CA2769940C - Island matrixed gallium nitride microwave and power switching transistors - Google Patents
Island matrixed gallium nitride microwave and power switching transistors Download PDFInfo
- Publication number
- CA2769940C CA2769940C CA2769940A CA2769940A CA2769940C CA 2769940 C CA2769940 C CA 2769940C CA 2769940 A CA2769940 A CA 2769940A CA 2769940 A CA2769940 A CA 2769940A CA 2769940 C CA2769940 C CA 2769940C
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/351—Substrate regions of field-effect devices
- H10D62/357—Substrate regions of field-effect devices of FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/254—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes extend entirely through the semiconductor bodies, e.g. via-holes for back side contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
Landscapes
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23113909P | 2009-08-04 | 2009-08-04 | |
| US61/231,139 | 2009-08-04 | ||
| PCT/CA2010/001202 WO2011014951A1 (en) | 2009-08-04 | 2010-08-04 | Island matrixed gallium nitride microwave and power switching transistors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2769940A1 CA2769940A1 (en) | 2011-02-10 |
| CA2769940C true CA2769940C (en) | 2016-04-26 |
Family
ID=43543843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2769940A Active CA2769940C (en) | 2009-08-04 | 2010-08-04 | Island matrixed gallium nitride microwave and power switching transistors |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9064947B2 (https=) |
| EP (1) | EP2465141B1 (https=) |
| JP (1) | JP5985393B2 (https=) |
| KR (1) | KR20120041237A (https=) |
| AU (1) | AU2010281317A1 (https=) |
| CA (1) | CA2769940C (https=) |
| WO (1) | WO2011014951A1 (https=) |
Families Citing this family (23)
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| EP2465141B1 (en) | 2009-08-04 | 2021-04-07 | GaN Systems Inc. | Gallium nitride microwave and power switching transistors with matrix layout |
| US9818857B2 (en) | 2009-08-04 | 2017-11-14 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| WO2015061881A1 (en) * | 2013-10-29 | 2015-05-07 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| US9029866B2 (en) * | 2009-08-04 | 2015-05-12 | Gan Systems Inc. | Gallium nitride power devices using island topography |
| DE102010001788A1 (de) | 2010-02-10 | 2011-08-11 | Forschungsverbund Berlin e.V., 12489 | Skalierbarer Aufbau für laterale Halbleiterbauelemente mit hoher Stromtragfähigkeit |
| KR20130088743A (ko) | 2010-04-13 | 2013-08-08 | 갠 시스템즈 인크. | 아일랜드 토폴로지를 이용한 고밀도 질화 갈륨 디바이스 |
| WO2013070971A2 (en) * | 2011-11-09 | 2013-05-16 | Skyworks Solutions, Inc. | Field-effect transistor structures and related radio-frequency switches |
| FR2984429B1 (fr) | 2011-12-16 | 2014-02-14 | Snecma | Bandes d'amortissement de vibrations a evacuation de fluides, pour protection acoustique de carter de soufflante de turbomachine d'aeronef |
| US20140027778A1 (en) * | 2012-07-25 | 2014-01-30 | International Rectifier Corporation | Robust Fused Transistor |
| US9331154B2 (en) * | 2013-08-21 | 2016-05-03 | Epistar Corporation | High electron mobility transistor |
| KR101729653B1 (ko) | 2013-12-30 | 2017-04-25 | 한국전자통신연구원 | 질화물 반도체 소자 |
| GB201418752D0 (en) * | 2014-10-22 | 2014-12-03 | Rolls Royce Plc | Lateral field effect transistor device |
| DE102016103581B4 (de) | 2016-02-29 | 2019-11-14 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit nadelförmigen Feldplatten und einer Gatestruktur mit Rand- und Knotenbereichen |
| US9842920B1 (en) | 2016-07-12 | 2017-12-12 | Semiconductor Components Industries, Llc | Gallium nitride semiconductor device with isolated fingers |
| JP2018026401A (ja) * | 2016-08-08 | 2018-02-15 | アイシン精機株式会社 | 半導体デバイス |
| US10403624B2 (en) | 2017-05-26 | 2019-09-03 | Stmicroelectronics Design And Application S.R.O. | Transistors with octagon waffle gate patterns |
| US10147796B1 (en) * | 2017-05-26 | 2018-12-04 | Stmicroelectronics Design And Application S.R.O. | Transistors with dissimilar square waffle gate patterns |
| US10218346B1 (en) | 2017-09-14 | 2019-02-26 | Gan Systems Inc. | High current lateral GaN transistors with scalable topology and gate drive phase equalization |
| US10529802B2 (en) | 2017-09-14 | 2020-01-07 | Gan Systems Inc. | Scalable circuit-under-pad device topologies for lateral GaN power transistors |
| US11082039B2 (en) | 2017-11-08 | 2021-08-03 | Gan Systems Inc. | GaN transistor with integrated drain voltage sense for fast overcurrent and short circuit protection |
| US11387169B2 (en) | 2020-08-04 | 2022-07-12 | Nxp Usa, Inc. | Transistor with I/O ports in an active area of the transistor |
| US11587852B2 (en) | 2020-10-12 | 2023-02-21 | Nxp Usa, Inc. | Power amplifier modules with flip-chip and non-flip-chip power transistor dies |
| US11502026B2 (en) | 2020-10-12 | 2022-11-15 | Nxp Usa, Inc. | Transistor with flip-chip topology and power amplifier containing same |
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-
2010
- 2010-08-04 EP EP10805910.6A patent/EP2465141B1/en active Active
- 2010-08-04 CA CA2769940A patent/CA2769940C/en active Active
- 2010-08-04 AU AU2010281317A patent/AU2010281317A1/en not_active Abandoned
- 2010-08-04 JP JP2012523170A patent/JP5985393B2/ja active Active
- 2010-08-04 KR KR1020127005615A patent/KR20120041237A/ko not_active Withdrawn
- 2010-08-04 US US13/388,694 patent/US9064947B2/en active Active
- 2010-08-04 WO PCT/CA2010/001202 patent/WO2011014951A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US9064947B2 (en) | 2015-06-23 |
| JP5985393B2 (ja) | 2016-09-06 |
| US20120138950A1 (en) | 2012-06-07 |
| JP2013501362A (ja) | 2013-01-10 |
| KR20120041237A (ko) | 2012-04-30 |
| EP2465141A1 (en) | 2012-06-20 |
| AU2010281317A1 (en) | 2012-02-23 |
| CA2769940A1 (en) | 2011-02-10 |
| WO2011014951A1 (en) | 2011-02-10 |
| EP2465141B1 (en) | 2021-04-07 |
| EP2465141A4 (en) | 2017-04-26 |
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