ATE458597T1 - Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung - Google Patents

Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung

Info

Publication number
ATE458597T1
ATE458597T1 AT03715694T AT03715694T ATE458597T1 AT E458597 T1 ATE458597 T1 AT E458597T1 AT 03715694 T AT03715694 T AT 03715694T AT 03715694 T AT03715694 T AT 03715694T AT E458597 T1 ATE458597 T1 AT E458597T1
Authority
AT
Austria
Prior art keywords
sub
substrate
fragile material
material substrate
fragile
Prior art date
Application number
AT03715694T
Other languages
English (en)
Inventor
Kazuya Maekawa
Hiroshi Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Application granted granted Critical
Publication of ATE458597T1 publication Critical patent/ATE458597T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing And Processing Devices For Dough (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Dicing (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Laminated Bodies (AREA)
AT03715694T 2002-04-01 2003-04-01 Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung ATE458597T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002098397 2002-04-01
PCT/JP2003/004159 WO2003082542A1 (fr) 2002-04-01 2003-04-01 Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede

Publications (1)

Publication Number Publication Date
ATE458597T1 true ATE458597T1 (de) 2010-03-15

Family

ID=28671950

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03715694T ATE458597T1 (de) 2002-04-01 2003-04-01 Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung

Country Status (10)

Country Link
US (1) US7851241B2 (de)
EP (1) EP1491309B1 (de)
JP (1) JP4198601B2 (de)
KR (1) KR100657201B1 (de)
CN (1) CN1330596C (de)
AT (1) ATE458597T1 (de)
AU (1) AU2003221112A1 (de)
DE (1) DE60331423D1 (de)
TW (1) TWI290128B (de)
WO (1) WO2003082542A1 (de)

