JP6019999B2 - 積層セラミックス基板の分断方法 - Google Patents
積層セラミックス基板の分断方法 Download PDFInfo
- Publication number
- JP6019999B2 JP6019999B2 JP2012212192A JP2012212192A JP6019999B2 JP 6019999 B2 JP6019999 B2 JP 6019999B2 JP 2012212192 A JP2012212192 A JP 2012212192A JP 2012212192 A JP2012212192 A JP 2012212192A JP 6019999 B2 JP6019999 B2 JP 6019999B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- laminated
- metal film
- substrate
- scribe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Description
11 セラミックス基板
12 金属膜
13,14 スクライビングホイール
15,16 支持部材
17,19 テープ
18 ブレイクバー
Claims (1)
- セラミックス基板に金属膜を積層した積層セラミックス基板の分断方法であって、
前記セラミックス基板及び前記金属膜の一方の面にスクライビングホイールを用いて他方の基板に到達しない第1のスクライブラインを形成し、
前記セラミックス基板及び前記金属膜の他方の面にスクライビングホイールを用いて前記第1のスクライブラインに沿って他方の基板に到達しない第2のスクライブラインを形成し、
前記第1,第2のスクライブラインに沿って前記セラミックス基板及び金属膜の少なくとも一方をブレイクすることによってスクライブラインに沿ってセラミックス基板を分断する積層セラミックス基板の分断方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012212192A JP6019999B2 (ja) | 2012-09-26 | 2012-09-26 | 積層セラミックス基板の分断方法 |
TW102112657A TWI574806B (zh) | 2012-09-26 | 2013-04-10 | Disassembly method of laminated ceramic substrate |
CN201310241360.6A CN103681294B (zh) | 2012-09-26 | 2013-06-13 | 积层陶瓷基板的分断方法 |
KR1020130089236A KR101779053B1 (ko) | 2012-09-26 | 2013-07-29 | 적층 세라믹 기판의 분단 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012212192A JP6019999B2 (ja) | 2012-09-26 | 2012-09-26 | 積層セラミックス基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014065633A JP2014065633A (ja) | 2014-04-17 |
JP6019999B2 true JP6019999B2 (ja) | 2016-11-02 |
Family
ID=50318493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012212192A Active JP6019999B2 (ja) | 2012-09-26 | 2012-09-26 | 積層セラミックス基板の分断方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6019999B2 (ja) |
KR (1) | KR101779053B1 (ja) |
CN (1) | CN103681294B (ja) |
TW (1) | TWI574806B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6515925B2 (ja) * | 2014-05-14 | 2019-05-22 | Agc株式会社 | 複合体、積層体および電子デバイス、ならびに、それらの製造方法 |
JP6481465B2 (ja) * | 2014-08-21 | 2019-03-13 | 三星ダイヤモンド工業株式会社 | 複合基板のブレイク方法 |
JP6547556B2 (ja) * | 2015-09-29 | 2019-07-24 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
US20200361120A1 (en) * | 2017-10-27 | 2020-11-19 | Mitsuboshi Diamond Industrial Co., Ltd. | Method of segmenting substrate with metal film |
CN111279459A (zh) * | 2017-10-27 | 2020-06-12 | 三星钻石工业股份有限公司 | 附金属膜的衬底的分断方法 |
TWI820177B (zh) * | 2018-09-26 | 2023-11-01 | 日商三星鑽石工業股份有限公司 | 附有金屬膜之基板的分割方法 |
JP2023179261A (ja) * | 2022-06-07 | 2023-12-19 | 株式会社デンソー | 半導体装置の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231427A (ja) * | 1983-12-21 | 1985-11-18 | Nippon Sheet Glass Co Ltd | 板ガラスの切断法 |
JPS6369728A (ja) * | 1986-09-12 | 1988-03-29 | Tomonori Murase | 合わせガラス板の切断方法 |
JPS6418605A (en) * | 1987-07-15 | 1989-01-23 | Matsushita Electric Works Ltd | Dividing method for ceramic wiring base |
JP3461449B2 (ja) * | 1998-10-13 | 2003-10-27 | シャープ株式会社 | 半導体素子の製造方法 |
CN101042487A (zh) * | 2001-11-08 | 2007-09-26 | 夏普株式会社 | 液晶板 |
DE60331423D1 (de) * | 2002-04-01 | 2010-04-08 | Mitsuboshi Diamond Ind Co Ltd | Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung |
KR20120043776A (ko) * | 2004-07-16 | 2012-05-04 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 커터휠과 그 제조방법, 수동 스크라이브 공구 및 스크라이브 장치 |
JP4918064B2 (ja) * | 2008-05-23 | 2012-04-18 | 三星ダイヤモンド工業株式会社 | 積層体の切断方法 |
JP2009166169A (ja) * | 2008-01-15 | 2009-07-30 | Mitsuboshi Diamond Industrial Co Ltd | カッター装置 |
CN102672741B (zh) * | 2008-01-15 | 2015-06-03 | 三星钻石工业股份有限公司 | 切刀 |
JP2009252971A (ja) * | 2008-04-04 | 2009-10-29 | Dowa Metaltech Kk | 金属セラミックス接合基板及びその製造方法及び金属セラミックス接合体 |
JP2012009767A (ja) * | 2009-11-27 | 2012-01-12 | Kyocera Corp | 多数個取り配線基板およびその製造方法、ならびに配線基板およびその製造方法 |
-
2012
- 2012-09-26 JP JP2012212192A patent/JP6019999B2/ja active Active
-
2013
- 2013-04-10 TW TW102112657A patent/TWI574806B/zh active
- 2013-06-13 CN CN201310241360.6A patent/CN103681294B/zh active Active
- 2013-07-29 KR KR1020130089236A patent/KR101779053B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN103681294A (zh) | 2014-03-26 |
KR101779053B1 (ko) | 2017-09-18 |
TWI574806B (zh) | 2017-03-21 |
KR20140040623A (ko) | 2014-04-03 |
TW201412481A (zh) | 2014-04-01 |
CN103681294B (zh) | 2017-05-24 |
JP2014065633A (ja) | 2014-04-17 |
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