ATE545665T1 - Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat - Google Patents

Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat

Info

Publication number
ATE545665T1
ATE545665T1 AT09008260T AT09008260T ATE545665T1 AT E545665 T1 ATE545665 T1 AT E545665T1 AT 09008260 T AT09008260 T AT 09008260T AT 09008260 T AT09008260 T AT 09008260T AT E545665 T1 ATE545665 T1 AT E545665T1
Authority
AT
Austria
Prior art keywords
polymer containing
nitrile groups
containing nitrile
synthesizing
laminate
Prior art date
Application number
AT09008260T
Other languages
English (en)
Inventor
Takeyoshi Kano
Hideo Nagasaki
Masataka Sato
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007256746A external-priority patent/JP5164502B2/ja
Priority claimed from JP2007256745A external-priority patent/JP5106025B2/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Application granted granted Critical
Publication of ATE545665T1 publication Critical patent/ATE545665T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/30—Nitriles
    • C08F22/32—Alpha-cyano-acrylic acid; Esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/42—Nitriles
    • C08F220/50—Nitriles containing four or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/18—Homopolymers or copolymers of nitriles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Physical Vapour Deposition (AREA)
AT09008260T 2006-10-23 2007-10-22 Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat ATE545665T1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2006287930 2006-10-23
JP2007095758 2007-03-30
JP2007095760 2007-03-30
JP2007146198 2007-05-31
JP2007146199 2007-05-31
JP2007256746A JP5164502B2 (ja) 2006-10-23 2007-09-28 ニトリル基含有ポリマー、その合成方法、ニトリル基含有ポリマーを用いた組成物、及び積層体
JP2007256745A JP5106025B2 (ja) 2006-10-23 2007-09-28 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物

Publications (1)

Publication Number Publication Date
ATE545665T1 true ATE545665T1 (de) 2012-03-15

Family

ID=39324512

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09008260T ATE545665T1 (de) 2006-10-23 2007-10-22 Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat

Country Status (6)

