ATE458597T1 - Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung - Google Patents
Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtungInfo
- Publication number
- ATE458597T1 ATE458597T1 AT03715694T AT03715694T ATE458597T1 AT E458597 T1 ATE458597 T1 AT E458597T1 AT 03715694 T AT03715694 T AT 03715694T AT 03715694 T AT03715694 T AT 03715694T AT E458597 T1 ATE458597 T1 AT E458597T1
- Authority
- AT
- Austria
- Prior art keywords
- sub
- substrate
- fragile material
- material substrate
- fragile
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002098397 | 2002-04-01 | ||
PCT/JP2003/004159 WO2003082542A1 (fr) | 2002-04-01 | 2003-04-01 | Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE458597T1 true ATE458597T1 (de) | 2010-03-15 |
Family
ID=28671950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03715694T ATE458597T1 (de) | 2002-04-01 | 2003-04-01 | Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung |
Country Status (10)
Country | Link |
---|---|
US (1) | US7851241B2 (de) |
EP (1) | EP1491309B1 (de) |
JP (1) | JP4198601B2 (de) |
KR (1) | KR100657201B1 (de) |
CN (1) | CN1330596C (de) |
AT (1) | ATE458597T1 (de) |
AU (1) | AU2003221112A1 (de) |
DE (1) | DE60331423D1 (de) |
TW (1) | TWI290128B (de) |
WO (1) | WO2003082542A1 (de) |
Families Citing this family (55)
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KR20120043776A (ko) * | 2004-07-16 | 2012-05-04 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 커터휠과 그 제조방법, 수동 스크라이브 공구 및 스크라이브 장치 |
JPWO2006067997A1 (ja) * | 2004-12-22 | 2008-06-12 | コニカミノルタホールディングス株式会社 | ホログラム素子内蔵レンズ製造方法 |
JP4890034B2 (ja) * | 2006-01-19 | 2012-03-07 | 富士吉田ティアック株式会社 | 光学部品の製造方法 |
CN102672741B (zh) * | 2008-01-15 | 2015-06-03 | 三星钻石工业股份有限公司 | 切刀 |
WO2009107794A1 (ja) * | 2008-02-29 | 2009-09-03 | 三星ダイヤモンド工業株式会社 | 平面表示パネル用マザー基板の分離装置及び分離方法 |
CN102026926B (zh) * | 2008-04-14 | 2013-06-05 | 三星钻石工业股份有限公司 | 脆性材料基板的加工方法 |
KR101228959B1 (ko) * | 2008-05-30 | 2013-02-01 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 모따기 방법 |
US20110132954A1 (en) * | 2008-06-05 | 2011-06-09 | Maoko Tomei | Scribing wheel and method for scribing brittle material substrate |
JP2011230288A (ja) * | 2008-07-29 | 2011-11-17 | Mitsuboshi Diamond Industrial Co Ltd | 樹脂フィルムのバリ取り方法及び積層体の切断方法 |
CN101491923B (zh) * | 2008-09-17 | 2013-01-09 | 章志春 | 一种软磁零件分离方法及其装置 |
JP5310278B2 (ja) * | 2009-06-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | ブレイクバー |
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US8910845B2 (en) | 2010-06-07 | 2014-12-16 | Nippon Electric Glass Co., Ltd. | Method for cutting glass sheet |
US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
TWI408112B (zh) * | 2010-08-31 | 2013-09-11 | Liefco Optical Inc | A Modified Glass Cutting Method for Preset Paths |
JP5170196B2 (ja) * | 2010-09-24 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | 樹脂付き脆性材料基板の分割方法 |
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JP6022862B2 (ja) * | 2012-05-08 | 2016-11-09 | 株式会社不二製作所 | 硬質脆性基板の切り出し方法及び切り出し装置 |
US10351460B2 (en) | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
JP6019999B2 (ja) * | 2012-09-26 | 2016-11-02 | 三星ダイヤモンド工業株式会社 | 積層セラミックス基板の分断方法 |
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JP2015034111A (ja) * | 2013-08-09 | 2015-02-19 | 三星ダイヤモンド工業株式会社 | 積層セラミックス基板の分断方法 |