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JP5078354B2 (ja) * 2004-07-16 2012-11-21 三星ダイヤモンド工業株式会社 カッターホイールの製造方法
US8006363B2 (en) * 2004-12-22 2011-08-30 Konica Minolta Holdings Inc. Manufacturing method of lens with built-in hologram element
JP4890034B2 (ja) * 2006-01-19 2012-03-07 富士吉田ティアック株式会社 光学部品の製造方法
CN102672741B (zh) * 2008-01-15 2015-06-03 三星钻石工业股份有限公司 切刀
JP5178814B2 (ja) * 2008-02-29 2013-04-10 三星ダイヤモンド工業株式会社 平面表示パネル用マザー基板の分離装置及び分離方法
JP5325209B2 (ja) * 2008-04-14 2013-10-23 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
EP2286972A1 (de) * 2008-05-30 2011-02-23 Mitsuboshi Diamond Industrial Co., Ltd. Abschrägverfahren für substrat aus brüchigem material
WO2009148073A1 (ja) * 2008-06-05 2009-12-10 三星ダイヤモンド工業株式会社 スクライビングホイール及び脆性材料基板のスクライブ方法
JP2011230288A (ja) * 2008-07-29 2011-11-17 Mitsuboshi Diamond Industrial Co Ltd 樹脂フィルムのバリ取り方法及び積層体の切断方法
CN101491923B (zh) * 2008-09-17 2013-01-09 章志春 一种软磁零件分离方法及其装置
JP5310278B2 (ja) * 2009-06-05 2013-10-09 三星ダイヤモンド工業株式会社 ブレイクバー
JP5330907B2 (ja) * 2009-06-25 2013-10-30 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5334205B2 (ja) * 2010-02-17 2013-11-06 株式会社ジャパンディスプレイ 電気的固体装置の製造方法
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JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5780155B2 (ja) * 2010-06-07 2015-09-16 日本電気硝子株式会社 ガラス板の切断方法
US8864005B2 (en) 2010-07-16 2014-10-21 Corning Incorporated Methods for scribing and separating strengthened glass substrates
TWI408112B (zh) * 2010-08-31 2013-09-11 Liefco Optical Inc A Modified Glass Cutting Method for Preset Paths
JP5170196B2 (ja) * 2010-09-24 2013-03-27 三星ダイヤモンド工業株式会社 樹脂付き脆性材料基板の分割方法
JP5309107B2 (ja) * 2010-10-05 2013-10-09 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
TWI551560B (zh) * 2010-11-30 2016-10-01 康寧公司 玻璃帶、接合玻璃帶之方法、以及製備用於接合之已塗佈玻璃帶之方法
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置
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JP6019999B2 (ja) * 2012-09-26 2016-11-02 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
TWI591040B (zh) 2012-10-22 2017-07-11 康寧公司 玻璃纖維網和拼接的方法
JP6043150B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法
KR101447578B1 (ko) * 2012-12-27 2014-10-06 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 분단용 분진 제거장치
KR101447577B1 (ko) * 2012-12-27 2014-10-08 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 스크라이브용 분진 제거장치
JP2015034111A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP6185813B2 (ja) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 イメージセンサ用ウエハ積層体の分断方法並びに分断装置
JP6213134B2 (ja) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
TWI617516B (zh) * 2014-04-23 2018-03-11 三星國際機械股份有限公司 用於一脆性基板之切割方法及切割設備
JP6256178B2 (ja) * 2014-04-28 2018-01-10 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP6331656B2 (ja) * 2014-04-28 2018-05-30 三星ダイヤモンド工業株式会社 脆性材料基板の搬送方法及び搬送装置
CN105278136B (zh) * 2014-06-25 2019-07-16 三星钻石工业股份有限公司 贴合基板的分断方法
JP2016043505A (ja) 2014-08-20 2016-04-04 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
JP6413496B2 (ja) * 2014-08-29 2018-10-31 三星ダイヤモンド工業株式会社 液晶表示パネルの製造方法
JP2016050162A (ja) * 2014-09-02 2016-04-11 旭硝子株式会社 ガラス基板の製造方法
CN105826180A (zh) * 2015-01-08 2016-08-03 三星钻石工业股份有限公司 影像传感器用晶圆积层体的分断方法及分断装置
JP2016184650A (ja) 2015-03-26 2016-10-20 三星ダイヤモンド工業株式会社 ブレイク装置
JP6578759B2 (ja) * 2015-06-29 2019-09-25 三星ダイヤモンド工業株式会社 ブレイク装置
JP6613677B2 (ja) * 2015-07-17 2019-12-04 三星ダイヤモンド工業株式会社 脆性基板の分断方法及び分断装置
JP6544179B2 (ja) * 2015-09-25 2019-07-17 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN108218215A (zh) * 2016-12-14 2018-06-29 塔工程有限公司 基板切割装置
US10710923B2 (en) * 2017-10-26 2020-07-14 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Wheel cutter for cutting a flexible glass substrate and cutting method thereof
CN120895469A (zh) * 2017-10-27 2025-11-04 三星钻石工业股份有限公司 附金属膜的衬底的分断方法
KR101991267B1 (ko) * 2017-11-23 2019-06-20 주식회사 탑 엔지니어링 기판 절단 장치
KR20190059575A (ko) * 2017-11-23 2019-05-31 주식회사 탑 엔지니어링 기판 절단 장치
JP7561481B2 (ja) 2018-02-05 2024-10-04 日本電気硝子株式会社 蛍光体ガラス薄板の個片の製造方法
CN108972925B (zh) * 2018-08-28 2020-10-23 扬州宏祥光电科技有限公司 一种太阳能级硅片切割方法
TWI820177B (zh) * 2018-09-26 2023-11-01 日商三星鑽石工業股份有限公司 附有金屬膜之基板的分割方法
JP7211003B2 (ja) * 2018-10-29 2023-01-24 日本電気硝子株式会社 ガラス板の製造方法
TWI805823B (zh) * 2018-10-31 2023-06-21 日商三星鑽石工業股份有限公司 基板供給系統及基板加工裝置
JP7127566B2 (ja) * 2019-02-07 2022-08-30 株式会社Ｊｖｃケンウッド 液晶デバイスの製造方法
KR102747998B1 (ko) * 2020-02-27 2024-12-30 삼성디스플레이 주식회사 표시 장치용 보호 부재, 이를 포함하는 표시 장치 및 표시 장치용 보호 부재의 제조 방법
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Also Published As

Publication number Publication date
TW200305547A (en) 2003-11-01
CN1330596C (zh) 2007-08-08
KR20040091697A (ko) 2004-10-28
AU2003221112A1 (en) 2003-10-13
TWI290128B (en) 2007-11-21
KR100657201B1 (ko) 2006-12-13
EP1491309A4 (de) 2008-01-23
EP1491309B1 (de) 2010-02-24
JP4198601B2 (ja) 2008-12-17
CN1646282A (zh) 2005-07-27
WO2003082542A1 (fr) 2003-10-09
US7851241B2 (en) 2010-12-14
US20050245051A1 (en) 2005-11-03
WO2003082542B1 (fr) 2004-02-19
DE60331423D1 (de) 2010-04-08
EP1491309A1 (de) 2004-12-29
JPWO2003082542A1 (ja) 2005-08-04

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