
JP6510461B2 (ja) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 基板保持装置
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CN110823922A (zh) * 2018-08-10 2020-02-21 鸿富锦精密电子(天津)有限公司 外观检测装置
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法
EP3918421B1 (en) * 2019-12-26 2024-05-15 Nanjing ZongAn Semiconductor Equipment Ltd Tool architecture for wafer geometry measurement in semiconductor industry
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
KR102614741B1 (ko) * 2021-08-14 2023-12-14 램 리써치 코포레이션 반도체 제조 툴들에서 사용하기 위한 클록 가능한 (clockable) 기판 프로세싱 페데스탈
CN115527913A (zh) * 2022-08-15 2022-12-27 恩纳基智能科技无锡有限公司 晶片吸附装置和晶片传送设备

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WO2004044953A2 (en) 2004-05-27
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