Country Link
US (2) US20100003533A1 (de)
EP (2) EP2105451B1 (de)
KR (1) KR101459515B1 (de)
CN (1) CN101528458B (de)
AT (1) ATE545665T1 (de)
WO (1) WO2008050715A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866579B2 (ja) * 2002-01-25 2007-01-10 富士フイルムホールディングス株式会社 薄層金属膜
WO2007021980A2 (en) 2005-08-12 2007-02-22 Isotron Corporation Compositionally modulated composite materials and methods for making the same
CN101528458B (zh) * 2006-10-23 2013-10-30 富士胶片株式会社 表面金属膜材料及其制造方法、金属模型材料及其制造方法、聚合物层形成用组合物、含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体
JP5258283B2 (ja) * 2007-12-27 2013-08-07 富士フイルム株式会社 金属箔付基板、及びその作製方法
US8293846B2 (en) * 2008-09-26 2012-10-23 Fujifilm Corporation Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material
JP5258489B2 (ja) * 2008-09-30 2013-08-07 富士フイルム株式会社 金属膜形成方法
JP2010100761A (ja) * 2008-10-24 2010-05-06 Fujifilm Corp 樹脂複合体、積層体
JP2010138475A (ja) * 2008-12-15 2010-06-24 Fujifilm Corp めっき用触媒液、めっき方法、金属膜を有する積層体の製造方法
JP5419441B2 (ja) * 2008-12-26 2014-02-19 富士フイルム株式会社 多層配線基板の形成方法
JP2010239057A (ja) * 2009-03-31 2010-10-21 Fujifilm Corp 回路基板の作製方法
JP2010254971A (ja) * 2009-03-31 2010-11-11 Fujifilm Corp 新規共重合ポリマー、新規共重合ポリマーを含有する組成物、積層体、表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、及び金属パターン材料
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
UA104323C2 (ru) 2009-09-15 2014-01-27 Майлен Груп Сополимеры и сополимерные связующие вещества для светочувствительных покровных композиций для светочувствительных офсетных печатных форм для негативного копирования
JP5642378B2 (ja) * 2009-11-30 2014-12-17 富士フイルム株式会社 絶縁性樹脂、絶縁性樹脂層形成用組成物、積層体、表面金属膜材料の作製方法、金属パターン材料の作製方法、配線基板の作製方法、電子部品、半導体素子
WO2011065568A1 (ja) * 2009-11-30 2011-06-03 富士フイルム株式会社 絶縁性樹脂、絶縁性樹脂層形成用組成物、積層体、表面金属膜材料の作製方法、金属パターン材料の作製方法、配線基板の作製方法、電子部品、及び、半導体素子
RU2559050C2 (ru) 2010-09-14 2015-08-10 Майлан Груп Сополимеры для чувствительных в ближней инфракрасной области излучения композиций для покрытия позитивных термических литографических печатных форм
JP5409575B2 (ja) * 2010-09-29 2014-02-05 富士フイルム株式会社 金属膜材料の製造方法、及びそれを用いた金属膜材料
US9378389B2 (en) 2011-09-09 2016-06-28 Microsoft Technology Licensing, Llc Shared item account selection
US9840058B2 (en) * 2012-10-31 2017-12-12 Dunlop Sports Co. Ltd. Fiber-reinforced epoxy resin material, prepreg and, tubular body made of fiber-reinforced epoxy resin material
JP6065604B2 (ja) * 2013-01-22 2017-01-25 日立金属株式会社 接着剤ワニス、接着フィルム、及び配線フィルム
WO2014146114A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nanolaminate coatings
EP2971266A4 (de) 2013-03-15 2017-03-01 Modumetal, Inc. Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen
WO2016044720A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
WO2014145588A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
BR112015022192A8 (pt) 2013-03-15 2019-11-26 Modumetal Inc artigo e seu método de preparação
WO2014156904A1 (ja) * 2013-03-25 2014-10-02 大日本印刷株式会社 電池用包装材料
US20160145747A1 (en) * 2013-07-09 2016-05-26 United Technologies Corporation Brush plating repair method for plated polymers
JP2017507368A (ja) * 2013-12-23 2017-03-16 ソルベイ スペシャルティ ポリマーズ イタリー エス．ピー．エー． ディスプレイデバイス
CN103936926B (zh) * 2014-04-30 2016-04-06 中国科学院理化技术研究所 侧链带有活性双键的兼具水溶性和油溶性的成膜树脂及其制备方法
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
US10596782B2 (en) * 2015-06-04 2020-03-24 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board and printed circuit board
JP7098606B2 (ja) 2016-09-08 2022-07-11 モジュメタル インコーポレイテッド ワークピース上に積層コーティングを提供するためのプロセス、およびそれから製造される物品
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
AR109648A1 (es) 2016-09-14 2019-01-09 Modumetal Inc Sistema confiable, de alta capacidad, para la generación de campos eléctricos complejos, y método para producir recubrimientos con los mismos
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
FR3061210B1 (fr) * 2016-12-22 2021-12-24 Electricite De France Procede sol-gel de fabrication d'un revetement anticorrosion sur substrat metallique
CN108697001A (zh) * 2017-04-05 2018-10-23 中国科学院宁波材料技术与工程研究所 一种柔性电极和/或电路的制备方法
EP3612669A1 (de) 2017-04-21 2020-02-26 Modumetal, Inc. Rohrförmige artikel mit galvanischen beschichtungen und systeme und verfahren zur herstellung derselben
US11598561B2 (en) * 2017-06-16 2023-03-07 Carrier Corporation Electrocaloric element, a heat transfer system comprising an electrocaloric element and a method of making them
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108912776B (zh) * 2018-07-03 2020-11-10 西安随心呼汽车服务有限公司 一种车漆养护镀膜剂
CN113813792B (zh) * 2021-09-26 2023-12-01 湖北吉星化工集团有限责任公司 一种双极膜电渗析生产次磷酸的工艺