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JP2016043505A (ja) | 2014-08-20 | 2016-04-04 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法及び分断装置 |
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JP2016050162A (ja) * | 2014-09-02 | 2016-04-11 | 旭硝子株式会社 | ガラス基板の製造方法 |
CN105826180A (zh) * | 2015-01-08 | 2016-08-03 | 三星钻石工业股份有限公司 | 影像传感器用晶圆积层体的分断方法及分断装置 |
JP2016184650A (ja) * | 2015-03-26 | 2016-10-20 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6578759B2 (ja) * | 2015-06-29 | 2019-09-25 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6613677B2 (ja) * | 2015-07-17 | 2019-12-04 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法及び分断装置 |
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CN108218215A (zh) * | 2016-12-14 | 2018-06-29 | 塔工程有限公司 | 基板切割装置 |
US10710923B2 (en) * | 2017-10-26 | 2020-07-14 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Wheel cutter for cutting a flexible glass substrate and cutting method thereof |
CN111279459A (zh) | 2017-10-27 | 2020-06-12 | 三星钻石工业股份有限公司 | 附金属膜的衬底的分断方法 |
KR20190059575A (ko) * | 2017-11-23 | 2019-05-31 | 주식회사 탑 엔지니어링 | 기판 절단 장치 |
KR101991267B1 (ko) * | 2017-11-23 | 2019-06-20 | 주식회사 탑 엔지니어링 | 기판 절단 장치 |
JP2019135205A (ja) * | 2018-02-05 | 2019-08-15 | 日本電気硝子株式会社 | 蛍光体ガラス薄板及びその個片の製造方法並びに蛍光体ガラス薄板及びその個片 |
CN108972925B (zh) * | 2018-08-28 | 2020-10-23 | 扬州宏祥光电科技有限公司 | 一种太阳能级硅片切割方法 |
TWI820177B (zh) * | 2018-09-26 | 2023-11-01 | 日商三星鑽石工業股份有限公司 | 附有金屬膜之基板的分割方法 |
JP7211003B2 (ja) * | 2018-10-29 | 2023-01-24 | 日本電気硝子株式会社 | ガラス板の製造方法 |
TWI805823B (zh) | 2018-10-31 | 2023-06-21 | 日商三星鑽石工業股份有限公司 | 基板供給系統及基板加工裝置 |
JP7127566B2 (ja) * | 2019-02-07 | 2022-08-30 | 株式会社Jvcケンウッド | 液晶デバイスの製造方法 |
JP2020116958A (ja) * | 2020-04-22 | 2020-08-06 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
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-
2003
- 2003-04-01 DE DE60331423T patent/DE60331423D1/de not_active Expired - Lifetime
- 2003-04-01 CN CNB038077027A patent/CN1330596C/zh not_active Expired - Fee Related
- 2003-04-01 TW TW92107459A patent/TWI290128B/zh not_active IP Right Cessation
- 2003-04-01 KR KR1020047013987A patent/KR100657201B1/ko not_active IP Right Cessation
- 2003-04-01 EP EP20030715694 patent/EP1491309B1/de not_active Expired - Lifetime
- 2003-04-01 WO PCT/JP2003/004159 patent/WO2003082542A1/ja active Application Filing
- 2003-04-01 US US10/509,895 patent/US7851241B2/en not_active Expired - Fee Related
- 2003-04-01 AU AU2003221112A patent/AU2003221112A1/en not_active Abandoned
- 2003-04-01 JP JP2003580048A patent/JP4198601B2/ja not_active Expired - Fee Related
- 2003-04-01 AT AT03715694T patent/ATE458597T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2003082542B1 (fr) | 2004-02-19 |
CN1330596C (zh) | 2007-08-08 |
TW200305547A (en) | 2003-11-01 |
WO2003082542A1 (fr) | 2003-10-09 |
US7851241B2 (en) | 2010-12-14 |
EP1491309A1 (de) | 2004-12-29 |
JPWO2003082542A1 (ja) | 2005-08-04 |
EP1491309A4 (de) | 2008-01-23 |
JP4198601B2 (ja) | 2008-12-17 |
DE60331423D1 (de) | 2010-04-08 |
AU2003221112A1 (en) | 2003-10-13 |
EP1491309B1 (de) | 2010-02-24 |
KR100657201B1 (ko) | 2006-12-13 |
US20050245051A1 (en) | 2005-11-03 |
KR20040091697A (ko) | 2004-10-28 |
CN1646282A (zh) | 2005-07-27 |
TWI290128B (en) | 2007-11-21 |
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