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL90074C (de) * 1954-03-27
BE542272A (de) * 1954-10-25
NL131014C (de) * 1961-06-27
US3448089A (en) * 1966-03-14 1969-06-03 Du Pont Photopolymerizable polymers containing free acid or acid anhydride groups reacted with glycidyl acrylate or glycidyl methacrylate
US3410810A (en) * 1966-05-03 1968-11-12 Goodrich Co B F Polymers of cyanoalkyl epoxy ethers
JPS5226259B2 (de) * 1973-02-10 1977-07-13
JPS5137316A (ja) * 1974-09-27 1976-03-29 Honda Motor Co Ltd Kakyushikienjin
US3998602A (en) * 1975-02-07 1976-12-21 Carl Horowitz Metal plating of polymeric substrates
JPS5940846B2 (ja) * 1975-03-25 1984-10-03 関西ペイント株式会社 非水系不飽和樹脂組成物
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS58196238A (ja) * 1982-05-13 1983-11-15 Toyo Ink Mfg Co Ltd 無電解メツキ方法
JPS62153340A (ja) * 1985-12-27 1987-07-08 Showa Highpolymer Co Ltd 硬化性組成物
JPS6392658A (ja) 1986-10-07 1988-04-23 Bio Material Yunibaasu:Kk 高分子表面改質のための空気酸素溶存下におけるラジカル重合法
JPH04259381A (ja) * 1991-02-14 1992-09-14 Nippon Chem Ind Co Ltd 表面改質した合成樹脂材料の製造方法
US5411795A (en) * 1992-10-14 1995-05-02 Monsanto Company Electroless deposition of metal employing thermally stable carrier polymers
JPH07267897A (ja) * 1994-03-30 1995-10-17 Mitsubishi Rayon Co Ltd ヒドロキシアルキルモノ（メタ）アクリレートの精製方法
JP3557023B2 (ja) 1995-01-11 2004-08-25 積水化学工業株式会社 基材密着性の良好な表面層を有する物品および該物品の製造方法
JP3700273B2 (ja) 1996-08-08 2005-09-28 日本油脂株式会社 防曇膜が形成された物品及びその製造方法
CN1226289A (zh) * 1996-08-21 1999-08-18 陶氏化学公司 耐久的电极涂料
JPH10296895A (ja) 1997-04-23 1998-11-10 Kawamura Inst Of Chem Res 表面親水性成形物、その製造方法、印刷原版及び画像形成方法
JPH11106372A (ja) 1997-10-01 1999-04-20 Toagosei Co Ltd 新規な２−シアノアクリレート
JPH11119413A (ja) 1997-10-09 1999-04-30 Mitsubishi Chemical Corp ダイレクト感光性平版印刷版
JP4096427B2 (ja) * 1998-11-30 2008-06-04 日本化成株式会社 ヒドロキシアルキルアクリレートの製造方法
EP1035439B1 (de) * 1999-02-25 2005-06-15 Dai Nippon Printing Co., Ltd. Lichtempfindliche Zusammensetzung, Farbfilter und dafür geeignetes Copolymerharz
JP4218851B2 (ja) * 1999-02-25 2009-02-04 大日本印刷株式会社 カラーフィルタ保護膜形成用感光性樹脂組成物
JP2002064252A (ja) * 2000-08-22 2002-02-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム、及びこれを用いた積層体、多層配線板
SG107593A1 (en) * 2002-06-04 2004-12-29 Agency Science Tech & Res Method for electroless metalisation of polymer substrate
JP4303522B2 (ja) 2002-09-18 2009-07-29 富士フイルム株式会社 グラフト重合法
JP2004176025A (ja) 2002-09-30 2004-06-24 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、画像表示装置及びハロゲン化銀写真感光材料
EP1581031B1 (de) * 2004-03-25 2010-10-06 FUJIFILM Corporation Verfahren zur Herstellung eines Musters und eines leitfähigen Musters
JP4180004B2 (ja) 2004-03-26 2008-11-12 富士フイルム株式会社 パターン形成方法、グラフトパターン材料、導電性パターン形成方法、及び導電性パターン材料
JP2005347423A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 金属パターン形成方法、及び導電性パターン材料
JP2006057059A (ja) * 2004-08-23 2006-03-02 Fuji Photo Film Co Ltd 表面導電性材料の製造方法
JP4528634B2 (ja) * 2005-01-13 2010-08-18 富士フイルム株式会社 金属膜の形成方法
JP4606924B2 (ja) * 2005-03-31 2011-01-05 富士フイルム株式会社 グラフトパターン材料、導電性パターン材料およびその製造方法
CN101528458B (zh) * 2006-10-23 2013-10-30 富士胶片株式会社 表面金属膜材料及其制造方法、金属模型材料及其制造方法、聚合物层形成用组合物、含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体

Also Published As

Publication number Publication date
CN101528458B (zh) 2013-10-30
EP2105451A2 (de) 2009-09-30
KR20090073079A (ko) 2009-07-02
US20100003533A1 (en) 2010-01-07
EP2078607A1 (de) 2009-07-15
EP2105451A3 (de) 2009-10-28
EP2078607B1 (de) 2018-09-12
EP2078607A4 (de) 2017-01-18
US8084564B2 (en) 2011-12-27
WO2008050715A1 (fr) 2008-05-02
CN101528458A (zh) 2009-09-09
US20090214876A1 (en) 2009-08-27
KR101459515B1 (ko) 2014-11-07
EP2105451B1 (de) 2012-02-15

Similar Documents

Publication Publication Date Title
ATE545665T1 (de) Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat
UA102514C2 (ru) Производные иминопиридина, промежуточное соединение, способ борьбы с заражением полезных растений грибами или его предупреждение и композиция на основе производной иминопиридина
ATE556111T1 (de) Thermoplastische polymerzusammensetzung
ATE512186T1 (de) Fluorhaltiges acrylat
EP2053095A3 (de) Tintenzusammensetzung und Tintenstrahlaufzeichnungsverfahren damit
WO2011054436A3 (de) Halogenalkyl-substituierte amide als insektizide und akarizide
MX2011006373A (es) Compuestos de carbodiimida ciclica.
EP2233521A4 (de) Kautschukzusammensetzung
EP2540759A3 (de) Wärmehärtende Harzzusammensetzung und gehärtetes Produkt daraus
EA201170132A1 (ru) 5-гетероциклилалкил-3-гидрокси-2-фенилциклопент-2-еноны в качестве гербицидов
DE602008005238D1 (de) Bisphenol Monoester
EP2006308A4 (de) Polvinyl-acetat-harz
EP2518076A4 (de) Pyrenderivat und organisches elektrolumineszenzelement damit
DE602007008662D1 (de) Phosphitzusammensetzung und Herstellungsverfahren dafür
WO2008123238A1 (ja) 樹脂組成物
EP1752479A4 (de) Acrylsternpolymer
GT200700074A (es) Fungicidas
MY147973A (en) New diazeniumdiolate compounds, a process for their preparation and pharmaceutical compositions containing them
ATE517087T1 (de) Cbp-verbindung
WO2010008213A3 (en) Silane based compound, method for preparing the same, and surface treating agent composition for copper foil including the silane based compound
ATE547100T1 (de) Leberfibroseinhibitor
WO2009057452A1 (ja) （メタ）アクリレート化合物
WO2008090717A1 (ja) Ａｄａｍ阻害剤
ATE535909T1 (de) Zusammensetzung zur optischen aufzeichnung und holografisches aufzeichnungsmedium
WO2009078394A1 (ja) ４-ヒドロキシフェニルアルキルアミン誘導体